GB1591895A - Electronic devices - Google Patents

Electronic devices Download PDF

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Publication number
GB1591895A
GB1591895A GB51546/77A GB5154677A GB1591895A GB 1591895 A GB1591895 A GB 1591895A GB 51546/77 A GB51546/77 A GB 51546/77A GB 5154677 A GB5154677 A GB 5154677A GB 1591895 A GB1591895 A GB 1591895A
Authority
GB
United Kingdom
Prior art keywords
case
metal
oxide film
electronic device
texturized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB51546/77A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB51546/77A priority Critical patent/GB1591895A/en
Publication of GB1591895A publication Critical patent/GB1591895A/en
Expired legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

(54) IMPROVEMENTS IN OR RELATING TO ELECTRONIC DEVICES (71) I, GENNADY GRIGORIEVICH SMOLKO of kvartira 19, korpus 501 Moscow 103482, Union of Soviet Socialist Republics, a citizen of the Union of Soviet Socialist Republics, do hereby declare the invention, for which I pray that a patent may be granted to me, and the method by which it is to be performed, to be particularly described in and by the following statement: This invention relates to electronic devices.
Such devices may be used to advantage in electronic calculators, electronic watches, radio and TV sets, and measuring instruments.
According to the invention, there is provided an electronic device comprising a case made of a metal of the valve group, the surface layer of the inner side of the case having a texturised anodised oxide film formed on the surface layer of the metal of the case, said surface layer carrying a thin or thick film integrated microcircuit and/or one or more discrete electronic components.
A preferred electronic device has an inner surface having a dielectric layer carrying a thin or thick film integrated microcircuit, the case of the device being made of a metal of the valve group, and the dielectric layer being a texturised anodised oxide film obtained from the metal of the case and formed on the surface layer of the said metal.
Such an embodiment of the electronic device provides for a homogeneity of the material of the case, substrate and elements of the thin or thick film integrated microcircuit, reliable removal of the heat given up by the microcircuit elements and a high mechanical and thermal resistance of the entire device, thereby ensuring a high service reliability of the electronic device.
The invention will be further described, by way of example, with reference to the accompanying drawings, in which: Fig. 1 is an enlarged cross-sectional view of a preferred electronic device; and Fig. 2 is a top plan view of the electronic device of Figure 1 with an uncovered section.
An electronic calculator will be further described as an example of a specific embodiment of the present invention.
The preferred electronic device comprises a case 1 (Fig. 1). The case 1 is made of a metal of the valve group, say, of aluminium.
Titanium, tantalum, niobium, etc. may be used besides aluminium.
The inner surface of the case 1 has a dielectric layer 2. The latter is a texturized anodized oxide film further referred to as the film 2. The film 2 is obtained from the metal of the case 1, i.e., from the aluminium, and is formed on the surface layer of the mentioned metal (the boundary between the film 2 and the metal proper is shown in the drawing arbitrarily by a dashed line).
A thin or thick film integrated microcircuit 3 is made on the texturized anodised oxide film 2. The microcircuit 3 may have various combinations of circuit elements.
Fig. I shows one of the versions of the microcircuit 3 containing a contact area 4 connected by a current-carrying path 5 to a capacitor 6 with foils 7 and 8 separated by a dielectric interlayer 9. The capacitor 6 is connected electrically by a current-carrying path 10 to a resistor 11 that is connected, in turn, by a current-carrying path 12 to a contact area 13. Contact areas 13, 14 and 15 hold a microcircuit 16. The contact areas may serve for attaching any other necessary circuit element, such as a transistor.
The case 1 is provided with a cover 17 made of the same metal as the case 1, i.e. of aluminium, kept within slots 18 of the case 1. The cover may also be made of any other material.
The case 1 is provided with a cover 17 made of the same metal as the case 1, i.e. of aluminium, kept within slots 18 of the case 1. The cover may also be made of any other material.
The cover 17 (Fig. 2) carries push-buttons 19 of a calculator keyboard for data input, an indicator 20 and a switch 21.
Contacts 22 of the keyboard buttons 19 are arranged on the texturized anodised oxide film 2.
The preferred electronic tlcvice 'prates as follows.
On connecting a source of clcctric posscr supply (not shown in the drawing) t(-, the elements of the thin or thick film integrated microcircuit 3 (Fig. 1), the dissipated power heats the tcxturizcd anodiscd oxide film 2 carrying the elements of the microcircuit 3.
Since the texturized anodised oxide film 2 is formed on the metal of the case 1 , there are no constructional elements of high thermal resistance between the oxide film 2 and the case 1. Consequently, the heat given up by the elements of the film integrated microcircuit 3 is dissipated by the entire metal mass of the case I As the coefficients of thermal expansion of the metal case l-texturized anodised oxide film 2-film integrated microcircuit 3 system are of similar values, cven sharp changcs in temperature occuring on. say, switching the device on and off do not give rise to considerable mcchanical strcsses within the electronic device.
Besides, the mcchanical strcsscs produced on operating the calculator keyboard do not destroy the metal case l-texturized anodised oxide film 2-film integrated microcircuit 3 system since the film 2 is formed in the metal of the case 1 The rcsulting cffcct attained by the use of the preferred electronic device provides for a considerable improvement of the service reliability of the device.
The abovc-dcscribed vcrsion of the electonic device compriscs an electronic calculator. The invention may also be used, for example, in electronic watches radio and TV sets and mcnsuring instruments.
In cases X hen the cover is made of the same valve-gronp metal as that of the case, for instance in mcsuring instruments, the texturized anodised oxide film may be formed in the surface layer of the cover metal. on the inner side of the surface of the electronic device case, and the elements of the thin or thick film integrated microcircuit may be arranged on the formed film.
In certain cases, such as, in TV sets, the case of the electronic device may have partitions. The latter are made of the same metal as the case of the device, the surface layer of which may be given a texturized anodised oxide film also carrying the elements of the thin or thick film integrated microcircuit.
The preferred electronic device is of high service reliability and is easy to manufacture, thus providing favourable conditions for all-round automation of the manufacturing process of the electronic device.
WHAT I CLAIM IS: 1. An electronic device comprising a case made of a metal of the valve group, the surface layer of the inner side of the case having a texturized anodised oxide film formed on the surface layer of the metal of the case, said surface layer carrying a thin or thick film integrated microcircuit and/or one or more discrete electronic components.
2. An electronic device substantially as hereinbefore described with reference to the accompanying drawings.
**WARNING** end of DESC field may overlap start of CLMS **.

Claims (2)

**WARNING** start of CLMS field may overlap end of DESC **. oxide film 2. The preferred electronic tlcvice 'prates as follows. On connecting a source of clcctric posscr supply (not shown in the drawing) t(-, the elements of the thin or thick film integrated microcircuit 3 (Fig. 1), the dissipated power heats the tcxturizcd anodiscd oxide film 2 carrying the elements of the microcircuit 3. Since the texturized anodised oxide film 2 is formed on the metal of the case 1 , there are no constructional elements of high thermal resistance between the oxide film 2 and the case 1. Consequently, the heat given up by the elements of the film integrated microcircuit 3 is dissipated by the entire metal mass of the case I As the coefficients of thermal expansion of the metal case l-texturized anodised oxide film 2-film integrated microcircuit 3 system are of similar values, cven sharp changcs in temperature occuring on. say, switching the device on and off do not give rise to considerable mcchanical strcsses within the electronic device. Besides, the mcchanical strcsscs produced on operating the calculator keyboard do not destroy the metal case l-texturized anodised oxide film 2-film integrated microcircuit 3 system since the film 2 is formed in the metal of the case 1 The rcsulting cffcct attained by the use of the preferred electronic device provides for a considerable improvement of the service reliability of the device. The abovc-dcscribed vcrsion of the electonic device compriscs an electronic calculator. The invention may also be used, for example, in electronic watches radio and TV sets and mcnsuring instruments. In cases X hen the cover is made of the same valve-gronp metal as that of the case, for instance in mcsuring instruments, the texturized anodised oxide film may be formed in the surface layer of the cover metal. on the inner side of the surface of the electronic device case, and the elements of the thin or thick film integrated microcircuit may be arranged on the formed film. In certain cases, such as, in TV sets, the case of the electronic device may have partitions. The latter are made of the same metal as the case of the device, the surface layer of which may be given a texturized anodised oxide film also carrying the elements of the thin or thick film integrated microcircuit. The preferred electronic device is of high service reliability and is easy to manufacture, thus providing favourable conditions for all-round automation of the manufacturing process of the electronic device. WHAT I CLAIM IS:
1. An electronic device comprising a case made of a metal of the valve group, the surface layer of the inner side of the case having a texturized anodised oxide film formed on the surface layer of the metal of the case, said surface layer carrying a thin or thick film integrated microcircuit and/or one or more discrete electronic components.
2. An electronic device substantially as hereinbefore described with reference to the accompanying drawings.
GB51546/77A 1977-12-12 1977-12-12 Electronic devices Expired GB1591895A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB51546/77A GB1591895A (en) 1977-12-12 1977-12-12 Electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB51546/77A GB1591895A (en) 1977-12-12 1977-12-12 Electronic devices

Publications (1)

Publication Number Publication Date
GB1591895A true GB1591895A (en) 1981-07-01

Family

ID=10460439

Family Applications (1)

Application Number Title Priority Date Filing Date
GB51546/77A Expired GB1591895A (en) 1977-12-12 1977-12-12 Electronic devices

Country Status (1)

Country Link
GB (1) GB1591895A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2133934A (en) * 1983-01-17 1984-08-01 Plessey Co Plc Improvements relating to thick film circuits
GB2167906A (en) * 1984-11-23 1986-06-04 Gec Avionics Rack mounted circuit module
GB2172437A (en) * 1985-03-16 1986-09-17 Marconi Electronic Devices Printed circuits
GB2193600A (en) * 1986-07-11 1988-02-10 Godfrey James Wright Circuit component, and optical instrument incorporating the same
GB2206451A (en) * 1987-04-09 1989-01-05 Reginald John Glass Substrates for circuit panels

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2133934A (en) * 1983-01-17 1984-08-01 Plessey Co Plc Improvements relating to thick film circuits
GB2167906A (en) * 1984-11-23 1986-06-04 Gec Avionics Rack mounted circuit module
GB2172437A (en) * 1985-03-16 1986-09-17 Marconi Electronic Devices Printed circuits
EP0203680A2 (en) * 1985-03-16 1986-12-03 Marconi Electronic Devices Limited Electrical device including a printed circuit
EP0203680A3 (en) * 1985-03-16 1987-09-02 Marconi Electronic Devices Limited Electrical device including a printed circuit
GB2193600A (en) * 1986-07-11 1988-02-10 Godfrey James Wright Circuit component, and optical instrument incorporating the same
GB2193600B (en) * 1986-07-11 1990-08-15 Godfrey James Wright Circuit component, and optical instrument incorporating the same
GB2206451A (en) * 1987-04-09 1989-01-05 Reginald John Glass Substrates for circuit panels

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PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee