GB201308484D0 - Workpiece handling system and method - Google Patents

Workpiece handling system and method

Info

Publication number
GB201308484D0
GB201308484D0 GB201308484A GB201308484A GB201308484D0 GB 201308484 D0 GB201308484 D0 GB 201308484D0 GB 201308484 A GB201308484 A GB 201308484A GB 201308484 A GB201308484 A GB 201308484A GB 201308484 D0 GB201308484 D0 GB 201308484D0
Authority
GB
United Kingdom
Prior art keywords
handling system
workpiece handling
workpiece
handling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB201308484A
Other versions
GB2514102A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Assembly Systems Switzerland GmbH
Original Assignee
DTG International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DTG International GmbH filed Critical DTG International GmbH
Priority to GB1308484.3A priority Critical patent/GB2514102A/en
Publication of GB201308484D0 publication Critical patent/GB201308484D0/en
Priority to TW103116680A priority patent/TW201507054A/en
Priority to PCT/EP2014/059670 priority patent/WO2014184149A1/en
Publication of GB2514102A publication Critical patent/GB2514102A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
GB1308484.3A 2013-05-11 2013-05-11 Workpiece handling system and method Withdrawn GB2514102A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB1308484.3A GB2514102A (en) 2013-05-11 2013-05-11 Workpiece handling system and method
TW103116680A TW201507054A (en) 2013-05-11 2014-05-12 Workpiece handling system and method
PCT/EP2014/059670 WO2014184149A1 (en) 2013-05-11 2014-05-12 Workpiece handling system and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1308484.3A GB2514102A (en) 2013-05-11 2013-05-11 Workpiece handling system and method

Publications (2)

Publication Number Publication Date
GB201308484D0 true GB201308484D0 (en) 2013-06-19
GB2514102A GB2514102A (en) 2014-11-19

Family

ID=48672163

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1308484.3A Withdrawn GB2514102A (en) 2013-05-11 2013-05-11 Workpiece handling system and method

Country Status (3)

Country Link
GB (1) GB2514102A (en)
TW (1) TW201507054A (en)
WO (1) WO2014184149A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110370078B (en) * 2019-08-16 2020-12-15 海宁奥通汽车零件有限公司 Material detection equipment on machining station
TWI707740B (en) 2019-11-26 2020-10-21 財團法人工業技術研究院 Adjustable workpiece support system and method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2856777C2 (en) * 1978-12-29 1980-11-13 Gao Gesellschaft Fuer Automation Und Organisation Mbh, 8000 Muenchen Stacking device for flat goods
JPS59202646A (en) * 1983-05-04 1984-11-16 Hitachi Ltd Positioning device for wafer
JPH06318800A (en) * 1993-05-07 1994-11-15 Toshiba Corp Component mounter
US6031931A (en) * 1996-03-15 2000-02-29 Sony Corporation Automated visual inspection apparatus
KR100196909B1 (en) * 1996-10-08 1999-06-15 윤종용 Sensing apparatus of wafer flat zone
FI111100B (en) * 2000-01-31 2003-05-30 Outokumpu Oy Bands for continuous heat treatment of a material layer
US20020109775A1 (en) * 2001-02-09 2002-08-15 Excellon Automation Co. Back-lighted fiducial recognition system and method of use
CN200957970Y (en) * 2006-08-31 2007-10-10 朱洪兵 Glass-fiber conveyor with fluorine-rubber coated
US20120100666A1 (en) * 2008-12-10 2012-04-26 Applied Materials Italia S.R.L. Photoluminescence image for alignment of selective-emitter diffusions
IT1392993B1 (en) * 2009-02-23 2012-04-02 Applied Materials Inc SUPPORT MATERIAL SUBSTRATE IMPROVED USEFUL FOR PRINTING PRINTING PROCEDURES
KR20120070381A (en) * 2010-12-21 2012-06-29 주식회사 에이케이인터내셔널 Meandering control device for belt conveyer
CN202208500U (en) * 2011-09-13 2012-05-02 郝名 Automatic conveyor belt aligning device

Also Published As

Publication number Publication date
WO2014184149A1 (en) 2014-11-20
TW201507054A (en) 2015-02-16
GB2514102A (en) 2014-11-19

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)