GB2047476A - Improvement in or relating to applying circuit elements to a substrate - Google Patents

Improvement in or relating to applying circuit elements to a substrate Download PDF

Info

Publication number
GB2047476A
GB2047476A GB8006068A GB8006068A GB2047476A GB 2047476 A GB2047476 A GB 2047476A GB 8006068 A GB8006068 A GB 8006068A GB 8006068 A GB8006068 A GB 8006068A GB 2047476 A GB2047476 A GB 2047476A
Authority
GB
United Kingdom
Prior art keywords
substrate
circuit element
circuit
carrier substrate
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8006068A
Other versions
GB2047476B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UK Secretary of State for Defence
Original Assignee
UK Secretary of State for Defence
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UK Secretary of State for Defence filed Critical UK Secretary of State for Defence
Priority to GB8006068A priority Critical patent/GB2047476B/en
Publication of GB2047476A publication Critical patent/GB2047476A/en
Application granted granted Critical
Publication of GB2047476B publication Critical patent/GB2047476B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

In a method of applying micro- electronic circuit elements, such as a high definition thin-film microwave filter 5 to a lower definition thick film or printed circuit board substrate 2, the filter is formed on the surface of a transparent, flexible carrier substrate 6 using thin film deposition techniques, and the circuit element is then adhesive bonded face down on the surface of the permanent substrate 2. The thin film circuit element 5 is formed with contact areas which overlap cooperating portions of the thick film circuit 4 e.g. a stripline, on insertion of the circuit element to provide electrical connections. The carrier substrate may then be removed, eg by dissolving, and the overlapping contact areas may be permanently bonded together. <IMAGE>

Description

SPECIFICATION Improvements in or relating to methods of applying circuit elements to a substrate This invention relates to methods of applying circuit elements to a substrate.
The invention is particularly, though not exclusively concerned with microwave microelectronic circuits or microwave integrated circuits (MICs) of the kind in which a number of active and/or passive circuit elements and their interconnecting patterns are formed on a single substrate, usually of a material having a relatively high dielectric constant, such as high alumina ceramics material whose dielectric constant is about 10. Other typical substrates include sapphire, beryllia and ferrite.
MlCs of this kind are generally fabricated by either thin film technology or thick film technology. Thin film technology generally involves the deposition in a vacuum, of thin films of conductive, resistive or insulating materials by sputtering, evaporation or chemical vapour deposition. Thick film technology on the other hand involves the deposition of pastes, or "inks", usually by a silk screen process followed by firing at high temperature. Where different types of pastes are used, eg to give resistors, conductors or insulating layers, more than one cycle of screen printing and firing is usually required. Further definition of the screen-printed pattern can be effected by etching back after firing.
Thick film technology has the advantage of being relatively inexpensive, particularly in quantity production, but the screen printing process used for printing the thick film patterns has inherent limitations on the precision with which patterns can be defined. Conductor line widths can only be produced to an accuracy of approximately 20 jum at best, and the line edges may be somewhat irregular unless etching or laser trimming is used.
Minimum line widths and line spacing are generally both limited to approximately 40 jum.
Thus, distributed circuit elements that require precise complex geometries and high definition, such as filters and couplers cannot be obtained using thick film techniques. As a result where such elements are required, the MIC has generally had to be fabricated using the more expensive, labour-intensive thin film technology, as this technique enables the desired definition to be achieved.
According to the present invention, a method of applying a circuit element to a substrate comprises forming the circuit element on the face of a carrier substrate, placing the carrier substrate face down onto the surface of a second substrate and attaching the circuit element to the second substrate.
Preferably the circuit element is formed by thin film fabrication techniques, and may comprise a metallisation pattern defining a distributed microwave circuit element such as a filter.
The second or main substrate may comprise a a thick film substrate, a thin film substrate or a printed circuit board. Thus, it will be seen, the invention enables individual high definition circuit elements formed by thin film circuit techniques to be inserted in a partially completed circuit otherwise fabricated using lower definition techniques, such as thick film, lower definition thin film, or printed circuit board techniques.
The circuit element may be attached to the second or main substrate using an adhesive, excess adhesive preferably being exuded before setting by applying pressure between the two substrates.
Preferably the carrier substrate is removed after attachment of the circuit element to the second substrate, for example, by dissolving, etching or peeling, following which an required electrical connections between the circuit element and other circuitry carried on the second substrate may be made.
In this regard the circuit element may be attached in a position adjacent an existing conductor pattern on the second substrate, and electrical connection made therebetween by tape or wire bonding, or soldering. Alternatively, the circuit element may be formed with one or more contact areas which, when located on the second substrate, overlap contact areas provided in the second substrate. Following removal of the carrier substrate, the overlapping contact areas may be electrically connected eg by ultrasonic bonding or conductive adhesive.
To facilitate location of the circuit element on the second substrate, the carrier substrate is preferably transparent, and may also be flexible to facilitate removal of excess adhesive, where adhesive is used to attach the circuit element to the second substrate. In some applications the second substrate itself may be transparent In a preferred embodiment, the carrier substrate is a biaxially orientated polystyrene material, being transparent and readily available in flexible sheet form. A cyanoacrylate adhesive may then be used as the attachment adhesive and the carrier substrate subsequently removed using a suitable hydrocarbon solvent.
The invention also extends to circuit substrates incorporating one or more circuit elements applied thereto by a method as aforesaid.
The invention will now be described, by way of example only, with reference to the accompanying drawings, of which: Figures (la) to 1(c) show diagrammatic sectional views of various stages in a method in accordance with the present invention of transferring a pre-formed thin film circuit ele ment on to a thick film circuit substrate; and Figure 2 shows a diagrammatic plan view of the thin film circuit element located on the thick film circuit substrate.
Referring to the drawings, Fig. 1 shows part of a thick film microwave integrated circuit (MIC) 1 comprising a substrate 2 of high dielectric constant material, such as alu mina, formed in known manner with a ground plane conductor 3 on one surface and on its other surface with a thick film microwave circuit pattern including a strip transmission line (microstrip line) 4. The microstrip line 4 is formed with a gap dfor receiving a pre formed high definition distributed microwave circuit element 5.
The circuit element 5, in this example a parallel gap filter (see Fig. 2) is formed using standard thin film techniques, on a carrier substrate 6 (Fig. 1(a)) comprising a 250#m thick flexible sheet of clear biaxially orientated polystyrene material, such as that sold under the Registered Trade Mark "POLYFLEX". A number of identical such metallised circuit elements may be deposited on a common piece of carrier substrate using step and re peat processes, and the carrier substrate then cut up into individual "chip" form.
The circuit element 5 is then attached to the thick film substrate 2 by placing the carrier substrate 6 onto the thick film circuit substrate 2 in a suitably aligned position across the gap din the transmission line 4, such that contact areas 8 (Fig. 2) of the circuit element 5 overlap the ends of the transmis sion line 4, a layer 9 of a suitable adhesive being applied between the substrate 2 and the parts of the circuit element 5 which do not overlap the transmission line 4. (Fig.
1(b)). The alignment -of the circuit element 5 is facilitated by the transparency of the carrier substrate material. Excess adhesive between the contact element 5 and the substrate 2 is exuded by squeezing the flexible carrier sub strate 6 against the thick film substrate 2 using, for example, a resilient roller whose width is slightly smaller than the width of the gap d. The adhesive is then set and the carrier substrate 6 removed by dissolving it in a suitable solvent which does not attack the adhesive. (Fig. 1 (c)). Suitable trichloroethy lene may be used as the solvent, with a cyano-acrylate adhesive which appears to combine good microwave properties with a resistance to attack by the solvent.
With the carrier substrate removed, the unattached contact areas 8 of the circuit ele ment 5 which now loosely overlap the ends of the transmission line 4, may then be permamently connected to the transmission line using any suitable electrical bonding technique such as ultrasonic bonding. However, this is not essential. In the example of Fig. 2 which shows a dc blocking filter, no electrical bonding is necessary as the overlap areas provide sufficient, probably capacitive, coupling to the filter at operating frequencies.
In an alternative method the entire circuit element 5 may be attached to the thick film substrate 2 without any overlap with the transmission line, and with contact areas positioned adjacent the ends of the transmission line 4 so that they can be electrically connected by conventional wire or tape bonding techniques.
Because the carrier substrate is removed, standard microstrip design data can be used for design purposes because there is minimal disturbance of the microstrip environment.
The invention thus enables precision circuit elements having the high definition achievable with thin film fabrication techniques to be incorporated in circuits made by methods which do not achieve the same precision, such as thick film circuits, low definition thin film circuits and copper laminate type printed circuit boards such as Polyguide (Registered Trade Mark) for microwave applications. Such precision circuit elements may be produced on individual carrier substrates, ie in "chip" form, and used in similar manner to known chip devices. Thus different complex circuit functions can be made available for incorporation on a common circuit substrate design to obtain different operating characteristics.
In some applications the carrier substrate need not be removed. On such application of the invention in which it may even be desirable to retain the carrier substrate is in stub tuning of MICs. A present only destructive one way" trimming of fixed position stubs is possible. However, by forming a suitably dimensioned open circuit stub line on a carrier substrate, eg a sheet of biaxially oriented polystyrene as before, this substrate can then be positioned face down onto the appropriate part of a transmission line and adjusted in position to obtain the desired characteristic.
Metal-to-metal contact between the transmission line and the stub formed on the carrier substrate is normally satisfactory for test purposes during adjustment, which can be effected to vary the length of the stub and its position along the transmission line. Once the correct positional and lengthwise adjustments have been obtained, adhesive is applied to the non overlapping region of the stub line and the stub line attached to the transmission line substrate in the desired position. Permanent electrical connection between the overlapping regions of the stub line and transmission line may then be effected using a conductive adhesive.
Thus problems of de-tuning as a result of removal of the carrier substrate are avoided.
To facilitate handling of the carrier substrate during adjustment, it may be temporarily attached to a low dielectric constant "probe", for example of foam polystyrene, which is removed after attachment of the stub to the transmission line circuit.
Although in the described embodiment the carrier substrate is of transparent flexible sheet material, removed by dissolving in a suitable solvent, the invention is not limited to carrier substrates of this type. Although the use of a transparent carrier substrate is advantageous for alignment purposes, it is not essential and non-transparent substrates may be used. Similarly, the use of a flexible carrier substrate is useful, particularly where areas of the circuit element formed thereon are required to overlap metallised areas on the receiving substrate, the use of flexible carrier substrates is not essential.
Furthermore, it is envisaged that other methods of removing the carrier substrate may be used. For example, the carrier substrate may be removed by etching or it may simply be peeled off depending on the form of carrier substrate and the materials used.
Similarly other forms of adhesive may be used to attach the circuit element to the second substrate.
While the invention is primarily applicable to microwave integrated circuits, for the purpose of enabling individual high definition distributed microwave components such as filters and couplers to be incorporated in less costly, lower definition circuits, it may also be applied, where appropriate to other forms of hybrid microelectronic circuitry. For example, a thin-film resistor may be appropriately placed on a printed circuit board, the carrier remaining in-situ to provide an environmental protective barrier while electrical contact may be effected using a conductive adhesive such as conductive epoxy.

Claims (25)

1. A method of applying a planar microelectronic circuit element to a substrate comprising, forming the the circuit element on the face of a first carrier substrate, placing the carrier substrate face down onto the surface of a second substrate and attaching the circuit element to the second substrate.
2. A method as claimed in Claim 1, wherein the circuit element is a thin-film microelectronic circuit element formed on the face of the carrier substrate using thin-film deposition techniques.
3. A method as claimed in Claim 2, wherein the circuit element comprises a metal- lisation pattern defining a distributed microwave circuit element.
4. A method as claimed in Claim 3, wherein the circuit element is a microwave filter.
5. A method as claimed in any one of Claims 1 to 4, wherein the carrier substrate is removed following attachment of the circuit element to the second substrate.
6. A method as claimed in Claim 5, wherein the carrier substrate is removed by dissolving or etching.
7. A method as claimed in any preceding Claim, wherein the circuit element is attached to the surface of the second substrate by means of an adhesive.
8. A method as claimed in Claim 7, wherein excess adhesive is exuded before setting by applying pressure between the two substrates.
9. A method as claimed in any preceding Claim wherein the carrier substrate is transparent.
10. A method as claimed in any preceding Claim, wherein the carrier substrate is flexible.
11. A method as claimed in any preceding Claim, wherein the carrier substrate is of biaxially oriented polystyrene sheet material.
12. A method as claimed in Claim 11, wherein the circuit element is attached to the surface of the second substrate using a cyanoacrylate adhesive.
13. A method as claimed in Claim 11 or Claim 12, wherein, following attachment of the circuit element to the surface of the second substrate, the polystrene carrier substrate is removed using a hydrocarbon solvent.
14. A method as claimed in any preceding Claim, wherein the surface of the second substrate to which the circuit element is attached carries a conductive planar micro-circuit pattern and an electrical connection is provided between the circuit element and the conductive pattern.
15. A method as claimed in Claim 14, wherein the second substrate comprises a thick film microelectronic circuit substrate on which the conductive circuit pattern is formed by thick film fabrication techniques.
16. A method as claimed in Claim 14, wherin the second substrate comprises a micro-electronic printed circuit board on which the conductive circuit pattern is formed by printed circuit board fabrication techniques.
17. A method as claimed in Claim 14, wherein the second substrate comprises a thin film microelectronic circuit substrate on which the conductive circuit pattern is formed by thin film fabrication techniques.
18. A method as claimed in any one of Claims 14 to 17, wherein the circuit element is attached to the surface of the second substrate in a position adjacent the conductive circuit pattern, and following removal of the carrier substrate, permanent electrical connection is provided between the circuit element and the conductive pattern by means of one or more bridging electrical connections.
19. A method as claimed in Claim 18, wherein the or each bridging electrical connection is formed by tape or wire bonding, or soldering.
20. A method as claimed in any one of Claims 14 to 17, wherein the circuit element is formed on the face of the carrier substrate with one or more metallised contact areas which, when the circuit element is located on the second substrate, overlap respective contact areas provided by the conductive circuit pattern on the surface of the second substrate.
21. A method as claimed in Claim 20, wherein following attachment of the circuit element to the surface of the second substrate, the carrier substrate is removed, and the overlapping contact areas of the circuit element and conductive circuit pattern are permanently electrically connected.
22. A method as claimed in Claim 20, wherein the circuit element is a radio frequency element, and wherein, following attachment of the circuit element to the surface of the second substrate, no permanent electrical connection is provided between the loosely overlapping areas of the circuit element and the conductive circuit pattern, the engagement between these overlapping areas providing sufficient radio frequency coupling between the circuit and the circuit element,
23. A method of applying a planar microelectronic circuit element to a substrate substantially as shown in, and as herein before described with reference to, the accompanying drawings.
24. A carrier substrate formed on its face with a planar microelectronic circuit element in combination with a second substrate carrying on its surface a planar conductive microelectronic circuit pattern, the circuit element and or the circuit pattern being adapted for insertion of the circuit element on the carrier substrate into the circuit pattern on the carrier substrate by a method as claimed in any preceding Claim.
25. A microelectronic circuit including one or more microelectronic circuit elements attached to the surface of a substrate by a method as claimed in any one of Claims 1 to 23.
GB8006068A 1979-02-26 1980-02-22 Applying circuit elements to a substrate Expired GB2047476B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8006068A GB2047476B (en) 1979-02-26 1980-02-22 Applying circuit elements to a substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB7906701 1979-02-26
GB8006068A GB2047476B (en) 1979-02-26 1980-02-22 Applying circuit elements to a substrate

Publications (2)

Publication Number Publication Date
GB2047476A true GB2047476A (en) 1980-11-26
GB2047476B GB2047476B (en) 1983-06-15

Family

ID=26270701

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8006068A Expired GB2047476B (en) 1979-02-26 1980-02-22 Applying circuit elements to a substrate

Country Status (1)

Country Link
GB (1) GB2047476B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2540328A1 (en) * 1983-01-31 1984-08-03 Inf Milit Spatiale Aeronaut
EP0140619A2 (en) * 1983-10-14 1985-05-08 Hitachi Chemical Co., Ltd. Anisotropic-electroconductive adhesive film and circuit connecting method using the same
EP0298219A2 (en) * 1987-06-08 1989-01-11 Tektronix Inc. Method and apparatus for testing unpackaged integrated circuits in a hybrid circuit environment
FR2807907A1 (en) * 2000-04-13 2001-10-19 Schott Glas ELECTRICAL CONNECTION BETWEEN A CONNECTION POINT AND A CONDUCTIVE TRACK APPLIED TO A PLATE, PARTICULARLY TO A VITROCERAMIC PLATE
EP1198161A1 (en) * 2000-10-10 2002-04-17 Morton International, Inc. Method for securing and processing thin film materials

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2540328A1 (en) * 1983-01-31 1984-08-03 Inf Milit Spatiale Aeronaut
EP0115460A2 (en) * 1983-01-31 1984-08-08 Compagnie D'informatique Militaire Spatiale Et Aeronautique Flexible printed circuit card, process for the modification of a printed circuit card, and printed circuit card
EP0115460A3 (en) * 1983-01-31 1984-08-29 Compagnie D'informatique Militaire Spatiale Et Aeronautique Flexible printed circuit card, process for the modification of a printed circuit card, and printed circuit card
EP0140619A2 (en) * 1983-10-14 1985-05-08 Hitachi Chemical Co., Ltd. Anisotropic-electroconductive adhesive film and circuit connecting method using the same
EP0140619A3 (en) * 1983-10-14 1986-05-14 Hitachi Chemical Co., Ltd. Anisotropic-electroconductive adhesive film and circuit connecting method using the same
EP0298219A2 (en) * 1987-06-08 1989-01-11 Tektronix Inc. Method and apparatus for testing unpackaged integrated circuits in a hybrid circuit environment
EP0298219A3 (en) * 1987-06-08 1990-08-01 Tektronix Inc. Method and apparatus for testing unpackaged integrated circuits in a hybrid circuit environment
FR2807907A1 (en) * 2000-04-13 2001-10-19 Schott Glas ELECTRICAL CONNECTION BETWEEN A CONNECTION POINT AND A CONDUCTIVE TRACK APPLIED TO A PLATE, PARTICULARLY TO A VITROCERAMIC PLATE
EP1198161A1 (en) * 2000-10-10 2002-04-17 Morton International, Inc. Method for securing and processing thin film materials

Also Published As

Publication number Publication date
GB2047476B (en) 1983-06-15

Similar Documents

Publication Publication Date Title
US4329779A (en) Methods of applying circuit elements to a substrate
US4000054A (en) Method of making thin film crossover structure
US4777718A (en) Method of forming and connecting a resistive layer on a pc board
US6144547A (en) Miniature surface mount capacitor and method of making same
US6021050A (en) Printed circuit boards with integrated passive components and method for making same
EP0406376A1 (en) Improved method for making printed circuits
JPH05235612A (en) Fixed impedance transition part between transmission structures of different dimensions
JPH0818187A (en) Electronic device and manufacture thereof
GB2047476A (en) Improvement in or relating to applying circuit elements to a substrate
USH416H (en) High capacitance flexible circuit
US4737747A (en) Printed circuit resistive element
EP1480286A1 (en) Microwave frequency surface mount components and methods of forming same
JPH07106759A (en) Thin-film multilayered substrate
US3584376A (en) Microstrip delay line and a method of manufacturing same
EP1187514A2 (en) Printed wiring board
JP3294294B2 (en) Ceramic substrate and metallizing method thereof
JPH0680964B2 (en) Circuit device having stripline
JPH06216501A (en) Printed board and member for it
JP3299265B2 (en) Device with laminated conductive pattern and easily selectable insulator
JPH09260797A (en) Wiring board
JPS6226197B2 (en)
JP2540933B2 (en) Method of connecting semiconductor element to circuit board or carrier
JPH03131102A (en) Method for connecting semiconductor element and circuit board or carrier
JP2002222729A (en) Electronic part and its manufacturing method
JPH05183306A (en) Dielectric board for tri-plate structure

Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee