GB201816765D0 - Flexible printed board - Google Patents
Flexible printed boardInfo
- Publication number
- GB201816765D0 GB201816765D0 GBGB1816765.0A GB201816765A GB201816765D0 GB 201816765 D0 GB201816765 D0 GB 201816765D0 GB 201816765 A GB201816765 A GB 201816765A GB 201816765 D0 GB201816765 D0 GB 201816765D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- flexible printed
- printed board
- board
- flexible
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0227—Split or nearly split shielding or ground planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016115323 | 2016-06-09 | ||
PCT/JP2017/019859 WO2017212966A1 (en) | 2016-06-09 | 2017-05-29 | Flexible printed board |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201816765D0 true GB201816765D0 (en) | 2018-11-28 |
GB2565453A GB2565453A (en) | 2019-02-13 |
GB2565453B GB2565453B (en) | 2021-09-08 |
Family
ID=60578704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1816765.0A Active GB2565453B (en) | 2016-06-09 | 2017-05-29 | Flexible printed circuit board |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6563129B2 (en) |
GB (1) | GB2565453B (en) |
WO (1) | WO2017212966A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI674059B (en) * | 2018-09-28 | 2019-10-01 | 正美企業股份有限公司 | Circuit board using for a printed electronic component |
CN117941471A (en) * | 2021-11-29 | 2024-04-26 | 日立安斯泰莫株式会社 | Electronic device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6027466A (en) * | 1983-07-25 | 1985-02-12 | Isuzu Motors Ltd | Formation of surface layer reinforcing wear surface of casting |
JPS6027466U (en) * | 1983-07-30 | 1985-02-25 | 日本メクトロン株式会社 | Base material for flexible circuit boards |
JPH02109390A (en) * | 1988-10-18 | 1990-04-23 | Furukawa Electric Co Ltd:The | High-density flexible printed circuit board |
JPH05190752A (en) * | 1992-01-09 | 1993-07-30 | Fujitsu Ltd | Wiring structure of power-supply pattern |
JP3282870B2 (en) * | 1993-01-22 | 2002-05-20 | 新光電気工業株式会社 | High frequency signal line |
US7439449B1 (en) * | 2002-02-14 | 2008-10-21 | Finisar Corporation | Flexible circuit for establishing electrical connectivity with optical subassembly |
JP4872847B2 (en) * | 2007-07-31 | 2012-02-08 | 株式会社デンソー | In-vehicle device |
-
2017
- 2017-05-29 GB GB1816765.0A patent/GB2565453B/en active Active
- 2017-05-29 WO PCT/JP2017/019859 patent/WO2017212966A1/en active Application Filing
- 2017-05-29 JP JP2018522427A patent/JP6563129B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
GB2565453A (en) | 2019-02-13 |
JP6563129B2 (en) | 2019-08-21 |
GB2565453B (en) | 2021-09-08 |
JPWO2017212966A1 (en) | 2019-02-21 |
WO2017212966A1 (en) | 2017-12-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
PL3357144T3 (en) | Printed circuit board stator | |
EP3200572A4 (en) | Printed wiring board | |
EP3174374A4 (en) | Printed wiring board | |
EP3422823A4 (en) | Flexible printed circuit board | |
EP3409081A4 (en) | Flexible printed circuit | |
EP2916629A4 (en) | Printed circuit board | |
IL262577A (en) | Sibling board | |
GB2526565B (en) | Assembly of printed circuit boards | |
EP3533300A4 (en) | Printed electronics | |
PL3475083T3 (en) | Hollow board | |
EP3158835A4 (en) | Modular printed circuit board | |
ZA202001845B (en) | Deck board | |
GB201700883D0 (en) | Inkjet printed electronic devices | |
GB201816765D0 (en) | Flexible printed board | |
EP3278636A4 (en) | Printed circuit board | |
HK1215509A1 (en) | Printed circuit board | |
GB201619976D0 (en) | I/O Circuit board for immersion-cooled electronics | |
TWM490721U (en) | Rigid-flexible printed circuit board | |
GB2560778B (en) | Circuit Board Assembly | |
GB201708991D0 (en) | Board clamp | |
TWM534495U (en) | Multilayer circuit board | |
TWM489446U (en) | Flexible printed circuit board with alignment mark set | |
EP3278637A4 (en) | Printed circuit board | |
TWI562687B (en) | Circuit board assembly | |
TWM533837U (en) | Flexible circuit board |