GB1585854A - Solid electrolytic capacitors - Google Patents
Solid electrolytic capacitors Download PDFInfo
- Publication number
- GB1585854A GB1585854A GB1215178A GB1215178A GB1585854A GB 1585854 A GB1585854 A GB 1585854A GB 1215178 A GB1215178 A GB 1215178A GB 1215178 A GB1215178 A GB 1215178A GB 1585854 A GB1585854 A GB 1585854A
- Authority
- GB
- United Kingdom
- Prior art keywords
- housing
- capacitor
- synthetic resin
- solder
- connecting wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 title claims description 45
- 239000007787 solid Substances 0.000 title claims description 12
- 229920003002 synthetic resin Polymers 0.000 claims description 17
- 239000000057 synthetic resin Substances 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 12
- 239000004411 aluminium Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 238000010292 electrical insulation Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 6
- 239000003792 electrolyte Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- -1 for example Inorganic materials 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Connection Of Batteries Or Terminals (AREA)
Description
(54) IMPROVEMENTS IN OR RELATING TO SOLID
ELECTROLYTIC CAPACITORS
(71) We, SEMENS AKTIENGESELLSCHAFT, a German Company of Berlin and Munich,
German Federal Republic, do hereby declare the invention, for which we pray that a patent may be granted to us, and the method by which it is to be performed, to be particularly described in and by the following statement:- The present invention relates to solid electrolytic capacitors in which the capacitor body is installed in a housing having a solderable connecting wire led through the base thereof to which the cathode contact of the capacitor body is soldered.
Solid electrolytic capacitors have a capacitor body comprising a sintered anode body made of a valve metal such as, for example, tantalum, on which an oxide layer which serves as the capacitor dielectric is applied by anodic oxidation. A layer of semiconducting electrolyte consisting, for example, of manganese dioxide deposited by
pyrolytic decomposition on the sintered anode body, serves as the capacitor cathode.
A graphite layer is provided on the manganese dioxide layer and is itself covered by a solder
able coating such as, for example, a layer
of a conductive silver lacquer, preferably
serves as a cathodic current supply contact.
Capacitor bodies of this kind are generally provided with a synthetic resin sheathing, or are installed in a housing made, for example, of metal or glass.
U.S. Patent Specification No. 3,337,429 discloses a solid electrolytic capacitor which
is secured in a metal housing by means of a soft solder. The housing consists of a softsolderable material and has a connecting wire passing through the base of and soldered to the housing. Such housings are relatively expensive and usually require an appropriate surface treatment to protect them from
corrosion.
It is an object of the present invention to provide a solid electrolytic capacitor comprising a housing which is not soft-solderable, in which the capacitor body is installed by means of soft-soldering and which is cheap to produce.
According to the invention, there is provided a solid electrolytic capacitor comprising a capacitor body installed in a housing made of a material which is not soft-solderable and through the base of which there passes a connecting wire, the inner end of which is soldered to a cathode contact of said capacitor body, said connecting wire being rivetted to the base of said housing.
The housing may consist of aluminium or an aluminium alloy or of a synthetic resin material. On the anode side, the housing is advantageously sealed with a hardened cast synthetic resin mass.
The cathode contact of the capacitor body is preferably soldered to the connecting wire without the addition of soft solder.
The invention will now be further described with reference to the drawing, which is a side-sectional view of a solid electrolytic capacitor according to the invention.
The capacitor illustrated comprises a capacitor body 1 installed in a housing 3.
The capacitor body 1 is formed from a sintered tantalum anode body, having thereon, in sequence, a thin tantalum pentoxide layer serving as di-electric, a manganese dioxide layer serving as electrolyte, and a metallised graphite layer forming the cathode contact. The individual parts of the capacitor body 1 are not shown in the drawing, for the sake of clarity.
In the completed capacitor, the electrolyte acts as cathode and is connected via the metallised graphite contact layer to a housing 3, which consists of aluminium, by means of soft solder 2 at a soldering joint 4 formed by the terminal of a cathode connecting wire 5 which is led through the base of the aluminium housing 3. As illustrated, the connecting wire 5 is rivetted to the aluminium housing 3. The cathode connecting wire 5 consists of a soft-solderable material such as, for example, copper or tinned copper.
The anode body is provided with an anode connecting wire 6 in the form of a tinned nickel wire which passes out of the open end of the housing remote from the base.
In order to install the tantalum-sintered body 1 on the housing, the requisite amount of a soft solder 2 is introduced into the housing 3 and is liquefied by heating.
Alternatively, solder 2 which is already in the liquid form, can also be introduced into the housing 3. The capacitor body 1 is then immersed in the solder 2. On cooling the, solder 2 solidifies and in this way produces the necessary electrical connection of the cathode connecting wire 5 to the metallised graphite contact layer on the body 1.
After the solidification of the soft solder, the housing 3 is filled with a casting resin 7 (e.g. an epoxy resin).
The aluminium housing 3 can additionally be provided with an external synthetic resin sheathing 8 which serves for the electrical insulation of the capacitor, for example, when it is installed in a printed circuit. Such a sheathing is not of course required when the body is installed in a synthetic resin housing. When the capacitor body is installed in a synthetic resin housing, any synthetic resin material can be used which does not decompose at the soldering temperature.
WHAT WE CLAIM IS:
1. A solid electrolytic capacitor- com- prising a capacitor body installed in a housing made of a material which is not soft-solderable and through the base of which housing there passes a connecting wire the inner end of which is soldered to a cathode contact of said capacitor body, said connecting wire being rivetted to the base of said housing.
2. A capacitor as claimed in Claim 1, wherein said housing consists of aluminium or an aluminium alloy.
3. A capacitor as claimed in Claim 1, wherein said housing consists of a synthetic resin material.
4. A capacitor as claimed in any one of the preceding Claims, wherein said housing is sealed with a hardened cast synthetic resin mass at its end remote from the base.
5. A capacitor as claimed in Claim 1 or
Claim 2, wherein said housing is sealed by means of a sheathing of synthetic resin material.
6. A capacitor as claimed in any one of the preceding Claims, wherein said cathode contact is soldered to said connecting wire without the use of soft solder.
7. A solid electrolytic capacitor substantially as hereinbefore described with reference to and as shown in the drawing.
**WARNING** end of DESC field may overlap start of CLMS **.
Claims (7)
1. A solid electrolytic capacitor- com- prising a capacitor body installed in a housing made of a material which is not soft-solderable and through the base of which housing there passes a connecting wire the inner end of which is soldered to a cathode contact of said capacitor body, said connecting wire being rivetted to the base of said housing.
2. A capacitor as claimed in Claim 1, wherein said housing consists of aluminium or an aluminium alloy.
3. A capacitor as claimed in Claim 1, wherein said housing consists of a synthetic resin material.
4. A capacitor as claimed in any one of the preceding Claims, wherein said housing is sealed with a hardened cast synthetic resin mass at its end remote from the base.
5. A capacitor as claimed in Claim 1 or
Claim 2, wherein said housing is sealed by means of a sheathing of synthetic resin material.
6. A capacitor as claimed in any one of the preceding Claims, wherein said cathode contact is soldered to said connecting wire without the use of soft solder.
7. A solid electrolytic capacitor substantially as hereinbefore described with reference to and as shown in the drawing.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19772725533 DE2725533A1 (en) | 1977-06-06 | 1977-06-06 | SOLID ELECTROLYTE CAPACITOR |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1585854A true GB1585854A (en) | 1981-03-11 |
Family
ID=6010870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1215178A Expired GB1585854A (en) | 1977-06-06 | 1978-03-29 | Solid electrolytic capacitors |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS543262A (en) |
| BR (1) | BR7803583A (en) |
| DE (1) | DE2725533A1 (en) |
| FR (1) | FR2394163A1 (en) |
| GB (1) | GB1585854A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59179523U (en) * | 1983-05-20 | 1984-11-30 | 小松ゼノア株式会社 | brush cutter |
| CA1289208C (en) * | 1987-08-05 | 1991-09-17 | Hironosuke Ikeda | Aluminum solid electrolytic capacitor and manufacturing method thereof |
| DE4114756C2 (en) * | 1991-05-06 | 1994-11-24 | Reiner Hoehne | Process for the production of wet electrolytic capacitors, in particular in chip construction |
-
1977
- 1977-06-06 DE DE19772725533 patent/DE2725533A1/en not_active Ceased
-
1978
- 1978-03-29 GB GB1215178A patent/GB1585854A/en not_active Expired
- 1978-06-01 FR FR787816424A patent/FR2394163A1/en active Granted
- 1978-06-05 BR BR7803583A patent/BR7803583A/en unknown
- 1978-06-06 JP JP6822778A patent/JPS543262A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2725533A1 (en) | 1978-12-07 |
| BR7803583A (en) | 1979-02-20 |
| FR2394163A1 (en) | 1979-01-05 |
| FR2394163B1 (en) | 1983-02-18 |
| JPS543262A (en) | 1979-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |