GB201800816D0 - A method for fabricating a lead-free thin film element and uses thereof - Google Patents
A method for fabricating a lead-free thin film element and uses thereofInfo
- Publication number
- GB201800816D0 GB201800816D0 GBGB1800816.9A GB201800816A GB201800816D0 GB 201800816 D0 GB201800816 D0 GB 201800816D0 GB 201800816 A GB201800816 A GB 201800816A GB 201800816 D0 GB201800816 D0 GB 201800816D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- fabricating
- lead
- thin film
- film element
- free thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB1800816.9A GB201800816D0 (en) | 2018-01-18 | 2018-01-18 | A method for fabricating a lead-free thin film element and uses thereof |
PCT/GB2018/053699 WO2019141961A1 (en) | 2018-01-18 | 2018-12-19 | A method for fabricating a lead-free thin film element and uses thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB1800816.9A GB201800816D0 (en) | 2018-01-18 | 2018-01-18 | A method for fabricating a lead-free thin film element and uses thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
GB201800816D0 true GB201800816D0 (en) | 2018-03-07 |
Family
ID=61283630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB1800816.9A Ceased GB201800816D0 (en) | 2018-01-18 | 2018-01-18 | A method for fabricating a lead-free thin film element and uses thereof |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB201800816D0 (en) |
WO (1) | WO2019141961A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115084393A (en) * | 2021-03-11 | 2022-09-20 | 吉林大学 | Perovskite thin film and preparation method thereof, solar cell and light-emitting device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6072207A (en) * | 1991-02-25 | 2000-06-06 | Symetrix Corporation | Process for fabricating layered superlattice materials and making electronic devices including same |
US6133092A (en) * | 1998-07-24 | 2000-10-17 | Symetrix Corporation | Low temperature process for fabricating layered superlattice materials and making electronic devices including same |
-
2018
- 2018-01-18 GB GBGB1800816.9A patent/GB201800816D0/en not_active Ceased
- 2018-12-19 WO PCT/GB2018/053699 patent/WO2019141961A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2019141961A1 (en) | 2019-07-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |