GB2051130A - Cylinder for Rotary Screen Printing having High Aperture Ratio and Process for Preparation Thereof Electroforming Perforate Cylindrical Bodies - Google Patents
Cylinder for Rotary Screen Printing having High Aperture Ratio and Process for Preparation Thereof Electroforming Perforate Cylindrical Bodies Download PDFInfo
- Publication number
- GB2051130A GB2051130A GB7932317A GB7932317A GB2051130A GB 2051130 A GB2051130 A GB 2051130A GB 7932317 A GB7932317 A GB 7932317A GB 7932317 A GB7932317 A GB 7932317A GB 2051130 A GB2051130 A GB 2051130A
- Authority
- GB
- United Kingdom
- Prior art keywords
- cylinder
- plating
- mesh
- thickness
- rotary screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010022 rotary screen printing Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims description 17
- 238000002360 preparation method Methods 0.000 title claims description 7
- 238000005323 electroforming Methods 0.000 title 1
- 238000007747 plating Methods 0.000 claims abstract description 72
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 238000009713 electroplating Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010021 flat screen printing Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/08—Perforated or foraminous objects, e.g. sieves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/247—Meshes, gauzes, woven or similar screen materials; Preparation thereof, e.g. by plasma treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Printing Plates And Materials Therefor (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
A cylinder for rotary screen printing comprises a seamless mesh cylindrical body of a metal formed by electric plating, each of meshes of the seamless cylinder comprising a primary metal plating mesh substrate formed on the surface of a mother roll and subsequently removed therefrom prior to application of a secondary plating layer applied in a uniform thickness to the periphery of said mesh substrate. The preferred form of the mesh is a semicylindrical section in which the inner face side is flat and the outer face side is curved. The primary and secondary metal plating layers are preferably nickel the former having a thickness in the range 20-50 mu m and the overall thickness of the product being in the range of 60-150 mu m. <IMAGE>
Description
SPECIFICATION
Cylinder for Rotary Screen Printing Having
High Aperture Ratio and Process for
Preparation Thereof
Background of the Invention (1) Field of the Invention
The present invention relates to a cylinder for rotary screen printing and a process for the preparation thereof. More particularly, the invention relates to a rotary screen cylinder which has a much higher aperture ratio than conventional rotary screen cylinders and hence can reproduce sharp and fine print patterns and a process for the preparation of this rotary screen cylinder.
(2) Description of the Prior Art
As a cylinder for rotary screen printing (hereinafter referred to as "cylinder"), there has heretofore been used broadly a cylinder formed by electrolytically plating an embossed surface of a mother roll, that is, an electrically conductive mesh surface, with nickel and removing a mesh cylinder formed as a plating layer from the mother roll.
This cylinder prepared by utilizing the plating technique, however, has an extremely lower aperture ratio than the flat screen or the like, and therefore, a print pattern formed by rotary screen printing using such cylinder lacks sharpness as compared with a print pattern formed by flat screen printing and this printing method is defective in that fine and delicate patterns can hardly be reproduced in good conditions.
In the above-mentioned process for forming the conventional cylinder, the metal plating layer grows equivalently in all the directions from the electrically conductive surface of the mother roll.
Accordingly, when a plating layer having a thickness predetermined from the required strength and rigidity, the plating layer grows also in the circumferential direction of the cylinder in a thickness two times this predetermined thickness, with the result that the aperture ratio is remarkably reduced.
Summary of the Invention
I found that when the first plating step of forming a mesh substrate having a self-retaining property on the surface of a mother roll by electric plating is combined with the second plating step of forming a plating layer having a uniform thickness around the mesh substrate by subjecting the mesh substrate removed from the mother roll to electric plating, there can be obtained a cylinder having a remarkably high aperture ratio while having strength and rigidity sufficient to resist the rotary screen printing operation.
It is therefore a primary object of the present invention to provide a cylinder for rotary screen printing having a remarkably increased aperture ratio while having sufficient strength and rigidity required for rotary screen printing, and a process for the manufacture of such cylinder.
Another object of the present invention is to provide a cylinder which can form print patterns excellent in the pattern sharpness with good reproducibility of delicate and fine patterns according to rotary screen printing and a process for the manufacture of such cylinder.
In accordance with one fundamental aspect of the present invention, there is provided a cylinder for rotary screen printing which comprises a seamless mesh cylindrical body of a metal formed by electric plating, each of meshes of the seamless cylinder comprising a primary metal plating mesh substrate having a semicylindrical section in which the inner face side is flat and the outer face side is curved and a secondary metal plating layer applied in a uniform thickness to the periphery of said mesh substrate.
In accordance with another fundamental aspect of the present invention, there is provided a process for the preparation of seamless cylinders for rotary screen printing having a high aperture ratio, which comprises electrically plating a mother roll having an electrically conductive mesh surface in a plating solution and removing a plating mesh layer formed on the surface of the mother roll in a cylindrical siape from the mother roll, said process being characterized by the first plating step of forming on the surface of the mother roll a mesh substrate having a thickness smaller than the thickness of the final rotary screen cylinder but sufficient to remove the mesh substrate from the mother roll and the second plating step of subjecting the mesh substrate removed from the mother roll to electric plating to form a secondary metal plating layer having a uniform thickness on the periphery of the mesh substrate.
The present invention will now be described in detail by reference to the accompanying drawings.
Brief Description of the Drawings
Fig. 1 is a sectional view illustrating formation of a plating layer on the surface of a mother roller
Fig. 2 is an enlarged development view of a mesh cylinder.
Fig. 3 is a sectional view illustrating a mesh cylinder according to the present invention.
Detailed Description of the Invention
Referring to Fig. 1 illustrating formation of a plating layer on the surface of a mother roll, the mother roll 1 comprises a mesh metal surface portion 2 corresponding to the mesh pattern of the final cylinder and an electrically nonconductive portion 3 corresponding to apertures of the final cylinder.
The metal surface portion 2 of the mother roll 1 is composed of a hard metallic material such as chromium in order to facilitate peeling of the cylinder to be formed by plating, and the electrically non-conductive portion 3 Is formed by embedding an electrically insulating material, for example, a synthetic resin such as an epoxy resin
or a synthetic rubber in dents 4 formed on the
surface of the metal roll.
This mother roll 1 is dipped in an electrolytic
plating solution and electric plating is carried out
according to known means by using the mother
roll 1 as a cathode. A metal ion in the electrolytic
plating solution, for example, a nickel ion, is
precipitated in the form of the metal on the
electrically conductive surface portion 2 of the
mother roll 1 and a metal plating layer 5 is formed. At this step, the plating layer 5 grows equally in all the directions on the electrically conductive surface 2 of the mother roll 1. More specifically, referring to Fig. 1, a plating layer having a certain thickness grows on the electrically conductive mesh surface 2 of the roll
1 and simultaneously, a plating layer having a radius same as said thickness grows from each edge of the electrically conductive surface.As a result, on the surface of the roll 1, there are formed plating layers 5, each having a semicylindrical section in which the size in the plane direction is much larger than the size in the thickness direction, and there is obtained a cylinder in which the area ratio of apertures 6 to the plating layers 5, that is, the aperture ratio, is extremely low.
This relation will now be described in detail.
In Fig. 1 and Fig. 2 which is an enlarged development view, symbols have the following meaning.
a: the standard width of the electrically conductive mesh surface of the mother roll, ordinarily 50 microns
b: the thickness of the mesh cylinder, which is necessary for ensuring sufficient strength and rigidity of the cylinder
c: the width of the aperture 6
p: the pitch of the meshes or apertures on the mesh cylinder
When plating is conducted on the surface of the mother roll, the width of the mesh portion in the plane direction is two times the thickness b and the width c of the aperture is represented by the following formula: c=p-a-2b (1)
Thus, the aperture ratio is drastically reduced and this reduction of the aperture ratio cannot be avoided according to the conventional technique.
One of important features of the present invention is based on the novel finding that when a metal mesh substrate having a self-retaining property is first formed by a first plating treatment on the abovementioned mother roll and the resulting metal mesh substrate is removed from the mother roll in the cylindrical form and subjected to a second plating treatment, there can be obtained a mesh cylinder having a much higher aperture ratio than the cylinder formed according to the conventional process where all the plating treatment is conducted on the mother roll, if the comparison is made with respect to the same cylinder thickness.
More specifically, in the conventional process including one-stage plating on the mother roll, increase of the mesh size in the plane direction is about 2 times the increase of the mesh size in the thickness direction. On the other hand, in case of the two-stage plating treatment according to the present invention, since a secondary metal plating layer is formed throughout the periphery of the primary metal plating mesh substrate, the increase of the mesh size in the thickness direction is always equal to the increase of the mesh size in the plane direction. Accordingly, it is possible to obtain a mesh cylinder having a much higher aperture ratio than in the conventional technique.
Referring to Fig. 3 illustrating the section of the cylinder for rotary screen printing according to the present invention, each of meshes of this cylinder comprises a primary metal plating mesh substrate 51 formed by the plating treatment on the mother roll, which has been described hereinbefore by reference to Fig. 1, and a secondary metal plating layer 52 applied in.a uniform thickness to the periphery of the substrate 51 by the second plating treatment.
Since the primary metal plating mesh substrate 51 is formed by the above-mentioned plating treatment on the mother roll, the mesh substrate 51 has a semicylindrical section, and supposing that the width of the mesh surface of the mother roll is a and the thickness of the cylinder formed by the primary plating treatment is d as pointed out hereinbefore, the width of the substrate 51 in the plane direction corresponds to (a+2d). On the other hand, the secondary metal plating layer 52 has a thickness e in all the parts.
Accordingly, the width c of the aperture of the mesh cylinder obtained according to the present invention is represented by the following formula: c=p-a-2d-2e (2)
Since the thickness b of the final cylinder is represented by the following formula:
b=d+2e (3) it is seen that according to the present invention, the width of the aperture can be increased by 2e (e is the width of the secondary metal plating layer 52) as compared with the aperture width in the conventional cylinder.
It is preferred that the thickness d of the primary metal plating mesh substrate 51 be as small as possible, so far as the cylinder can be removed from the mother roll and a sufficient selfretaining property (shape retaining property) can be ensured in the substrate 51. From this viewpoint, it is preferred that the thickness d be 20 to 50 , particularly 30 to 40 y. The final thickness b of the cylinder is determined so that sufficient strength and rigidity can be obtained when the cylinder is used for rotary screen printing. It is ordinarily preferred that the thickness b be 60 to 150 u, particularly 70 to 908.
In the present invention, the primary metal plating mesh substrate 51 and the secondary metal plating layer 52 may be composed of the same metal or different metals. Generally, it is preferred that both the substrate 51 and plating layer 52 be composed of a metal excellent in the mechanical strength and various resistances, such as nickel.
The composition of the electrolytic plating solution and the electrolytic plating conditions, which are adopted in the present invention, are those known in the art. Accordingly, they are not particularly described.
In the present invention, it is important that the plating treatment should be carried out in two stages as pointed out hereinbefore. By virtue of this characteristic feature, the aperture ratio can be remarkably increased in the final cylinder for rotary screen printing.
The effect of increasing the aperture ratio according to the present invention will now be described specifically by reference to the following example that by no means limits the scope of the invention.
Example
In case of a cylinder for a 1 00-mesh rotary screen, the arrangement pitch p of apertures is 0.254 mm, and if the thickness b of the cylinder is adjusted to 80 microns, the width c of the aperture in the conventional cylinder is 0.044 mm as seen from the following calculation: c=p-a-2 b
=0.254-0.05-2 x0.08=0.044 On the other hand, in case of the cylinder according to the present invention supposing that the first plating thickness d is 30 microns and the second plating thickness e is 25 microns, the thickness b is 80 microns
(b=d+2e=30+2 x25=80) and the width c of the aperture is 0.094 mm (c=p-a-2d-2e =0.254-0.05-2 x0.03-2x0.025).
When each right hexagonal mesh area at the above arrangement pitch is calculated, it is seen that the area is about 0.05587 mm2, and in the conventional screen, the aperture area is about 0.001677 mm2 and in the screen of the present invention the aperture area is 0.007652 mm2.
Accordingly, the aperture ratio in the conventional screen is 3% as calculated below:
0.001677 x100=.3 0.05587 ~~~~~~~~~~~~~ On the other hand, the aperture ratio in the screen according to the present invention is 13.7% as calculated below:
0.007652 x100' .13.7 0.05587
Thus, it will readily be understood that the aperture ratio can be remarkably increased according to the present invention.
Claims (7)
1. A cylinder for rotary screen printing which comprises a seamless mesh cylindrical body of a metal formed by electric plating, each of meshes of the seamless cylinder comprising a primary metal plating mesh substrate having a semicylindrical section in which the inner face side is flat and the outer face side is curved and a secondary metal plating layer applied in a uniform thickness to the periphery of said mesh substrate.
2. A cylinder as set forth in claim 1 wherein the primary metal plating mesh substrate has a thickness of 20 to 50 microns and each mesh unit of the cylinder has a thickness of 60 to 1 50 microns as a whole.
3. A cylinder as set forth in claim 1 wherein said primary metal plating mesh substrate and secondary metal plating layer are composed of nickel.
4. A process for the preparation of seamless cylinders for rotary screen printing having a high aperture ratio, which comprises electrically plating a mother roll having an electrically conductive mesh surface in a plating solution and removing a plating mesh layer formed on the surface of the mother roll in a cylindrical shape from the mother roll, said process being characterized by the first plating step of forming on the surface of the mother roll a mesh substrate having a thickness smaller than the thickness of the final rotary screen cylinder but sufficient to remove the mesh substrate from the mother roll and the second plating step of subjecting the mesh substrate removed from the mother roll to electric plating to form a secondary metal plating layer having a uniform thickness on the periphery of the mesh substrate.
5. A process for the preparation of seamless cylinders for rotary screen printing substantially as hereinbefore described with reference to the accompanying drawings and/or the Example.
6. A cylinder produced by the process of claim 4 or 5.
7. A cylinder for rotary screen printing substantially as hereinbefore described with reference to and as shown by the accompanying drawings and/or the Example.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7690679A JPS5613195A (en) | 1979-06-20 | 1979-06-20 | Cylinder for rotary screen with large opening area ratio and production thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2051130A true GB2051130A (en) | 1981-01-14 |
| GB2051130B GB2051130B (en) | 1983-03-23 |
Family
ID=13618704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB7932317A Expired GB2051130B (en) | 1979-06-20 | 1979-09-18 | Cylinder for rotary screen printing having high aperture ratio and process for preparation thereof |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS5613195A (en) |
| DE (1) | DE2936693A1 (en) |
| FR (1) | FR2459134A1 (en) |
| GB (1) | GB2051130B (en) |
| IN (1) | IN152903B (en) |
| IT (1) | IT1123265B (en) |
| NL (1) | NL7907257A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0164149A1 (en) * | 1984-05-07 | 1985-12-11 | Stork Screens B.V. | Screen material for printing material and a manufacturing method |
| EP0182195A2 (en) * | 1984-11-14 | 1986-05-28 | Ferd. Rüesch AG. | Process and apparatus for the production of printing screens |
| FR2630753A1 (en) * | 1988-05-02 | 1989-11-03 | Piolat Ind | PERFORATED NICKEL FRAMES AND METHOD OF MANUFACTURING THE SAME |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5917152A (en) * | 1982-07-21 | 1984-01-28 | Yokogawa Hokushin Electric Corp | Ultrasonic probe |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2266381A (en) * | 1938-01-26 | 1941-12-16 | Othmar W Pies | Piezoelectric apparatus |
-
1979
- 1979-06-20 JP JP7690679A patent/JPS5613195A/en active Granted
- 1979-09-04 IN IN919/CAL/79A patent/IN152903B/en unknown
- 1979-09-11 DE DE19792936693 patent/DE2936693A1/en not_active Withdrawn
- 1979-09-18 GB GB7932317A patent/GB2051130B/en not_active Expired
- 1979-09-20 IT IT25897/79A patent/IT1123265B/en active
- 1979-09-28 NL NL7907257A patent/NL7907257A/en not_active Application Discontinuation
- 1979-09-28 FR FR7924230A patent/FR2459134A1/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0164149A1 (en) * | 1984-05-07 | 1985-12-11 | Stork Screens B.V. | Screen material for printing material and a manufacturing method |
| AU577851B2 (en) * | 1984-05-07 | 1988-10-06 | Stork Screens B.V. | Fine mesh screen for screen printing |
| EP0182195A2 (en) * | 1984-11-14 | 1986-05-28 | Ferd. Rüesch AG. | Process and apparatus for the production of printing screens |
| EP0182195A3 (en) * | 1984-11-14 | 1987-12-23 | Ferd. Rüesch AG. | Process and apparatus for the production of printing screens |
| FR2630753A1 (en) * | 1988-05-02 | 1989-11-03 | Piolat Ind | PERFORATED NICKEL FRAMES AND METHOD OF MANUFACTURING THE SAME |
| EP0341167A1 (en) * | 1988-05-02 | 1989-11-08 | Piolat Industrie | Process for manufacturing a perforated nickel frame by electroforming |
| US4913783A (en) * | 1988-05-02 | 1990-04-03 | Piolat Industrie | Process for the manufacture of a perforated nickel frame by electroforming |
Also Published As
| Publication number | Publication date |
|---|---|
| IT7925897A0 (en) | 1979-09-20 |
| DE2936693A1 (en) | 1981-01-29 |
| JPS5723599B2 (en) | 1982-05-19 |
| NL7907257A (en) | 1980-12-23 |
| IT1123265B (en) | 1986-04-30 |
| FR2459134A1 (en) | 1981-01-09 |
| GB2051130B (en) | 1983-03-23 |
| JPS5613195A (en) | 1981-02-09 |
| IN152903B (en) | 1984-04-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |