GB2017403B - Encapsulated semiconductor device - Google Patents

Encapsulated semiconductor device

Info

Publication number
GB2017403B
GB2017403B GB7908980A GB7908980A GB2017403B GB 2017403 B GB2017403 B GB 2017403B GB 7908980 A GB7908980 A GB 7908980A GB 7908980 A GB7908980 A GB 7908980A GB 2017403 B GB2017403 B GB 2017403B
Authority
GB
United Kingdom
Prior art keywords
semiconductor device
encapsulated semiconductor
encapsulated
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7908980A
Other languages
English (en)
Other versions
GB2017403A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of GB2017403A publication Critical patent/GB2017403A/en
Application granted granted Critical
Publication of GB2017403B publication Critical patent/GB2017403B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
GB7908980A 1978-03-28 1979-03-14 Encapsulated semiconductor device Expired GB2017403B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/891,090 US4161746A (en) 1978-03-28 1978-03-28 Glass sealed diode

Publications (2)

Publication Number Publication Date
GB2017403A GB2017403A (en) 1979-10-03
GB2017403B true GB2017403B (en) 1982-08-04

Family

ID=25397599

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7908980A Expired GB2017403B (en) 1978-03-28 1979-03-14 Encapsulated semiconductor device

Country Status (9)

Country Link
US (1) US4161746A (enExample)
JP (1) JPS55105355A (enExample)
BE (1) BE875082A (enExample)
BR (1) BR7901807A (enExample)
CA (1) CA1107403A (enExample)
DE (1) DE2912325A1 (enExample)
FR (1) FR2421464A1 (enExample)
GB (1) GB2017403B (enExample)
IN (1) IN150322B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4168960A (en) * 1978-04-18 1979-09-25 Westinghouse Electric Corp. Method of making a glass encapsulated diode
IT1134954B (it) * 1981-01-07 1986-08-20 Sar Spa Pompa ad azionamento manuale per la erogazione sotto pressione di sostanze liquide e/o dense racchiuse in un contenitore sul quale la pompa e' montata
JPS6014494A (ja) * 1983-07-04 1985-01-25 株式会社日立製作所 セラミツク多層配線基板およびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3392312A (en) * 1963-11-06 1968-07-09 Carman Lab Inc Glass encapsulated electronic devices
US3475662A (en) * 1967-11-22 1969-10-28 Westinghouse Electric Corp Hermetically sealed electrical device
US3517272A (en) * 1968-12-24 1970-06-23 Rca Corp Microwave circuit with coaxial package semiconductor device
US3643136A (en) * 1970-05-22 1972-02-15 Gen Electric Glass passivated double beveled semiconductor device with partially spaced preform
JPS5346669B2 (enExample) * 1975-02-21 1978-12-15
US3996602A (en) * 1975-08-14 1976-12-07 General Instrument Corporation Passivated and encapsulated semiconductors and method of making same
DE2636629A1 (de) * 1976-08-13 1978-02-16 Siemens Ag Halbleiterbauelement mit scheibenfoermigem gehaeuse

Also Published As

Publication number Publication date
DE2912325A1 (de) 1979-10-11
JPS55105355A (en) 1980-08-12
IN150322B (enExample) 1982-09-11
CA1107403A (en) 1981-08-18
BR7901807A (pt) 1979-11-20
GB2017403A (en) 1979-10-03
BE875082A (fr) 1979-09-24
FR2421464A1 (fr) 1979-10-26
US4161746A (en) 1979-07-17

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee