GB202117309D0 - Heatsink - Google Patents
HeatsinkInfo
- Publication number
- GB202117309D0 GB202117309D0 GBGB2117309.1A GB202117309A GB202117309D0 GB 202117309 D0 GB202117309 D0 GB 202117309D0 GB 202117309 A GB202117309 A GB 202117309A GB 202117309 D0 GB202117309 D0 GB 202117309D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- heatsink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K5/00—Casings; Enclosures; Supports
- H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
- H02K5/20—Casings or enclosures characterised by the shape, form or construction thereof with channels or ducts for flow of cooling medium
- H02K5/207—Casings or enclosures characterised by the shape, form or construction thereof with channels or ducts for flow of cooling medium with openings in the casing specially adapted for ambient air
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K9/00—Arrangements for cooling or ventilating
- H02K9/22—Arrangements for cooling or ventilating by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
- H02K9/227—Heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K2213/00—Specific aspects, not otherwise provided for and not covered by codes H02K2201/00 - H02K2211/00
- H02K2213/03—Machines characterised by numerical values, ranges, mathematical expressions or similar information
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
- Manufacture Of Motors, Generators (AREA)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2117309.1A GB2613542B (en) | 2021-11-30 | 2021-11-30 | Heatsink |
GB2216860.3A GB2613699B (en) | 2021-11-30 | 2022-11-11 | Heatsink |
JP2022183983A JP2023081313A (en) | 2021-11-30 | 2022-11-17 | Heatsink |
EP22209117.5A EP4187761A1 (en) | 2021-11-30 | 2022-11-23 | Heatsink |
AU2022275455A AU2022275455A1 (en) | 2021-11-30 | 2022-11-24 | Heatsink |
TW111145383A TW202336403A (en) | 2021-11-30 | 2022-11-28 | Heatsink |
KR1020220162794A KR20230081671A (en) | 2021-11-30 | 2022-11-29 | Heatsink |
CN202211511891.8A CN116209209A (en) | 2021-11-30 | 2022-11-29 | Radiator |
MX2022015124A MX2022015124A (en) | 2021-11-30 | 2022-11-29 | Heatsink. |
US18/070,868 US20230170766A1 (en) | 2021-11-30 | 2022-11-29 | Heatsink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2117309.1A GB2613542B (en) | 2021-11-30 | 2021-11-30 | Heatsink |
Publications (3)
Publication Number | Publication Date |
---|---|
GB202117309D0 true GB202117309D0 (en) | 2022-01-12 |
GB2613542A GB2613542A (en) | 2023-06-14 |
GB2613542B GB2613542B (en) | 2024-04-10 |
Family
ID=80038489
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2117309.1A Active GB2613542B (en) | 2021-11-30 | 2021-11-30 | Heatsink |
GB2216860.3A Active GB2613699B (en) | 2021-11-30 | 2022-11-11 | Heatsink |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2216860.3A Active GB2613699B (en) | 2021-11-30 | 2022-11-11 | Heatsink |
Country Status (1)
Country | Link |
---|---|
GB (2) | GB2613542B (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE548613T1 (en) * | 2005-08-11 | 2012-03-15 | Machflow Energy Inc | BERNOULLI HEAT PUMP BASED ON NOBLE GAS AND PROCESS |
US7695161B2 (en) * | 2007-11-08 | 2010-04-13 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device for light emitting diode module |
EP2262080B1 (en) * | 2008-04-03 | 2016-10-19 | Yuneec Technology Co., Limited | A brushless dc motor and a radiator thereof |
CN101662914A (en) * | 2008-08-29 | 2010-03-03 | 嘉赫科技有限公司 | Radiating device and radiator |
US20110079370A1 (en) * | 2009-07-17 | 2011-04-07 | Textron Inc. | Non-Uniform Height And Density Fin Design For Heat Sink |
TW201128162A (en) * | 2010-02-12 | 2011-08-16 | li-hua Qin | Planting and bonding method of heat-dissipation fin |
US20160106000A1 (en) * | 2014-10-13 | 2016-04-14 | Panasonic Automotive Systems Company Of America, Division Of Panasonic Corporation Of North America | Low profile heat sink |
TWM609965U (en) * | 2020-12-02 | 2021-04-01 | 訊凱國際股份有限公司 | Heat dissipation fin and heat dissipator |
-
2021
- 2021-11-30 GB GB2117309.1A patent/GB2613542B/en active Active
-
2022
- 2022-11-11 GB GB2216860.3A patent/GB2613699B/en active Active
Also Published As
Publication number | Publication date |
---|---|
GB2613699A (en) | 2023-06-14 |
GB202216860D0 (en) | 2022-12-28 |
GB2613699B (en) | 2024-04-10 |
GB2613542B (en) | 2024-04-10 |
GB2613542A (en) | 2023-06-14 |
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