GB2044468A - Device for measuring electrical parameters of electronic circuits - Google Patents
Device for measuring electrical parameters of electronic circuits Download PDFInfo
- Publication number
- GB2044468A GB2044468A GB7908894A GB7908894A GB2044468A GB 2044468 A GB2044468 A GB 2044468A GB 7908894 A GB7908894 A GB 7908894A GB 7908894 A GB7908894 A GB 7908894A GB 2044468 A GB2044468 A GB 2044468A
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed circuit
- terminals
- circuit boards
- base plate
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
- G06F11/24—Marginal checking or other specified testing methods not covered by G06F11/26, e.g. race tests
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Quality & Reliability (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
A device for measuring electrical parameters of electronic circuits such as microprocessors 44, 45 in LSI form, comprises a base plate 1 which mounts printed circuit boards 2 with electronic component parts 3 and coupling terminals 4 to connect a main terminal block 5 located near the printed circuit boards 2. The base plate 1 has a through hole along whose periphery there are mounted connectors 6 for the printed circuit boards 2 and runners 7 with terminals 8 for connection to a plug 24 to which the circuits 44, 45 under test are connected via relays 28...31. Disposed above the printed circuit boards 2 is a printed circuit board cover 12 with holes 13. The cover 12 allows the air to pass through the holes 11 to heat sinks 14 of the electronic component parts 3. In Fig. 2 (not shown), a microscope is inverted in place of the upper connector 24 to facilitate alignment of probes relative to bonds of the chip under test. <IMAGE>
Description
SPECIFICATION
Device for measuring electrical parameters of electronic circuits
The invention relates to test instrumentation for pulsed engineering, and more particularly to a device for measuring electrical parameters of electronic circuits.
The device is applicable for the measurements performed in the manufacture of microelectronics items, including the testing, at high testing rates, of the integrated circuits in packages and the probe testing on the slice as well.
There is disclosed a device for measuring electrical parameters of electronic circuits, comprising a base plate mounting printed circuit boards with electronic component parts and coupling terminals to connect the device to a main terminal block located near the printed circuit boards which device comprises, according to the invention, a through hole in the base plate, along whose periphery there are mounted the connectors for the printed circuit boards and runners with terminals, a recess being formed in the base plate under said connectors, said recess being enclosed with a wiring cover, holes being formed in the base plate near said connectors, a printed circuit board cover being disposed above said printed circuit boards, said printed circuit board cover being provided with holes to lead the air delivered through the holes in the base plate to the heat sinks of the electronic component parts of the printed circuit boards, control printed circuit boards, disposed in its own connectors, being mounted at right angles to the base plate, coupling connectors being mounted on and air duct holes being formed in the end face portion of the base plate, an additional terminal board being mounted on the printed circuit board cover, said additional terminal board being provided with terminals which connect additional component parts coupled to load connectors disposed in the printed circuit board cover and mounted, together with the additional terminal board inside an encapsulation casing, and a detachable plug member being disposed between the runners with terminals, which can be connected to the latter.
Advantageously, the proposed device further comprises an additional terminal block, said detachable plug member being provided with two detachable terminal boards having their terminals coupled to respective terminals of the runners and the printed circuit boards, switching elements, control coils mounted on said terminal boards and having their enclosures adjacent the switching elements which have their first leads coupled to the terminals of the terminal boards, and terminal strips attached to the control coils and provided with terminals which connect the second leads of the switching elements and the leads of the main and additional terminal blocks.
Preferably, a detachable plug member comprises a hollow cylinder with side and end face terminals which connect one another by virtue of conductors, the side terminals of the detachable plug member being coupled to respective terminals of the runners and the printed circuit boards, and a terminal block is implemented as a mounting plate with a central hole along whose periphery there are mounted probe test terminals coupled to respective end face terminals of the detachable plug member.
The disclosed device provides for effective cooling of its component parts that generate heat.
The device provides for connection of more than one terminal block and for operation in conjunction with the probe testing installation, which results in a higher equipment utilization factor along with a higher testing rate of the electrical parameters.
With the device, LSI circuits incorporated in internal storages and microprocessors, both in packages and on the slice, can be tested at maximum allowable testing rates.
The invention will now be described, by way of example, with reference to the accompanying drawings in which:
Figure 1 is a longitudinal section of a device for measuring electrical parameters of electronic circuits, according to the invention
Figure 2 is a longitudinal section of a device for measuring electrical parameters of electronic circuits, showing another embodiment of a detachable plug member.
The device of the invention comprises a base plate 1 (Fig. 1) which mounts printed circuit boards 2 with electronic component parts 3 and coupling terminals 4 to provide connection for a terminal block 5 located near the printed circuit boards 2.
The base plate 1 has a through hole along whose periphery there are mounted connectors 6 for the printed circuit boards 2 and runners 7 with terminals 8. There is a recess 9 in the base plate 1 under the connectors 6. The recess 9, enclosed with a wiring cover 9, serves to accommodate the wiring, to receive the air flow and to create a respective pressure in the latter. Holes 11 are formed in a respective wall of the recess 9.
Disposed above the printed circuit boards 2 is a printed circuit board cover 12 with holes 13. The cover 12 allows the air to pass through the holes 11 to heat sinks 14 disposed on one side of the printed circuit boards 2 and connected with the electronic component parts 3 which tend to generate heat.
The base pfate 1 also mounts connectors 15 which house a number of control printed circuit boards 16 disposed at right angles to the base plate 1. Located near the end face portion of the base plate 1 are coupling connectors 17 and ar. air duct hole 18.
Load connectors 19 for the printed circuit boards 2 are mounted above the latter. The printed circuit board cover 12 mounts an additional terminal board 20 with terminals 21 for additional component parts 22, said terminals 21 being coupled to respective load connectors 19.
An encapsulation casing 23 is mounted above the additional terminal board 20 and the printed circuit board cover 12. There is a detachable plug member 24 between the runners 7, which has terminals 25 coupled to the terminals 8 of respective runners 7.
The detachable plug member 24 comprises two detachable terminal boards 26 and 27 which connect, via the terminals 25, the first leads of switching elements 28 and 29 to the terminals 8 and 4 of the runners 7 and the printed circuit boards 2 respectively. The detachable plug member 24 also comprises control coils 30 and 31 mounted on the terminal boards 26 and 27 and having their enclosures adjacent the switching elements 28 and 29.
Attached to the control coils 30 and 31 are terminal strips 32 and 33 whose terminals 34 and 35 connect the second leads of the switching elements 28 and 29 and the leads of the main and additional terminal blocks 5 and 36.
Figure 2 shows a detachable plug member 38 (fixed with locks 37) which is a hollow cylinder having side terminals 39 and end face terminals 40 which connect one another by virtue of conductors 41.
The side terminals 39 of the detachable plug member 38 are coupled to the terminals 8 and 4 of the runners 7 and the printed circuit boards 2, respectively.
A terminal block 42 is implemented as a mounting plate with a central hole along whose periphery there are mounted probe test terminals 43 coupled to respective end face terminals 40 of the detachable plug member 38.
The device of the invention operates in the following manner.
During the testing of the integrated circuits in packages, the device of the invention is set in a vertical position (Fig. 1).
The integrated circuits under test, as shown at 44 and 45, are placed in the terminal blocks 5 and 36 and are connected to a respective printed circuit board 2 by virtue of one of the groups of the switching elements 29 and 28.
The leads of the integrated circuit 44 are first coupled to the printed circuit board 2 via the termial block 5 and the terminals 25, 8 and 4.
After the test operations are completed, the switching elements 29 are operated to disconnect the integrated circuit 44 from the printed circuit board 2.
When the integrated circuit 44 is replaced by a new one (this being done either by a human operator or an automatic sorting device), the integrated circuit 45 is connected to the printed circuit board 2 by operating the switching elements 28, via the terminal block 36 and the terminals 25, 8 and 4.
After the integrated circuit 45 has been tested, the switching elements 28 are operated to disconnect it from the printed circuit board 2 and thk replacement of the integrated circuit 45 in the terminal block 36 then commences. During this period of time, another integrated circuit 44 is being tested in the terminal block 5.
The detachable plug member 24 therefore makes it possible to connect alternatively the integrated circuits 44 and 45 to the measuring assemblies of the device of the invention. The utilization factor of the most costly portion of the device is therefore increased by a factor of 1.5 to 2, whereas the connections between the leads of the integrated circuits 44 and 45 as well as between the assemblies on the printed circuit boards 2 can be considerably reduced or made equal to one another in size.
All these features of the invention provide for a high testing rate of the electrical parameters and identical test results for the integrated circuits 44 and 45 located in different terminal blocks 5 and 36.
The cool effectively the electronic component parts 3 on the printed circuit boards 2, which generate a large amount of heat, the air is delivered through the air duct hole 18 into the recess 9 hermetically enclosed with the wiring cover 10 and then passes, under a certain pressure and via the holes 11, into a space formed by the base plate 1, the printed circuit board cover 12 and the encapsulation casing 23.
The air led through a space formed by the printed circuit board cover 12 and the base plate 1 and a space formed by the encapsulation casing 23 and the printed circuit board cover 12 passes to the heat sinks 14 connected with the component parts 3 generating a large amount of heat.
Also, the air led through the space formed by the printed circuit board cover 12 and the encapsulation casing 23 provides for the cooling of the additional component parts 23 on the additonal terminal board 20.
This embodiment of the invention, although having small dimensions, ensures effective cooling of the component parts 3 and 22 which tend to generate more heat at increased testing rate.
To create real loads during the testing of the integrated circuits 44 and 45, changeable load elements serve as the additional component parts 22 connected to the terminals 21 of the additional terminal board 20 and, via the load connectors 19, to the assemblies of the printed circuit boards 2.
The load section is enclosed with the encapsulation casing 23.
The control printed circuit boards 16 provide automatic control of the additional component parts 22, switching elements 28 and 29 and the component parts 3.
The coupling connectors 17 allow external control apparatus to be connected to the device of the invention.
The embodiment of the invention makes it
possible to increase the utilization factor and flexibility of the device and to obtain a higher testing rate and test results of a higher validity.
In addition, the detachable plug member 24 can be replaced with another one serving a new purpose and can provide the use of the device in conjunction with probe testing installations for testing the integrated circuits on the slice
In this embodiment the detachable plug member 24, comprising the terminal blocks 5 and 36, terminal boards 26 and 27 and terminal strips 32 and 33 wih the control coils 30 and 31 installed therebetween to control the switching elements 28 and 29, is withdrawn from the device and replaced with the detachable plug member 38 (Fig. 2). The terminal block 42 is coupled to the end face portion of the detachable plug member 38.
During the testing of the integrated circuits on the slice, the device of the invention operates in the following manner.
The device is mounted between a slice 46 with an integrated circuit chip 47 under test and a microscope 48. Respective holes in the base plate 1, terminal block 42 and detachable plug member 38 make it possible to use the microscope 48 to observe how the probe test terminals 43 are positioned with respect to the bonding pads of the integrated circuit chip 47 on the slice 46.
After the ends of the probe test terminals 43 are aligned relative to the centers of the bonding pads of the chip 47, contact is established between the probe test terminals 43 and the bonding pads of the chip 47.
The output of the printed circuit board 2 produces signals coming via the terminals 4, 8 and 39 and via the conductors 41 to the end face terminals 40 to which respective probe test terminals 43 are connected. The signals then pass to the bonding pads of the chip 47 with the result that respective tests are performed. In this case, the electrical characteristics of the device are maintained in the prescribed limits, which ensures its increased effectiveness in testing microelectronics items being manufactured.
Claims (4)
1. A device for measuring electrical parameters
of electronic circuits, comprising a base plate
mounting printed circuit boards with electronic
component parts and coupling terminals to
connect a main terminal block located near the
printed circuit boards, the connectors for the
printed circuit boards and runners with terminals
being mounted along the periphery of a through
hole in the base plate, a recess being formed in the
base plate under said connectors, said recess
being enclosed with a wiring cover, holes being formed in the base plate near the connectors, a printed circuit board cover being disposed above the printed circuit boards, the printed circuit board cover being provided with holes to lead the air delivered throught the holes in the base plate to the heat sinks of the electronic component parts cf the printed circuit boards, control printed circuit boards in their own connectors being mounted at right angles to the base plate, coupling connectors being mounted on and air duct holes being formed in the end face portion of the base plate, an additional terminal board mounted on the printed circuit board cover and having its terminals connected to additional component parts which connect load connectors disposed in the printed circuit board cover and installed, together with the additional terminal board, inside an encapsulation casing, and a detachable plug member being disposed between the runners, which can be connected to the terminals of the runners.
2. A device as claimed in claim 1, comprising an additional terminal block and a detachable plug member incorporating two detachable terminal boards having their terminals connected to respective terminals of the runners and the printed circuit boards, switching elements, control coils disposed on the terminal boards and having their enclosures adjacent the switching element which have their first leads coupled to the terminals of the terminal boards, and terminal strips attached to the control coils and provided with terminals which connect the second leads of the switching elements and the leads of the main and additional terminal blocks.
3. A device as claimed in claim 1, comprising detachable plug member which is a hollow cylinder with side and end face terminals which connect one another by virtue of conductors, the side terminals of the detachable plug member being coupled to respective terminals of the runners and the printed circuit boards, and a terminal block implemented as a mounting plate with a central hole, probe test terminals coupled to respective end face terminals of the detachable plug member being mounted along the periphery of the central hole.
4. A device for measuring electrical parameters of electronic circuits substantially as hereinbefore described with reference to the accompanying drawings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7908894A GB2044468A (en) | 1979-03-13 | 1979-03-13 | Device for measuring electrical parameters of electronic circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7908894A GB2044468A (en) | 1979-03-13 | 1979-03-13 | Device for measuring electrical parameters of electronic circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB2044468A true GB2044468A (en) | 1980-10-15 |
Family
ID=10503849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB7908894A Withdrawn GB2044468A (en) | 1979-03-13 | 1979-03-13 | Device for measuring electrical parameters of electronic circuits |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2044468A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1983004315A1 (en) | 1982-05-24 | 1983-12-08 | Micro Component Technology, Inc. | Integrated circuit test apparatus |
| EP1029249A2 (en) * | 1997-05-23 | 2000-08-23 | Credence Systems Corporation | Test head structure for integrated circuit tester |
| CN114113717A (en) * | 2021-11-24 | 2022-03-01 | 北京航空航天大学 | Plug-in type totally-enclosed Faraday probe |
| CN115077732A (en) * | 2022-07-20 | 2022-09-20 | 深圳市德兰明海科技有限公司 | Make things convenient for temperature sensor subassembly and temperature measuring equipment of dismouting |
-
1979
- 1979-03-13 GB GB7908894A patent/GB2044468A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1983004315A1 (en) | 1982-05-24 | 1983-12-08 | Micro Component Technology, Inc. | Integrated circuit test apparatus |
| EP0108790A1 (en) * | 1982-05-24 | 1984-05-23 | Micro Component Technology Inc | Integrated circuit test apparatus. |
| EP0108790A4 (en) * | 1982-05-24 | 1984-07-06 | Micro Component Technology Inc | Integrated circuit test apparatus. |
| EP1029249A2 (en) * | 1997-05-23 | 2000-08-23 | Credence Systems Corporation | Test head structure for integrated circuit tester |
| EP1029249A4 (en) * | 1997-05-23 | 2006-01-18 | Credence Systems Corp | Test head structure for integrated circuit tester |
| CN114113717A (en) * | 2021-11-24 | 2022-03-01 | 北京航空航天大学 | Plug-in type totally-enclosed Faraday probe |
| CN115077732A (en) * | 2022-07-20 | 2022-09-20 | 深圳市德兰明海科技有限公司 | Make things convenient for temperature sensor subassembly and temperature measuring equipment of dismouting |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |