GB1581974A - Epoxy resin composition - Google Patents
Epoxy resin composition Download PDFInfo
- Publication number
- GB1581974A GB1581974A GB18958/78A GB1895878A GB1581974A GB 1581974 A GB1581974 A GB 1581974A GB 18958/78 A GB18958/78 A GB 18958/78A GB 1895878 A GB1895878 A GB 1895878A GB 1581974 A GB1581974 A GB 1581974A
- Authority
- GB
- United Kingdom
- Prior art keywords
- phenol
- weight
- composition
- polymer
- naphthol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000203 mixture Substances 0.000 title claims description 127
- 239000003822 epoxy resin Substances 0.000 title claims description 46
- 229920000647 polyepoxide Polymers 0.000 title claims description 46
- 229920000642 polymer Polymers 0.000 claims description 71
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 63
- 150000001875 compounds Chemical class 0.000 claims description 54
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims description 43
- 239000003795 chemical substances by application Substances 0.000 claims description 42
- 125000003118 aryl group Chemical group 0.000 claims description 39
- 238000012360 testing method Methods 0.000 claims description 36
- -1 polyphenol compounds Chemical class 0.000 claims description 33
- 229930195735 unsaturated hydrocarbon Natural products 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 26
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 25
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 22
- 150000002430 hydrocarbons Chemical class 0.000 claims description 21
- 229930195733 hydrocarbon Natural products 0.000 claims description 20
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 125000004432 carbon atom Chemical group C* 0.000 claims description 18
- 229920000768 polyamine Polymers 0.000 claims description 17
- 239000002253 acid Substances 0.000 claims description 15
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 claims description 14
- 239000003513 alkali Substances 0.000 claims description 13
- 125000001931 aliphatic group Chemical group 0.000 claims description 12
- 238000010538 cationic polymerization reaction Methods 0.000 claims description 12
- 238000004821 distillation Methods 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 12
- 239000003208 petroleum Substances 0.000 claims description 12
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical class CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 claims description 11
- 239000004215 Carbon black (E152) Substances 0.000 claims description 11
- 239000002685 polymerization catalyst Substances 0.000 claims description 11
- 150000003839 salts Chemical class 0.000 claims description 11
- 238000005336 cracking Methods 0.000 claims description 10
- 239000007921 spray Substances 0.000 claims description 10
- 238000009835 boiling Methods 0.000 claims description 8
- 150000002170 ethers Chemical class 0.000 claims description 8
- 238000002407 reforming Methods 0.000 claims description 8
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 7
- 229930003836 cresol Natural products 0.000 claims description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 7
- 235000013824 polyphenols Nutrition 0.000 claims description 7
- 229910001209 Low-carbon steel Inorganic materials 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- MMSLOZQEMPDGPI-UHFFFAOYSA-N p-Mentha-1,3,5,8-tetraene Chemical class CC(=C)C1=CC=C(C)C=C1 MMSLOZQEMPDGPI-UHFFFAOYSA-N 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- CYEJMVLDXAUOPN-UHFFFAOYSA-N 2-dodecylphenol Chemical compound CCCCCCCCCCCCC1=CC=CC=C1O CYEJMVLDXAUOPN-UHFFFAOYSA-N 0.000 claims description 3
- CRBJBYGJVIBWIY-UHFFFAOYSA-N 2-isopropylphenol Chemical compound CC(C)C1=CC=CC=C1O CRBJBYGJVIBWIY-UHFFFAOYSA-N 0.000 claims description 3
- DUIOKRXOKLLURE-UHFFFAOYSA-N 2-octylphenol Chemical compound CCCCCCCCC1=CC=CC=C1O DUIOKRXOKLLURE-UHFFFAOYSA-N 0.000 claims description 3
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical class CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 claims description 3
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 3
- 230000000379 polymerizing effect Effects 0.000 claims description 3
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000004018 acid anhydride group Chemical group 0.000 claims description 2
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 125000001624 naphthyl group Chemical group 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 2
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 claims description 2
- 125000001302 tertiary amino group Chemical group 0.000 claims description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 claims 1
- 230000008859 change Effects 0.000 description 45
- 238000006116 polymerization reaction Methods 0.000 description 40
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 30
- 239000000047 product Substances 0.000 description 22
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 21
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 17
- 239000011269 tar Substances 0.000 description 17
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 13
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 11
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 11
- 239000002904 solvent Substances 0.000 description 10
- 210000003918 fraction a Anatomy 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 229910015900 BF3 Inorganic materials 0.000 description 8
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 8
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 239000000454 talc Substances 0.000 description 8
- 229910052623 talc Inorganic materials 0.000 description 8
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 7
- 239000004952 Polyamide Substances 0.000 description 7
- 150000001412 amines Chemical class 0.000 description 7
- 229920002647 polyamide Polymers 0.000 description 7
- 229930195734 saturated hydrocarbon Natural products 0.000 description 7
- 239000008096 xylene Substances 0.000 description 7
- FYGHSUNMUKGBRK-UHFFFAOYSA-N 1,2,3-trimethylbenzene Chemical compound CC1=CC=CC(C)=C1C FYGHSUNMUKGBRK-UHFFFAOYSA-N 0.000 description 6
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 6
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 6
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 239000004615 ingredient Substances 0.000 description 6
- 239000003973 paint Substances 0.000 description 6
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 5
- LRTOHSLOFCWHRF-UHFFFAOYSA-N 1-methyl-1h-indene Chemical compound C1=CC=C2C(C)C=CC2=C1 LRTOHSLOFCWHRF-UHFFFAOYSA-N 0.000 description 5
- OGMSGZZPTQNTIK-UHFFFAOYSA-N 1-methyl-2-prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC=C1C OGMSGZZPTQNTIK-UHFFFAOYSA-N 0.000 description 5
- 229910003556 H2 SO4 Inorganic materials 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 150000002989 phenols Chemical class 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- QNLZIZAQLLYXTC-UHFFFAOYSA-N 1,2-dimethylnaphthalene Chemical compound C1=CC=CC2=C(C)C(C)=CC=C21 QNLZIZAQLLYXTC-UHFFFAOYSA-N 0.000 description 4
- FIPKSKMDTAQBDJ-UHFFFAOYSA-N 1-methyl-2,3-dihydro-1h-indene Chemical compound C1=CC=C2C(C)CCC2=C1 FIPKSKMDTAQBDJ-UHFFFAOYSA-N 0.000 description 4
- XXTQHVKTTBLFRI-UHFFFAOYSA-N 1-methyl-3-prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC(C)=C1 XXTQHVKTTBLFRI-UHFFFAOYSA-N 0.000 description 4
- QPUYECUOLPXSFR-UHFFFAOYSA-N 1-methylnaphthalene Chemical compound C1=CC=C2C(C)=CC=CC2=C1 QPUYECUOLPXSFR-UHFFFAOYSA-N 0.000 description 4
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 4
- MMSCEAYNVNXXGA-UHFFFAOYSA-N C1(=CC=CC=C1)O.C1(=CC=CC=C1)O.C1(=CC=CC2=CC=CC=C12)O.C1(=CC=CC=C1)O Chemical compound C1(=CC=CC=C1)O.C1(=CC=CC=C1)O.C1(=CC=CC2=CC=CC=C12)O.C1(=CC=CC=C1)O MMSCEAYNVNXXGA-UHFFFAOYSA-N 0.000 description 4
- 239000001856 Ethyl cellulose Substances 0.000 description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 4
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 4
- 238000002835 absorbance Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 4
- 150000001993 dienes Chemical class 0.000 description 4
- 239000003085 diluting agent Substances 0.000 description 4
- 235000019325 ethyl cellulose Nutrition 0.000 description 4
- 229920001249 ethyl cellulose Polymers 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- PQNFLJBBNBOBRQ-UHFFFAOYSA-N indane Chemical compound C1=CC=C2CCCC2=C1 PQNFLJBBNBOBRQ-UHFFFAOYSA-N 0.000 description 4
- 230000007935 neutral effect Effects 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- ODLMAHJVESYWTB-UHFFFAOYSA-N propylbenzene Chemical compound CCCC1=CC=CC=C1 ODLMAHJVESYWTB-UHFFFAOYSA-N 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 4
- 235000010215 titanium dioxide Nutrition 0.000 description 4
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 3
- 238000005727 Friedel-Crafts reaction Methods 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 150000005205 dihydroxybenzenes Chemical class 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000004780 naphthols Chemical class 0.000 description 3
- RNVCVTLRINQCPJ-UHFFFAOYSA-N o-toluidine Chemical compound CC1=CC=CC=C1N RNVCVTLRINQCPJ-UHFFFAOYSA-N 0.000 description 3
- 238000005120 petroleum cracking Methods 0.000 description 3
- 238000004376 petroleum reforming Methods 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- 235000011149 sulphuric acid Nutrition 0.000 description 3
- 229960001124 trientine Drugs 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- DMYOHQBLOZMDLP-UHFFFAOYSA-N 1-[2-(2-hydroxy-3-piperidin-1-ylpropoxy)phenyl]-3-phenylpropan-1-one Chemical compound C1CCCCN1CC(O)COC1=CC=CC=C1C(=O)CCC1=CC=CC=C1 DMYOHQBLOZMDLP-UHFFFAOYSA-N 0.000 description 2
- HYFLWBNQFMXCPA-UHFFFAOYSA-N 1-ethyl-2-methylbenzene Chemical compound CCC1=CC=CC=C1C HYFLWBNQFMXCPA-UHFFFAOYSA-N 0.000 description 2
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- NGFPWHGISWUQOI-UHFFFAOYSA-N 2-sec-butylphenol Chemical compound CCC(C)C1=CC=CC=C1O NGFPWHGISWUQOI-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- KZMGYPLQYOPHEL-UHFFFAOYSA-N Boron trifluoride etherate Chemical compound FB(F)F.CCOCC KZMGYPLQYOPHEL-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000013032 Hydrocarbon resin Substances 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical class CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 229920001079 Thiokol (polymer) Polymers 0.000 description 2
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000011088 calibration curve Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000011280 coal tar Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 2
- 229920006270 hydrocarbon resin Polymers 0.000 description 2
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- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000006297 carbonyl amino group Chemical group [H]N([*:2])C([*:1])=O 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 231100000315 carcinogenic Toxicity 0.000 description 1
- 238000004523 catalytic cracking Methods 0.000 description 1
- 239000003729 cation exchange resin Chemical class 0.000 description 1
- 229940023913 cation exchange resins Drugs 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- ZLFVRXUOSPRRKQ-UHFFFAOYSA-N chembl2138372 Chemical compound [O-][N+](=O)C1=CC(C)=CC=C1N=NC1=C(O)C=CC2=CC=CC=C12 ZLFVRXUOSPRRKQ-UHFFFAOYSA-N 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011300 coal pitch Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 239000010779 crude oil Substances 0.000 description 1
- 229910001610 cryolite Inorganic materials 0.000 description 1
- BOTLEXFFFSMRLQ-UHFFFAOYSA-N cyclopentyloxycyclopentane Chemical compound C1CCCC1OC1CCCC1 BOTLEXFFFSMRLQ-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- BQQUFAMSJAKLNB-UHFFFAOYSA-N dicyclopentadiene diepoxide Chemical compound C12C(C3OC33)CC3C2CC2C1O2 BQQUFAMSJAKLNB-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- PQZTVWVYCLIIJY-UHFFFAOYSA-N diethyl(propyl)amine Chemical compound CCCN(CC)CC PQZTVWVYCLIIJY-UHFFFAOYSA-N 0.000 description 1
- YNLAOSYQHBDIKW-UHFFFAOYSA-M diethylaluminium chloride Chemical compound CC[Al](Cl)CC YNLAOSYQHBDIKW-UHFFFAOYSA-M 0.000 description 1
- MGHPNCMVUAKAIE-UHFFFAOYSA-N diphenylmethanamine Chemical compound C=1C=CC=CC=1C(N)C1=CC=CC=C1 MGHPNCMVUAKAIE-UHFFFAOYSA-N 0.000 description 1
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- UAIZDWNSWGTKFZ-UHFFFAOYSA-L ethylaluminum(2+);dichloride Chemical compound CC[Al](Cl)Cl UAIZDWNSWGTKFZ-UHFFFAOYSA-L 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 210000002196 fr. b Anatomy 0.000 description 1
- 210000000540 fraction c Anatomy 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 231100000206 health hazard Toxicity 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- TYHUXFNCOGRXTK-UHFFFAOYSA-H hexabromorhenium Chemical compound Br[Re](Br)(Br)(Br)(Br)Br TYHUXFNCOGRXTK-UHFFFAOYSA-H 0.000 description 1
- OQVJXQJWYQNWTI-UHFFFAOYSA-H hexabromotungsten Chemical compound Br[W](Br)(Br)(Br)(Br)Br OQVJXQJWYQNWTI-UHFFFAOYSA-H 0.000 description 1
- GSGIQJBJGSKCDZ-UHFFFAOYSA-H hexachlororhenium Chemical compound Cl[Re](Cl)(Cl)(Cl)(Cl)Cl GSGIQJBJGSKCDZ-UHFFFAOYSA-H 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052976 metal sulfide Inorganic materials 0.000 description 1
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- GICWIDZXWJGTCI-UHFFFAOYSA-I molybdenum pentachloride Chemical compound Cl[Mo](Cl)(Cl)(Cl)Cl GICWIDZXWJGTCI-UHFFFAOYSA-I 0.000 description 1
- NBJFDNVXVFBQDX-UHFFFAOYSA-I molybdenum pentafluoride Chemical compound F[Mo](F)(F)(F)F NBJFDNVXVFBQDX-UHFFFAOYSA-I 0.000 description 1
- BAVYZALUXZFZLV-UHFFFAOYSA-N mono-methylamine Natural products NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N mono-n-propyl amine Natural products CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- QUSNBJAOOMFDIB-UHFFFAOYSA-N monoethyl amine Natural products CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- NRZWYNLTFLDQQX-UHFFFAOYSA-N p-tert-Amylphenol Chemical compound CCC(C)(C)C1=CC=C(O)C=C1 NRZWYNLTFLDQQX-UHFFFAOYSA-N 0.000 description 1
- BFXSYWWEMMKKRS-UHFFFAOYSA-I pentabromomolybdenum Chemical compound Br[Mo](Br)(Br)(Br)Br BFXSYWWEMMKKRS-UHFFFAOYSA-I 0.000 description 1
- QHIRVZBLPRTQQO-UHFFFAOYSA-I pentafluorotungsten Chemical compound F[W](F)(F)(F)F QHIRVZBLPRTQQO-UHFFFAOYSA-I 0.000 description 1
- VENBJVSTINLYEU-UHFFFAOYSA-N phenol;trifluoroborane Chemical compound FB(F)F.OC1=CC=CC=C1 VENBJVSTINLYEU-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000004230 steam cracking Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000004227 thermal cracking Methods 0.000 description 1
- LTSUHJWLSNQKIP-UHFFFAOYSA-J tin(iv) bromide Chemical compound Br[Sn](Br)(Br)Br LTSUHJWLSNQKIP-UHFFFAOYSA-J 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- UBZYKBZMAMTNKW-UHFFFAOYSA-J titanium tetrabromide Chemical compound Br[Ti](Br)(Br)Br UBZYKBZMAMTNKW-UHFFFAOYSA-J 0.000 description 1
- XROWMBWRMNHXMF-UHFFFAOYSA-J titanium tetrafluoride Chemical compound [F-].[F-].[F-].[F-].[Ti+4] XROWMBWRMNHXMF-UHFFFAOYSA-J 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- SMTFLSSUAHATMA-UHFFFAOYSA-K tripotassium;tribromide Chemical compound [K+].[K+].[K+].[Br-].[Br-].[Br-] SMTFLSSUAHATMA-UHFFFAOYSA-K 0.000 description 1
- AKROLTGTPNCGRL-UHFFFAOYSA-K tripotassium;trichloride Chemical compound [Cl-].[Cl-].[Cl-].[K+].[K+].[K+] AKROLTGTPNCGRL-UHFFFAOYSA-K 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- KPGXUAIFQMJJFB-UHFFFAOYSA-H tungsten hexachloride Chemical compound Cl[W](Cl)(Cl)(Cl)(Cl)Cl KPGXUAIFQMJJFB-UHFFFAOYSA-H 0.000 description 1
- NXHILIPIEUBEPD-UHFFFAOYSA-H tungsten hexafluoride Chemical compound F[W](F)(F)(F)(F)F NXHILIPIEUBEPD-UHFFFAOYSA-H 0.000 description 1
- UXVOMHPBSSIGNQ-UHFFFAOYSA-I tungsten(v) bromide Chemical compound Br[W](Br)(Br)(Br)Br UXVOMHPBSSIGNQ-UHFFFAOYSA-I 0.000 description 1
- WIDQNNDDTXUPAN-UHFFFAOYSA-I tungsten(v) chloride Chemical compound Cl[W](Cl)(Cl)(Cl)Cl WIDQNNDDTXUPAN-UHFFFAOYSA-I 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L57/00—Compositions of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C08L57/02—Copolymers of mineral oil hydrocarbons
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
(54) EPOXY RESIN COMPOSITION
(71) We, MITSUI PETROCHEMICAL INDUSTRIES, LTD., a Japanese
Body Corporation, of 2-5, 3-chome, Kasumigaseki, Chiyoda-ku, Tokyo, Japan, do hereby declare the invention, for which we pray that a patent may be granted to us, and the method by which it is to be performed, to be particularly described in and by the following statement:- This invention relates to a novel epoxy resin composition, and more specifically to an epoxy resin composition especially useful in the field of paints which comprises a combination of a phenol- or naphthol-modified aromatic hydrocarbon resin and a polyepoxy compound.
Epoxy resin compositions have found extensive applications in the fields of paints, adhesives, molding materials, etc. In particular, tar epoxy resin compositions comprising a polyepoxy compound, tar, a curing agent and optional additives such as pigments, fillers, reactive diluents, flexibilizers or modifying resins are generally inexpensive and have relatively good adhesion, chemical resistance and flexibility.
-Hence, they find a wide range of applications as waterproof coatings of buildings and surface protective paints for metallic containers, various industrial apparatus and appliances, steel pipes, ships, seaside facilities and structural materials; as adhesives for floors, bricks, tiles; as road repairing materials for repairing cracks of highways; and as floor coverings for slip prevention, waterproofing, etc.
However, these tar epoxy resin compositions have one or more defects. For example, because the tar components present in a concentration of about 10 to 50 /O by weight such as coal tar, pitch and petroleum asphalt contain carcinogenic substances such as benzopyrene, they cause a problem of health hazard at the time of preparation and application of these compositions. Or they tend to bleed out from the compositions because their compatibility with polyepoxy compounds is generally not good. Since they are black in color, pale-colored coatings cannot be obtained, and their use is limited.
In an attempt to eliminate these defects, various investigations have been made for techniques of replacing the tar components of the tar epoxy resin compositions by substances which have characteristics comparable to, or better than, those of the conventional tar components, and some of the results obtained have been reported, and applied for patent.
For example, Japanese Patent Publication No. 23718/75 suggests the use of the by-product cresol distillation residue obtained in the synthesis of cresol as a substitute for the tar component of a tar epoxy resin composition composed mainly of an epoxy resin, a curing agent and the tar component.
The distillation residue (tar) formed as a by-product in the synthesis of cresol suggested in the abcve-cited Japanese Patent Publication has good compatibility with the remaining ingredients of the tar epoxy resin compositions such as epoxy resins.
However, since the distillation residue is highly reactive with the polyepoxy compounds, tar epoxy resin compositions containing the distillation residue have the defect of reduced operability because of their short curing time, and give coatings having poor water resistance. Furthermore, because the distillation residue is not constant in quality and its composition may vary from lot to lot, a product of uniform quality is difficult to obtain. Another defect is that the residue itself is colored deep, and cannot be used in applications where light colors are required.
It is an object of this invention to provide an epoxy resin composition free from the aforesaid defects.
Another object of this invention is to provide an epoxy resin composition having a light color and being useful in various applications such as paints, adhesives and molding materials.
Still another object of this invention is to provide a light-colored epoxy resin composition especially suitable as a vehicle component of paints which give coated films having better water resistance, chemical resistance (e.g., resistances to salt water, solvents or acids) and strength than do conventional tar epoxy resin compositions.
Other objects and advantages of the present invention will become apparent from the following description.
According to this invention, there is provided an epoxy resin composition comprising
[A] a polymer having a hydroxyl content of 0.3 to 7 millimoles/g, said polymer being prepared by polymerizing a polymerizable material selected from
(a) a cationically polymerizable hydrocarbon-containing fraction having a boiling
point in the range of from 140 to 2800C obtained by the distillation of a
cracking or reforming product of a petroleum,
(b) a cationically polymerizable aromatic unsaturated hydrocarbon, and
(c) a mixture of (a) and (b) in the presence of a cationic polymerization catalyst and modifying the resulting polymer with a phenol or naphthol,
[B] a polyepoxy compound; and
[C] a curing agent.
One characteristic feature of this invention is to use a phenol- or naphthol-modified aromatic hydrocarbon polymer as one ingredient of an epoxy resin composition.
The modified aromatic hydrocarbon polymer will first be described in detail.
The aromatic hydrocarbon polymer in accordance with this invention can be produced by the cationic polymerization of the following basic polymerizable materials.
(a) Cationically polymerizable hydrocarbon-containing fraction having a boiling
range of 140 to 2800C obtained by the distillation of a cracking or reforming
product of a petroleum: In the present specification and appended claims the term "petroleum" denotes naphtha, gas oils, kerosene, or crude oils.
The term "fraction obtained by distilling the cracking or reforming product of a petroleum" denotes a hydrocarbon-containing fraction which is formed as a by-product in the thermal or catalytic cracking, such as steam cracking, vapor phase cracking or sand cracking or reforming, such as hydroreforming, of the petroleum defined above.
As the polymerizable material (a) in accordance with this invention, a cationically polymerizable unsaturated hydrocarbon-containing fraction which has a boiling range of 140"C to 2800C, preferably 1400C to 2400C, more preferably 1600C to 2000C, is specifically used.
The petroleum cracking or reforming fraction having a boiling range of from 1400C to 2800C contains cationically polymerizable hydrocarbons and non-polymerizable hydrocarbons, most of which contain at least 8 carbon atoms. The hydrocarbons with at least 8 carbon atoms are contained generally in an amount of at least 90% by weight based on the weight of the fraction. Specifically, the composition of the petroleum fraction varies over a broad range according, for example, to the type of the petroleum cracked or reformed and the cracking or reforming conditions. According to the present invention, a fraction containing at least 20% by weight, preferably 30 to 75% by weight, more preferably 35 to 60% by weight, based on the weight of the fraction, of cationically polymerizable hydrocarbon is advantageously used.
Hydrocarbons having at least 8 carbon atoms contained in the fraction are almost all aromatic hydrocarbons, the major proportion of which consists of aromatic hydrocarbons containing 9 or 10 carbon atoms. The total amount of such aromatic hydrocarbons with 9 and 10 carbon atoms is 50 to 95% by weight, usually 60 to 95% by weight, based on the weight of the fraction. The fraction contains some amounts of aromatic hydrocarbons containing 8 carbon atoms and more than 10 carbon atoms.
Typical examples of the cationically polymerizable hydrocarbons contained in the fraction are cationically polymerizable aromatic unsaturated hydrocarbons containing 8 to 12 carbon atoms, such as styrene, a- or P-methyl-styrene, o-, m- or p-vinyltoluene, isopropenyltoluene, indene, methylindene, divinylbenzene, and vinylnaphthalene.
In an especially preferred embodiment, the fraction contains at least 20% by weight in total of such cationically polymerizable unsaturated aromatic hydrocarbons.
The term "cationically polymerizable aromatic unsaturated hydrocarbons", as used herein, denotes a hydrocarbon containing at least one aromatic ring and at least one cationically polymerizable unsaturated bond.
Other typical cationically polymerizable non-aromatic hydrocarbons include olefins and/or diolefins with 8 to 12 carbon atoms such as dicyclopentadiene or methyldicyclopentadiene which are present in minor quantities.
On the other hand, typical examples of the non-polymerizable hydrocarbons contained in the fraction include CR to C12 aromatic hydrocarbons such as xylene, ethylbenzene, cumene, ethyltoluene, n-propylbenzene, trimethylbenzene, indane, methylindane, naphthalene, methylnaphthalene, and dimethylnaphthalene. Other examples of the non-polymerizable hydrocarbons are Cs to C,2 paraffins and/or naphthenes which are present in small amounts.
As stated hereinabove, the composition of the petroleum cracking or reforming fraction used in this invention changes over a wide range according, for example, to the petroleum cracked or reformed, and the cracking or reforming conditions, and cannot be definitely determined. Generally, the fraction preferably has a bromine value of 50 to 90. Fractions having the following compositions are especially preferably used. It should be noted however that the present invention is not limited to the following exemplification.
Components Amounts in percent buy weight
Cationically polymerizable aromatic
unsaturated hydrocarbons 25 to 75, preferably 30 to 60
Olefins 0 to 15, preferably 5 to 10
Diolefins 0 to 5, preferably 1 to 3
Non-polymerizable aromatic saturated
hydrocarbons 15 to 50, preferably 20 to 40
Paraffins and naphthenes 5 to 25, preferably 10 to 25
Examples of the cationically polymerizable aromatic unsaturated hydrocarbons given iii the above table are C5 to Cil cationically polymerizable aromatic unsaturated hydrocarbons such as styrene, a- or jB-methylstyrene, o-, m- or p-vinyltoluene, indene, and methylindene.
Usually cationically polymerizable aromatic unsaturated hydrocarbons having 9 to 10 carbon atoms such as a- or,P-methylstyrene, o-, m-, or p-vinyltoluene, indene and methylindene usually account for 50 to 95% by weight, usually 60 to 95% by weight, based on the cationically polymerizable aromatic unsaturated hydrocarbons.
Usually, C8 cationically polymerizable aromatic unsaturated hydrocarbons such as styrene, and Cll~ 12 cationically polymerizable aromatic unsaturated hydrocarbons are contained in an amount of 1 to 30% by weight, especially 2 to 20% by weight, and 1 to 40% by weight, especially 2 to 30% by weight, respectively.
Examples of the olefins and diolefins given in the above table are C8~12 aliphatic monoolefins and diolefins such as dicyclopentadiene or methyldicyclopentadiene. Typical examples of the non-polymerizable aromatic saturated hydrocarbons given in the table include C812 aromatic saturated hydrocarbons such as xylene, ethylbenzene, cumene, ethyltoluene, n-propylbenzene, trimethylbenzene, indane, methylindane, naphthalene, methylnaphthalene and dimethylnaphthalene.
The paraffins and naphthenes contained in the fraction include paraffins and naphthenes having 9 to 12 carbon atoms.
The cationically polymerizable aromatic unsaturated hydrocarbon component in be fraction typically consists essentially of the following components.
Components Amount in % by weight (*) Vinvltoluene Total 30 to 85, preferably 35 to 70 Styrene a-Methylstyrene Methylindene J p-Methylstyrene
(*) The amounts are based on the total weight of the cationically polymerizable
aromatic unsaturated hydrocarbons.
The petroleum cracking or reforming fraction can be used either directly, or if desired, or as required, it may be purified prior to use by, for example, distilling it to separate the non-polymerizable hydrocarbons at least partly and to increase the content of the cationically polymerizable aromatic unsaturated hydrocarbons. In particular, a fraction having a boiling range of 140 to 240"C, most preferably 160 to 2000 C, is preferred.
(b) Cationically polymerizable aromatic unsaturated hydrocarbon: The fraction described in (a) above contains two or more cationically polymerizable aromatic unsaturated hydrocarbons in the mixed state. In the present invention, however, the aromatic unsaturated hydrocarbons can be used also in the isolated state.
Cationically polymerizable aromatic unsaturated hydrocarbons containing 8 to 12 carbon atoms, preferably 8 to 10 carbqn atoms, are especially suitable in the present invention. Typical examples of these aromatic unsaturated hydrocarbons include styrene, a- or ,3-methylstyrene, o-, m- or p-vinyltoluene, o-, m- or p-isopropenyltoluene, indene, o-, m- or p-ethylstyrene, 3-methylindene and vinyl naphthalene. Of these, styrene, la- or ,8-methylstyrene, o-, m- or p-vinyltoluene, and o-, m- or p-isopropenyltoluene are preferred. They can be used either alone or as a mixture of two or more.
(c) Mixture of ingredients (a) and (b) :- In a mixture of ingredients (a) and (b), the mixing proportions are not strictly limited, and can be varied widely according to the types of these ingredients (a) and (b), etc. Generally, the recommendable weight ratio of ingredient (a) to (b) is from 10:90 to 90:10, especially from 20:80 to 80:20.
Of the aforesaid polymerizable materials (a), (b) and (c), the cationically polymerizable aromatic unsaturated hydrocarbon (b) is especially preferred.
The polymerizable material described hereinabove is polymerized in accordance with this invention in the presence of a cationic polymerization catalyst.
The polymerization can be performed by known methods which are frequently used to produce ordinary hydrocarbon resins.
The term "cationic polymerization catalyst", as used in the present application, denotes a catalyst having the ability to form a cation in the polymerization system, and includes, for example, protonic acid, Friedel-Crafts catalysts (Lewis acids), halogens, metal oxides, metal sulfides, halogenated organometallic compounds, and cation exchange resins.
Typical examples of cationic polymerization catalysts used in this invention include
Friedel-Crafts catalysts such as boron trifluoride, complexes of boron trifluoride with alcohols, phenols, ethers or organic carboxylic acids (e.g., boron trifluoride phenolate and boron trifluoride etherate), aluminum trichloride, aluminum tribromide, tin tetrachloride, tin tetrabromide, titanium tetrafluoride, titanium tetrachloride, titanium tetrabromide, potassium trifluoride, potassium trichloride, potassium tribromide, molybdenum pentafluoride, molybdenum pentachloride, molybdenum pentabromide, tungsten hexafluoride, tungsten hexachloride, tungsten hexabromide, tungsten pentafluoride, tungsten pentachloride, tungsten pentabromide, rhenium hexachloride, and rhenium hexabromide; and organoaluminum compounds such as diethylaluminum chloride and ethylaluminum dichloride. They may be used either singly or, if required, as a mixture of two or more.
Of these cationic polymerization catalysts, the Friedel-Crafts catalysts, especially boron trifluoride, boron trifluoride complexes, aluminum trichloride, tin tetrachloride and titanium tetrachloride, are preferred. The boron trifluoride, boron trifluoride com
plexes, and aluminum trichloride are especially preferred. The amount of the catalyst is
not particularly restricted. However, its suitable amount is usually 0.1 to 25% by
weight, preferably 0.2 to 20% by weight, based on the weight of the polymerizable
material.
The polymerization can be performed in the absence of solvent, but usually it is
advantageous to perform it in the presence of a solvent. Suitable polymerization
solvents are, for example, aliphatic saturated hydrocarbons such as pentane, hexane,
heptane and kerosene, and aromatic saturated hydrocarbons such as benzene, toluene
and xylene. When these saturated hydrocarbons are contained in the polymerizable
material, they can be used as polymerization solvents.
The polymerization can be carried out usually at a temperature ranging from 0 to 2000 C, preferably 10 to 1500C. Atmospheric pressure suffices as the polymerization
pressure. If desired, elevated on reduced pressures in the range of 0.1 to 50 atmos .pheres can be employed. Under these polymerization conditions, the polymerization
can be completed usually within 10 minutes to 5 hours.
After the polymerization, the catalyst can be removed by such a treatment as
washing with an alkali aqueous solution or with water, and the unreacted hydrocarbons
or polymers with a low degree of polymerization can be removed by a suitable means
such as distillation. Advantageously, the distillation is carried out generally at a tem
perature of 150 to 2500C. and a pressure of 5 mmHg to 100 mmHg. As a result, hydro
carbon resins are obtained as distillation bottoms.
The most characteristic feature of the present invention is to use the aforesaid
aromatic hydrocarbon polymer as modified with a phenol or naphthol.
This modification can be achieved by introducing a phenol or naphthol into the polymerization reaction system of preparing the above aromatic hydrocarbon polymer at any stage of the polymerization process or into the resulting aromatic hydrocarbon polymer.
Introduction of a phenol or naphthol into the polymerization reaction system can
be performed at any desired stage of the polymerization, for example, by mixing the
phenol or naphthol with the polymerizable material before the initiation of the reaction;
by adding the phenol or naphthol to the polymerization reaction mass during the pro
ceeding of the polymerization; or by adding the phenol or naphthol to the reaction
mixture after the polymerization reaction but before removing the cation polymerization
catalyst, and continuing the reaction. Alternatively, the phenols or. naphthols can also
be introduced into the polymer by separating the resulting polymer from the poly-
merization system, adding the phenol or naphthol to the separated polymer, and
reacting them in the presence of the cationic polymerization catalyst.
It is especially preferred in this invention, however,- that the phenol or naphthol
be introduced into the polymerization reaction system before the initiation of the poly
merization reaction.
Any conventional compounds having at least one hydroxyl group directly bonded
to an aromatic ring can be used as the phenols or naphthols to modify the aromatic
hydrocarbon polymer. Compounds expressed by the formula
wherein Ar represents a benzene or naphthalene ring, R1 and R2, independently from each other, represent a hydrogen atom or an alkyl group, and n is an integer of 1 or 2, can be used advantageously.
In formula (I), the alkyl group may be linear or branched, and contain up to 20 carbon atoms, preferably up to 15 carbon atoms, more preferably up to 12 carbon atoms. Examples are methyl, ethyl, n- or iso-propyl, n-sec-, iso- or tert-butyl, n-pentyl, iso-amyl, n-hexyl, n-octyl, n-nonyl, and n-decyl groups. Specific examples of the phenol or naphthol that can be used in this invention include phenol, cresol (o-, m- or p-), xylenol (2,3-, 2,4-, 2,5-, 2,6-, 3,4- or 3,5-), isopropyl phenol, sec- or tert-butylphenol, p-tert-amyl phenol, octyl phenol, nonyl phenol, dodecyl phenol, naphthol (r, or iP-), dihydroxybenzenes (resorcinol, catechol and hydroquinone), and pyrogallol.
Among these, phenol, cresol (o-, m- or p-), xylenol (2,6- or 3,5-), isopropyl phenol, sec- or tert-butylphenol, octyl phenol, nonyl phenol, dodecyl phenol, naphthol (a- or ,B-), and dihydroxybenzenes (resorcinol, catechol and hydroquinone) are preferred.
Phenol, cresols and dihydroxybenzenes are especially preferred.
These phenols or naphthols can be used either alone or as a mixture of two or more of them.
The amount of the phenol or naphthol is not critical, and can be varied widely according to the characteristics required of the final modified polymer, for example.
Generally, the suitable amount of the phenol or naphthol is 5 to 100 parts by weight, preferably 6.5 to 70 parts by weight, most preferably 10 to 50 parts by weight, per 100 parts by weight of all the cationically polymerizable components of the polymerizable material. When the phenol or naphthol is to be added to the resulting polymer, its amount is desirably within the above-specified ranges per 100 parts by weight of the polymer.
As stated hereinabove, the phenol or naphthol can be introduced into the polymerization reaction system at any desired stage of the polymerization of the polymerizable material. For example, it may be mixed with the starting material before the initiation of polymerization, or to the reaction mixture during the polymerization reaction, or to the reaction mixture immediately after the polymerization reaction.
The reaction after mixing of the phenol or naphthol can be performed in the presence of a cationic polymerization catalyst under the same polymerization reaction conditions as used in the polymerization, and no special attention needs to be paid.
It is also possible to add the phenol or naphthol to an aromatic hydrocarbon polymer produced by the above polymerization reaction and then separated, and react them under the same conditions as the polymerization conditions in the reaction solvent and in the presence of the cationic polymerization catalyst.
Various properties of the resulting modified polymer, such as softening point, molecular weight, molecular weight distribution, melt viscosity, solubility and compatibility, can be varied widely by properly choosing the types of the polymerizable material and/or the phenol or naphthol, the polymerization conditions, etc.
In the modified polymer so produced, the aromatic hydrocarbon polymer formed by the polymerization of the polymerizable material is chemically modified by a phenol or naphthol, and the phenol is incorporated into the chain of the aromatic hydrocarbon polymer while partly retaining its hydroxyl groups, or partly through an ether linkage ascribable to the hydroxyl groups. Accordingly, the modified polymer of this invention can have a hydroxyl content of generally 0.3 to 7 millimoles/g, preferably 0.4 to 5.5 millimoles/g, more preferably 0.5 to 4 millimoles/g, according to the amount of the phenol or naphthol introduced.
The modified polymer can have a phenol or naphthol content of generally 3 to 50% by weight, preferably 4.5 to 50% by weight, more preferably 6 to 40% by weight, according to the amount of the phenol or naphthol introduced into the polymer.
The term "hydroxyl content", as used in the present specification and the appended claims, is defined as follows: The absorbances at 3550 cm-' (the characteristic absorption wave number of a phenolic hydroxyl group) of toluene solutions containing phenol in various predetermined concentrations are measured by using an infrared spectrophotometer DS-80/G (a standard cell, thickness 0.1 m) of Nippon Bunko Kogyo K.K., and a standard calibration curve is prepared by plotting the absorbances on the axis of ordinates and the phenol concentrations on the axis of abscissas. Separately, 0.3 g of a sample is dissolved in 10 ml of toluene, and the absorbance of the solution at 3550 cm-l is read.
The phenol concentration corresponding to the absorbance read from the standard calibration curve is determined, and defined as the hydroxyl content of the sample.
The "phenol or naphthol content" is obtained by determining the oxygen content of a sample by an element analyzer (type O-corder MO--10, a product of Yanagimoto Seisakusho), and multiplying the oxygen content (% by weight) by the quotient obtained by dividing the molecular weight of the phenol or naphthol used for modification by the number of hydroxyl groups present in the phenol or naphthol.
The modified polymer ranges from a liquid state at room temperature to a solid state with a softening point (by the ball-and-ring method in ASTM E 2858T) of not more than 200"C., preferably not more than 1800C.
The modified polymer can have a number average molecular weight of generally 200 to 3000, preferably 200 to 2000, most preferably 250 to 1500. Sometimes, the modified polymer has a Gardner color number of about 17, but generally it is available in a comparatively light color with a Gardner color number of less than about 10. It can be used advantageously in applications in which coloration is undesired.
According to this invention, the modified polymer is used to prepare a tar-epoxy resinous composition in conjunction with a polyepoxy compound and a curing agent.
The polyepoxy compound that can be used in the epoxy resin composition is a compound containing at least two epoxy groups per molecule. Both low-molecularweight and high-molecular-weight polyepoxy compounds containing at least two epoxy groups per molecule can be used. They may also be aliphatic, aromatic, or araliphatic, or may contain a heterocycle. Thus, any epoxy compounds ordinarily used in the conventional tar epoxy resin compositions are feasible in this invention.
The polyepoxy. compound can be freely selected from known compounds according to the purpose of use of the final epoxy resin composition or the characteristics required of the final composition. Specific examples are given below. It should be understood
however that the scope of the present invention is in no way limited by these examples.
(1) Polyglycidyl ethers of polyphenols: Diglycidyl ether of bisphenol A,
diglycidyl ether of bisphenol F,
tetraglycidyl ether of 1,1,2,2-tetrakis(4'-hydroxyphenyl )ethane,
diglycidyl ether of 2,2-bis(4-hydroxyphenyl)nonadenane,
diglycidyl ether of diphenyl ether,
diglycidyl ether of tetrachlorobisphenol A,
diglycidyl ether of tetrabromobisphenol A, and
diglycidyl ether of bisphenol-hexafluoroacetone.
(2) Polyglycidyl ethers of nuclearly hydrogenated products of polyphenol
compounds:
(2,2 - (4 - [3 - Chloro - 2 - (2,3 - epoxy propoxy)propoxyj - cyclohexyl)
propane)
(diglycidyl ether of hydrogenated bisphenol A)
("Epikote" (Trade Mark) 871, a product of Shell) (3) Polyglycidyl ethers of polyhydric phenols: Catechol diglycidyl ether,
resorcinol diglycidyl ether,
hydroquinone diglycidyl ether,
phloroglycin ditriglycidyl ether,
trihydroxy biphenyl triglycidyl ether,
tetraglycidoxy biphenyl,
methylphloroglycin triglycidyl ether,
tetraglycidyl ether of bis-resorcinol, and
tetraglycidyl ether of resorcinol ketone.
(4) Polyglycidyl ethers of polyhydric alcohols:- Ethyl glycol diglycidyl ether,
butanediol diglycidyl ether,
glycerin diglycidyl ether,
glycerin triglycidyl ether,
pentaerythritol diglycidyl ether,
pentaerythritol triglycidyl ether,
pentaerythritol tetraglycidyl ether,
sorbitol polyglycidyl ethers,
polyoxyalkylene glycol diglycidyl ethers, and
trimethylolpropane triglycidyl ether.
(5) Novolak type polyepoxy compounds: Polyglycidyl ether of phenol-formaldehyde novolak
(a=0-8, b=0-8, c=0-1) Polyglycidyl ether of o-cresol-formaldehyde novolak
(a=0-4, b=0-8) (6) Alicyclic polyepoxy compounds: Vinyl cyclohexane dioxide,
limonene dioxide,
dicyclopentadiene dioxide, 2,2-bis(3,4-epoxycyclohexyl )propane,
bis(2,3-epoxycyclopentyl ) ether, and
bisepoxy dicyclopentyl ether of ethylene glycol.
(7) Polyglycidyl esters of polycarboxylic acids or their condensates: Diglycidyl phthalate,
diglycidyl isophthalate,
diglycidyl tetrahydrophthalate,
diglycidyl ester of dimeric acid,
diglycidyl hexahydrophthalate, and
diglycidyl ester of a condensate of terephthalic acid (or isophthalic acid) and
ethylene glycol (polyester) having the following formula
(myl) (8) Polyglycidyl amine compounds:
(in which R is a hydrocarbon group with 1 to 25 carbon atoms, such as alkyl,
aryl, aralkyl or alkaryl)
[e.g. diglycidyl methyl amine, diglycidyl ethyl amine, diglycidyl propyl
amine, and diglycidyl aniline],
triglycidyl p-aminophenol,
triglycidyl isocyanurate, and
tetraglycidyl aminodiphenylmethane.
(9) Methyl epichlorohydrin-type polyepoxy compounds: Di(2-methyl)glycidyl ether of ethylene glycol,
di(2-methyl)glycidyl ether of bisphenol A,
di(2-methyl)glycidyl ether of bisphenol F,
di(2-methyl)glycidyl phthalate, and
di(2-methyl)glycidyl isophthalate,
Among these polyepoxy compounds, the polyglycidyl ethers of polyphenolic compounds and novolak-type polyepoxy compounds are used conveniently in the present invention. Above all, bisphenol A diglycidyl ether, and bisphenol F diglycidyl ether are preferred.
The epoxy equivalent and molecular weight of the polyepoxy compound that can be used in this invention are not critical, and can be varied widely according to the use and properties of the final polyepoxy resin composition. Generally, it has an epoxy equivalent of at most 5,000, preferably 43 to 3,500, more preferably 80 to 3,000, and a molecular weight of 86 to 20,000, preferably 130 to 10,000, most preferably 150 to 5,000. Those which are liquid or solid at room temperature can be used. Preferably, solid polyepoxy compounds are used as a solution in a suitable solvent.
Any curing agents which are generally known as curing agents for epoxy resins can be used in the polyepoxy resin composition provided by this invention. These curing agents are polyfunctional compounds containing at least two functional groups per molecule, such as primary, secondary or tertiary amino groups, acid anhydride groups, mercapto groups, or phenolic hydroxyl group. Typical examples are given below. It should be understood that the scope of the invention is in no way limited by these examples.
(1) Linear aliphatic primary polyamines
Diethylene triamine, triethylene tetramine, tetraethylene pentamine, dipropylene
diamine, and diethylaminopropylamine.
(2) Alicyclic primary polyamines
N-aminoethylpiperazine, methanediamine, 1,3-diaminocyclohexane, isophoronedi
amine, bis(4 - amino - 3 - methylcyclohexyl)methane, 3,9 - bis(3 - amino
propyl) - 2,4,8,10 - tetroxaspiro [5,5]undecane, and 1,3 - diaminocyclohexane.
(3) Modified aliphatic primary polyamines
(i) Amine epoxy resin adducts: Diethylene triamine-bisphenol A glycidyl ether adduct
(ii) Amine ethylene oxide or propylene oxide adducts: N,N'-bis (hydroxyethyl) diethylene triamine,
N,N'-bis (hydroxypropyl ) diethylene triamine, N- ( hydroxypropyl ) diethylenetriamine, N- (2-hydroxy-2,4,4-trimethylphenyl) diethylene triamine,
N- (2-hydroxyethyl ) diethylene triamine, and
N,N,N',N'-tetrahydroxypropylene diamine.
(iii) Cyanoethylated polyamines :
Cyanoethylated diethylene triamine,
cyanoethylated triethylene tetramine, and
cyanoethylated tetraethylene pentamine.
(iv) Ketone blocked polyamines :
Reaction product between diethylene triamine and a ketone having the
formula 'R2C = N-( -CH2- ) 2-NH- -CH.- )2-N - CTh (R=C1 ,, alkyl group) (4) Aromatic primary polyamines
o-, or m-Phenylenediamine, diaminodiphenyl ether, 4,4'-methylenedianiline, di
aminodiphenyl sulfone, dimethyl diphenyl methane, m-xylylene diamine, 4,4'-bis
(o - toluidine), tetrachioro - p - xylylenediamine, 4,4' - thiodianiline, 4,4' bis ( o-toluidine), dianisidine, 2,4-toluenediamine, methylene-bis (o-chloroaniline),
m-aminobenzylamine, a eutectic blend of aromatic amines (e.g., a eutectic blend
of m-phenylenediamine and 4,4'-methylenedianiline), and an adduct of an aro
matic amine with styrene oxide or phenylglycidyl ether.
(5) Tertiary amine-type curing agents
(i) Aliphatic tertiary amines: N,N,N',N' - Tetramethyl - 1,3 - butanediamine, tetramethylguanidine, tri
ethanolamine, 2-dimethylamino-2-hydroxypropane, and trialkylamines such
as trimethylamine and triethylamine.
(ii) Alicyclic tertiary amines:- N,N'-dimethylpiperazine, N-methylmorpholine, and 1,4-diazabicyclo (2,2,2)
octane.
(iii) Heteroaromatic ring-containing tertiary amines:- Picoline, pyridine, pyrazine, and quinoline.
(iv) Aromatic ring-containing aliphatic tertiary amines:- Benzyldimethylamine, a - methylbenzyldimethylamine, 2 - (dimethyl
aminomethyl)phenol, and 2i4,6-tris(dimethylaminomethyl)phenol.
(6) Mercaptan-type curing agents
(n=1-2; R=aliphatic hydrocarbon group)
Examples are Thiokol (a trademark for a product of Thiokol Company) and
Epi-Cure 861 (a trademark for a product of Celanese Corporation).
(7) Acid anhydride-type curing agents
Phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhy
dride, hexahydrophthalic anhydride, methylbicyclo[2.2.1]heptene - 2,3 - di
carboxylic anhydride, dodecenylsuccinic anhydride, ethylene glycol bistrimellitate,
glycerol tristrimellitate, and tetrahydrophthalic anhydride.
(8) Phenolic hydroxyl-containing compounds
Phenol-formaldehyde precondensates (novolak and resol types), resorcinol, phloro
glucinol, 1,5-naphthalenediol, and 4,4'-dihydroxydiphenylsulfone.
(9) Other compounds
(i) boron trifluorine-amine complexes,
(ii) dicyandiamide,
(iii) melamine resins,
(iv) urea resins,
(v) 2-ethyl-4-methyl imidazole,
(vi) polysulfide resins,
(vii) polyamide resins,
(viii) amide polyamines, and
(ix) polyamide amines.
The reaction products of fatty acids and polyamines (e.g., diethylene triamine, triethylene tetramine, and tetraethylene pentamine).
CH3 (CH2 )CONH(CH, ) 2NH( CH2 ) ,NH, CII,I( CH, )ONH(CH2),NH(CH,),NH(CH2 ),NH,
(n=1-20) These curing agents can be used singly, or if desired, two or more of them may be used as a mixture. The curing agent to be used in a particular composition can be chosen according to the desired rate of curing and properties of the final composition, and those skilled in the art can make such a choice very easily by preliminary routine experiments.
Preferred curing agents for use in the present invention are linear aliphatic primary polyamines such as diethylene triamine, triethylene tetramine, tetraethylene pentamine, dipropylene diamine and diethylamino propane; adducts of aliphatic polyamines with epoxy resins; adducts of aliphatic polyamines with ethylene oxide or propylene oxide; modified aliphatic primary polyamines such as cyano-ethylated aliphatic primary polyamines; amide polyamines; aromatic primary polyamines; and acid anhydride-type curing agents.
In the present composition, the proportions of the modified polymer, the polyepoxy compound and the curing agent are not strictly restricted, and can be varied widely according, for example, to the properties required of the final composition.
Generally, the modified polymer can be used in an amount of 3 to 700 parts by weight, preferably 4 to 660 parts by weight, most preferably 5 to 500 parts by weight, per 100 parts by weight of the polyepoxy compound. On the other hand, it is advantageous to use the curing agent in an amount of 3 to 500 parts by weight, preferably 4 to 300 parts by weight, most preferably 5 to 250 parts by weight, per 100 parts by weight of the polyepoxy compound.
The polyepoxy resin composition provided by the present invention may further contain optional additives. Examples of the additives are phenolic resins, alkvd resins, petroleum resins, pigments (e.g., titanium oxide, antimony oxide, cadmium red, toluidine red, phthalocyanine blue), fillers (e.g., talc, silica, mica, cryolite, clay, calcium carbonate, alumina, portland cement, graphite), reactive diluents (e.g., styrene oxide, allyl glycidyl ether, butyl glycidyl ether, vinylcyclohexane monoxide, dipentene monoxide, glycidyl methacrylate), flexibilizers (e.g., polyamides, polysulfide resins, poly- urethane elastomers), and solvents.The amounts of such additives are, for example, 0 to 1000 parts by weight for the pigments and fillers; 0 to 50 parts by weight for the reactive diluents and flexibilizers; and 0 to 2000 parts by weight for the solvents, all per 100 parts by weight of the polyepoxy compound.
The polyepoxy resin compositions provided by the present invention include both room temperature-curable type compositions which cure at room temperature, and heat-curable type compositions which cure only when heated at a temperature of about 50 to about 200"C., depending upon the types of the polyepoxy compound and curing agent to be included in the compositions.
The epoxy resin composition of this invention can be prepared by any conventional methods. For example, the modified polymer is mixed first with the polyepoxy compound or the curing agent, and just prior to use in applications to be described below, the mixture is uniformly mixed with the curing agent or the polyepoxy compound. Or just prior to use in the applications to be described below, the modified polymer, the polyepoxy compound and the curing agent are simultaneously mixed to form a uniform blend. Additives such as pigments, fillers, reactive diluents and solvents can be added simultaneously with the addition of the polyepoxy compound or curing agent to the modified polymer. But advantageously, the additives are fully mixed with the polyepoxy compound beforehand, and then the mixture is mixed with the modified polymer and/or the curing agent.
The modified polymers employed in this invention have superior compatibility with epoxy resins and curing agents. Hence, epoxy resin compositions including the modified polymers according to this invention can be stored stably over long periods of time. In comparison with tar-containing epoxy resin compositions, the epoxy resin compositions of this invention have reduced bleed-out and superior mechanical strength (e.g., compression or impact strength), abrasion resistance, water resistance, and chemical resistance (e.g., alkali resistance). Therefore, these compositions can be suitably used in fields which use tar-containing epoxy resin compositions, for example as paints, road repairing materials, or slip-preventing floor materials.
Furthermore, in comparison with compositions of epoxy resins and curing agents not containing the modified polymers of this invention, the epoxy resin compositions of this invention have superior adhesion, mechanical strength (e.g., compression or impact strength), water resistance, chemical resistance (e.g., alkali or solvent resistance), and thermal stability. These epoxy resin compositions can also be used in a wide range of applications as, for example, cast articles, adhesives and laminated boards.
Since the modified polymer in accordance with this invention is available in a relatively light to colorless color, the epoxy resin composition of this invention can be obtained in a light color. Accordingly, it can be used advantageously also in applications which permit only light-colored coloration.
The following Examples specifically illustrate the epoxy resin composition of this invention.
Example 1.
(1) Preparation of phenol-modified poly(a-methylstyrene)
A liter glass reactor equipped with a thermometer, a reflux condenser, a feed opening and a stirrer was charged with a mixture consisting of 170 g of a-methylstyrene, 30 g of phenol and 200 g of toluene. The mixture was stirred to form a solution.
To the resulting solution was added dropwise 2 g of a boron triflouride/phenol complex, and the polymerization was performed in a nitrogen atmosphere at 30"C. for 2 hours. To the resulting polymerization product was added 150 ml of a 0.3N aqueous solution of sodium hydroxide, and the mixture was stirred for 30 minutes. The aqueous layer was separated, and the residue was repeatedly washed with water until the aqueous layer became neutral. The aqueous layer was separated, and the residue was concentrated at 200"C. and 5 mmHg for 30 minutes to afford 195 g of a modified polymer. The properties of the polymer are shown in Table 2.
(2) Preparation of an epoxy resin composition
A blend consisting of 40 parts by weight of bisphenol A diglycidyl ether (EPO
MIK R-144, a trademark for a product of Mitsui Petrochemical Epoxy Co., Ltd.), 40 parts by weight of the phenol-modified poly(a-methylsryrene) prepared in section (1) above, 100 parts by weight of talc, 30 parts by weight of titanium white and 40 parts by weight of ethyl cellulose was passed through a three-roli mill three times to disperse the talc uniformly in the blend.Then, 30 parts by weight of a polyamide amine curing agent (EPOMIK Q-671, a trademark for a product of Mitsui Petro-chemical
Epoxy Co., Ltd.), and the viscosity of the resulting mixture was adjusted to 2500 centipoises (measured by a B-type viscometer) with a 1:1 by weight mixture of xylene and tert-butanol. The resulting composition was coated on a mild steel plate.
(3) Test for the performance of the coated film
The coated film obtained was tested for performance by the method described hereinbelow. The results are shown in Table 2.
Examples 2 to 9.
The procedure of Example 1, (1) was repeated except that 170 g of each of the polymerizable materials shown in Table 2 was used instead of 170 g of the a-methyl- styrene in Example 1, (1). Thus, phenol-modified polymers having the characteristics shown in Table 2 were prepared.
Then, the procedure of Example 1, (2) was repeated except using each of the phenol-modified polymers obtained above in the amount shown in Table 2 instead of the phenol-modified poly(a-methylstyrene), each of the polyepoxy compounds in the amounts shown in Table 2 instead of the bisphenol A diglycidyl ether, and each of the curing agents shown in Table 2 instead of the polyamide amine curing agent in
Example 1, (2). Thus, epoxy resin compositions were prepared.
These compositions were tested for the performances of coated films in the same way as in Example 1, (3). The results are shown in Table 2.
Comparative Example 1.
An epoxy resin composition was prepared by repeating the procedure of Example 1, (2) except that 40 parts by weight of a coal tar (TACRON #180) was used instead of 40 parts by weight of the phenol-modified poly(a-methylstyrene) in Example 1, (2).
The composition was tested for coating performance in the same way as in
Example 1, (3). The results are summarized in Table 2 below.
Examples 10 and 11.
(1) Preparation of a phenol-modified polymer
A 1-liter glass reactor equipped with a thermometer, a reflux condenser, a feed opening and a stirrer was charged with a mixture consisting of 185 g of a-methyl- styrene, 15 g of ether ss-naphthol or resorcinol and 200 g of toluene, and the mixture was stirred. To the resulting solution was added dropwise 2 g of a boron trifluoride/ phenol complex, and the polymerization was performed in a nitrogen atmosphere at 50"C. for 2 hours. To the resulting polymerization product was added 150 ml of a 0.3N aqueous solution of sodium hydroxide. The mixture was stirred for 30 minutes.
and the aqueous layer was separated. The residue was repeatedly washed with water until the aqueous layer became neutral. The aqueous layer was separated, and the residue was concentrated at 2000C. and 5 mmHg for 30 minutes to afford a modified polymer having the properties shown in Table 2.
(2) Preparation of an epoxy resin composition
A blend consisting of 72 parts by weight of bisphenol A diglycidyl ether (EPO
MIK R-140, a trademark for a product of Mitsui Petrochemical Epoxy Co., Ltd.), 8 parts by weight of the modified poly(a-methylstyrene) prepared in section (1) above, 100 parts by weight of talc, 20 parts by weight of titanium white and 40 parts by weight of ethyl cellulose was passed through a three-roll mill three times. Then, 50 parts by weight of a polyamide amine curing agent (EPOMIK Q-671, a trademark for a product of Mitsui Petro-Chemical Epoxy Co., Ltd.) was added. The viscosity of the mixture was adjusted to 2500 centipoises (measured by a B-type viscometer) with a 1:1 by weight mixture of xylene andsec-butanol. The resulting composition was coated on a mild steel plate.
(3) Test for the performance of coated film
The coated film obtained was tested for performance by the method described hereinbelow. The results are shown in Table 2.
Examples 12 to 21.
(1) Preparation of a phenol-modified polymer
A 1 liter glass reactor equipped with a thermometer, a reflux condenser, a feed opening and a stirrer was charged with a mixture consisting of 170 g of a naphtha cracking hydrocarbon fraction having each of the compositions A to C shown in Table 1 below and 30 g of a phenol, and the mixture was stirred. To the resulting solution was added dropwise 2 g of a boron trifluoride/phenol complex, and the polymerization was performed in a nitrogen atmosphere at 300 C. for 2 hours. To the resulting polymerization product was added 150 ml of a 0.3N aqueous solution of sodium hydroxide, and the mixture was stirred for 30 minutes. The aqueous layer was separated, and the residue was repeatedly washed with water until the aqueous layer became neutral. The aqueous layer was separated, and the residue was concentrated at 2000 C. and 5 mmHg for 30 minutes to afford a modified polymer having the properties shown in Table 2.
TABLE 1
Content
(% by weight based on the fraction)
Component A B C
Styrene 2.8 0.7 1.8
a-Methyl styrene 2.1 3.0 1.5 ss-Methylstyrene 2.3 3.2 1.4
Vinyltoluene 18.0 25.5 14.0
Indene 12.1 16.3 9.1
Methylindene 4.2 1.0 3.0
Trimethylbenzene 12.0 20.0 10.0
Naphthalene 5.1 0.0 4.3
Other C,-C,, aromatic
saturated hydrocarbons 30.5 22.3 40.5
Paraffins and unidentified
components 10.9 8.0 14.4
Total of the aromatic
unsaturated hydrocarbons 41.5 49.7 30.8
Boiling range of the
fraction (OC) 140-240 160-200 140-280 (2) Preparation of an epoxy resin composition
A blend consisting of 40 parts by weight of bis-phenol A diglycidyl ether (EPO
MIK R-144, a trademark for a product of Mitsui Petrochemical Epoxy Co., Ltd.), 40 part by weight of the polymer obtained in (1) above, 100 parts by weight of talc, 30 parts by weight of titanium white and 40 parts by weight of ethyl cellulose was passed through a three-roll mill three times to disperse the talc uniformly in the blend.
Then, a polyamide amine curing agent (EPOMIK Q-671) was added in an amount of 30 parts by weight, and the viscosity of the mixture was adjusted to 2500 centipoises (measured by a B-type viscometer) with a 1:1 by weight mixture of xylene and secbutyl alcohol. The resulting composition was coated on a mild steel plate.
(3) Test for the performance of the coated film
The resulting coated film was tested for performance by the method to be described. The results are shown in Table 2.
Example 22.
(1) Preparation of a phenol-modified polymer
A 1 liter glass reactor equipped with a thermometer, a reflux condenser, a feed opening and a stirrer was charged with a mixture consisting of 170 g of a naphthacracking hydrocarbon fraction having the composition (C) shown in Table 1 and 30 g of a phenol, and the mixture was stirred. To the resulting solution was added 2 g of a boron trifluoride/phenol complex, and in a nitrogen atmosphere, the polymerization was performed at 0 C. for 2 hours. 150 ml of a 0.3N aqueous solution of sodium hydroxide was added to the resulting polymerization product, and the mixture was stirred for 30 minutes. The aqueous layer was separated, and the residue was repeatedly washed until the aqueous layer became neutral.The aqueous layer was separated, and the residue was concentrated at 200PC. -and 5 mmHg for 30 minutes to afford a modified polymer having the properties shown in Table 2.
(2) Preparation of an epoxy resin composition
A blend consisting of 20 parts by weight of bisohenol A diglycidyl ether (EPO
MIK R-144, a trademark for a product of Mitsui Petrochemical Epoxy Co., Ltd.), 60 parts by weight of the polymer obtained in section (1) above, 100 parts by weight of talc, 30 parts by weight of titanium white and 40 parts by weight of ethyl cellulose was passed through a three-roll mill three times to disperse the talc uniformly in the blend. Then, a polyamide amine curing agent (EPOMIK Q-671) was added in an amount of 20 parts by weight, and the viscosity of the mixture was adjusted to 2500 centipoises (measured by a B-type viscometer) with a 1:1 by weight mixture of xylene and sec-butanol. The resulting composition was coated on a mild steel plate.
(3) Test for the performance of coated film
The resulting coated film was tested for performance by the method described hereinbelow. The results are shown in Table 2.
TABLE 2
Example 1 2 3 Modified polymer Polymerizable material a-methyl styrene styrene isopropenyl styren Phenol or naphthol phenol phenol phenol Softening point ( C.) 35 52 41 Color (Gardner number) 4 3 3 Constant of the phenol or naphthol (% by weight) 14 12 13 Hydroxyl content (millimoles/g) 1.5 1.2 1.0 Amount used (parts by weight) 40 40 40 Polyepoxy compound (EPOMIK) (parts by weight) R-144 (40) R-144 (40) R-144 (40) Curing agent (EPOMIK) (parts by weight) Q-671 (30) Q-671 (30) Q-671 (30) Properties of the coated film Pot life (hr, 20 C.) 24 24 24 Finger touch drying time (hr, 200C.) 8.5 8.0 8.0 Curing time (hr, 200C.) 33 34 35 Crosscut test for adhesion 100 /100 100/100 100/100 Salt spray test (300 hours) No change No change No change Acid resistance test No change for No change for No change for (10% H2 SO4) one month one month one month Alkali resistance (10% NaOH) Ditto Ditto Ditto Water resistance Ditto Ditto Ditto n-Hexane resistance (300C.) Ditto Ditto Ditto Strength HB H HB Color White White I~ White TABLE 2 (Continued)
Example 4 5 6 Modified polymer Polymerizable material vinyltoluene 1) indene α;-methylstyrene Phenol or naphthol phenol phenol phenol Softening point ( C.) 55 130 35 Color (Gardner number) 7 5 4 Content of the -henol or naphthol (% by weight) 14 14 14 Hydroxyl content (millimoles/g) 1.3 1.4 1.5 Amount used (parts by weight) 40 40 40 Polyepoxy compound (EPOMIK) (parts by weight) R-144 (40) R-144 (40) R-144 (40) Curing agent (EPOMIK) (parts by weight) Q-671 (30) Q-671 (30) Q607 4) (35) Properties of the coated film Pot life (hr, 200C.) 24 23 24 Finger touch drying time (hr 200C.) 8.0 7.5 8.5 Curing time (hr, 200C.) 32 30 34 Crosscut test for adhesion 100 /100 100 '100 100 /100 Salt spray test (300 hours) No change No change No change Acid resistance test No change for No change for No change for (10% H2SO4) one month one month one month Alkali resistance (10% NaOH) Ditto Ditto Ditto Water resistance Ditto Ditto Ditto n-Hexane resistance Dittd Ditto Ditto (30CC.) Strength Ii 2H HB Color Whits White White TABLE 2 (Continued)
Example 7 8 9 Modified polymer Polymeri zable material a-methylstyrene styrene ame thy Is tyrene Phenol or naphthol phenol phenol phenol Softening point ( C.) 35 52 35 Color (Gardner number) 4 3 4 Content of the phenol or naphthol (% by weight) 14 12 14 Hydroxyl content (millimoles/g) 1.5 1.2 1.5 Amount used (parts by weight) 8 25 40 Polyepoxy compound (EPOMIK) (parts by weight) R-144 (72) R-144 (55) R-301 3) (40) Curing agent (EPOMIK) (parts by weight) Q-671 (50) Q-671 (20) Q671 (30) Properties of the coated film Pot life (hr, 20 C.) 24 24 24 Finger touch drying time (hr, 20 C.) 8.5 8.5 8.5 Curing time (hr, 200C.) 36 36 35 Crosscut test for adhesion 100/100 100/100 100/100 Salt spray test (300 hours) No change No change No change Acid resistance test No change for No change for No change (10% H2 SO4) one month one month one month Alkali resistance (10% NaOH) Ditto Ditto Ditto Water resistance Ditto Ditto Ditto n-Hexane resistance (30 C.) Ditto Ditto Ditto Strength B HB H Color White White White TABLE 2 (Continued)
Example Comp. Ex. 1 10 11 Modified polymer Polymeri zable material TARCRON #180 α-methylstyrene α-methylstyrene Phenol or naphthol - ss-naphthol resorcinol Softening point ( C.) - 63 68 Color (Gardner number) - 7 9 Constant of the phenol or naphthol (% by weight) - 7 7 Hydroxyl content (millimoles /g) 0.5 1.2 Amount used (parts by weight) 40 8 8 Polyepox compound (EPOMIK (parts by weight) R-144 (40) R-140 (72) R-140 (72) Curing agent (EPOMIK) (parts by weight) Q-671 (30) Q-67 1(50) Q-67 (50) Properties of the coated film Pot life (hr, 200C.) 24 24 24 Finger touch drying time (hr, 20 C.) 9.0 8.0 8.0 Curing time (hr, 20 C.) 40 35 30 Crosscut test for adhesion 100/100 100/100 100/100 Salt spray test Peeling by tust (300 hours) formation No change No change Acid resistance test Blister occurred No change for No change for (10% H2 SO4) in 20 days one month one month Alkali resistance Blister occurred Ditto Ditto (10% NaOH) in 22 days Water resistance No change for Ditto Ditto one month n-Hexane resistance Blister occurred Ditto Ditto (300C.) in 20 days Strength 2B B 2H Color Black brown White White TABLE 2 (Continued)
Example 12 13 14 Modified polymer Polymerizable material C9 fraction A C9 fraction B Cq fraction C Phenol or naphthol phenol phenol phenol Softening point ( C.) 57 70 65 Color (Gardner number) 15 13 16 Content of the phenol or naphthol (% by weight) 24 22 31 Hydroxyl content (millimoles "g) 2.0 1.8 2.6 Amount used (parts by weight) 40 40 40 Polyepoxy compound (EPOMIK) (parts by weight) 4-144 (40) R-144 (40) R-144 (40) Curing agent (EPOMIK) (parts by weight) Q 671 (30) Q-671 (30) Q-671 (30) Properties of the coated film Pot life (hr, 200C.) 24 24 23 Finger touch drying time (hr, 200C.) 7.5 7.5 7.5 Curing time (hr, 200C.) 32 32 29 Crosscut test for adhesion 100,'l00 100 'l00 100 100/100 Salt spray test (300 hours) No change No change No change Acid resistance test No change for No change for No change for (10% H2SO4) one month one month one month Alkali resistance (10% NaOH) Ditto Ditto Ditto Water resistance Ditto Ditto Ditto n-Hexane resistance (30 C.) Ditto Ditto Ditto Strength H 2H 2H Color Yellow Light yellow Yellow TABLE 2 (Continued)
Example 15 16 17 Modified polymer Polymerizable material (::, fraction A (', fraction A (", fraction A Phenol or naphthol cresol) isopropyl phenol sec-butyl phenol Softening point ( C.) 60 60 65 Color (Gardner number) 15 14 14 Content of the phenol or naphthol ('YO by weight) 2() 24 23 Hydroxyl content (millimoles/g) 1.7 1.4 1.2 Amount used (parts by weight) 40 40 40 Polyepoxy compound (EPOMIK) (parts by weight) R-144 (40) R-144 (40) R-144 (40) Curing agent (EPOMIK) (parts by weight) Q-67 1 (30) Q-671 (30) Q-671 (30) Properties of the coated film Pot life (hr, 200C.) 24 24 24 Finger touch drying time (hr, 200C.) 8.0 8.0 8.0 Curing time (hr, 200C.) 33 32 32 Crosscut test for adhesion 100/100 100/100 100/100 Salt spray test (30() hours) No change No change No change Acid resistance test No change for No change for No change for (10% H2SO4) one month one month one month Alkali resistance (10% NaOll) Ditto Ditto Ditto Water resistance Ditto Ditto Ditto n-llcxane resistance (30 C) Ditto Ditto Ditto Strength II II II Color Yellow light yellow Light yellow TABLE 2 (Continued)
Example 18 19 20 Modified polymer Polymerizable material C9 fraction A C9 fraction A C9 fraction A Phenol or naphthol tert-butyl phenol octyl phenol nonyl phenol Softening point (OC.) 70 63 61 Color (Gardner number) 14 15 15 Content of the phenol or naphthol (% by weight) 23 21 20 Hydroxyl content (millimoles /g) 1.2 0.8 0.8 Amount used (parts by weight) 40 40 40 Polyepoxy compound (EPOMIK) (parts by weight) R-144 (40) R-144 (40) R-144 (40) Curing agent (EPOMIK) (parts by weight) Q-671 (30) Q-671 (30) Q671 (30) Properties of the coated film Pot life (hr, 200C.) 24 24 24 Finger touch drying time (hr, 200C.) 7.5 8.0 8.0 Curing time (hr, 200C.) 31 33 32 Crosscut test for adhesion 100/100 100/100 100/100 Salt spray test (300 hours) No change No change No change Acid resistance test No change for No change for No change for (lo(r, H2 SO4) one month one month one month Alkali resistance (10% HaOH) Ditto Ditto Ditto Water resistance Ditto Ditto Ditto n-Hexane resistance (300C.) Ditto Ditto Ditto Strength 2H H H Color Light yellow Yellow Yellow TABLE 2 (Continued)
Example 21 22 Modified polymer Polymerizable material C9 fraction A C9 fraction A Phenol or naphthol dodecyl phenol phenol Softening point (OC.) 62 115 Color (Gardner number) 15 14 Content of the phenol or naphthol (% by weight) 20 23 Hydroxyl content (millimoles /g) 0.7 1.8 Amount used (parts by weight) 40 60 Polyepoxy compound (EPOMIK) (parts by weight) R-144 (40) R-144 (20) Curing agent (EPOMIK) (parts by weight) Q-671 (30) Q-671 (20) Properties of the coated film Pot life (hr, 2aOC.) 24 24 Finger touch drying time (hr, 200C.) 8.0 8.0 Curing time (hr, 200C.) 33 29 Crosscut test for adhesion 100/100 100/100 Salt spray test (300 hours) No change No change Acid resistance test No change for No change for (10% H2 SO4) one month one month Alkali resistance (10% NaOH) Ditto Ditto Water resistance Ditto Ditto n-Hexane resistance Blister occurred (300C.) Ditto in 28 days Strength H H Color Yellow Light yellow 1) m-/p- weight ratio= 6/4 2) m-/p- ratio 6/4
3) R-301, bisphenol A glycidyl ether, a product of Mitsui Petrochemical Epoxy
Co., lAd.
4) Q-607, modified aliphatic polyamine, a product of Mitsui Petrochemical
Epoxy Co., Ltd.
The properties shown in Table 2 were measured by the following methods.
(i) Softening point of the copolymer
Measured by the ball and ring method in ASTM E 2858T.
(ii) Color (Gardncr number)
Measured by the method of ASTM D154468.
(iii) The coated test plate was prepared by coating the composition on a mild steel plate by the method described in JIS K-5400. The thickness of the coated film upon drying was 150+5 microns.
(iv) The pot life of the epoxy resin composition, the finger touch drying time of the coated film, the curing time, and the acid resistance, alkali resistance and water resistance of the coated film were measured by the method of JIS K 5400.
(v) The salt spray test was performed by the method of JIS K-2371.
(vi) The strength of the coated film was measured by the method of JIS K-5651.
(vii) The color of the coated film was observed visually.
(viii) The crosscut test was performed by providing 11 parallel cuts in a substrate at an interval of 1 mm, and another set of 11 cuts at right angles to them, applying an adhesive tape to the substrate, pulling it away, and counting the number of remaining squares.
(ix) The resistance to n-hexane was performed by dipping the test sample in an n-hexane solution at 30"C., and then observing the state of the coated film visually.
WHAT WE CLAIM IS:
1. An epoxy resin composition comprising
[A] a polymer having a hydroxyl content of 0.3 to 7 millimoles/g, said polymer being prepared by polymerizing a polymerizable material selected from
(a) cationically polymerizable hydrocarbon-containing fractions having a boiling
point in the range of from 140 to 2800C. obtained by distillation of a crack
ing or reforming product of a petroleum,
(b) a cationically polymerizable aromatic unsaturated hydrocarbon, and
(c) a mixture of (a) and (b) in the presence of a cationic polymerization catalyst and modifying the resulting polymer with a phenol or naphthol; [B] a polyepoxy compound; and
[C] a curing agent.
2. The composition of claim 1 wherein the cationically polymerizable hydrocarbon-containing fraction (a) contains at least 20% by weight of cationically polymerizable aromatic unsaturated hydrocarbons.
3. The composition of claim 1 wherein the cationically polymerizable aromatic unsaturated hydrocarbon (b) contains 8 to 10 carbon atoms.
**WARNING** end of DESC field may overlap start of CLMS **.
Claims (18)
1) m-/p- weight ratio= 6/4
2) m-/p- ratio 6/4
3) R-301, bisphenol A glycidyl ether, a product of Mitsui Petrochemical Epoxy
Co., lAd.
4) Q-607, modified aliphatic polyamine, a product of Mitsui Petrochemical
Epoxy Co., Ltd.
The properties shown in Table 2 were measured by the following methods.
(i) Softening point of the copolymer
Measured by the ball and ring method in ASTM E 2858T.
(ii) Color (Gardncr number)
Measured by the method of ASTM D154468.
(iii) The coated test plate was prepared by coating the composition on a mild steel plate by the method described in JIS K-5400. The thickness of the coated film upon drying was 150+5 microns.
(iv) The pot life of the epoxy resin composition, the finger touch drying time of the coated film, the curing time, and the acid resistance, alkali resistance and water resistance of the coated film were measured by the method of JIS K 5400.
(v) The salt spray test was performed by the method of JIS K-2371.
(vi) The strength of the coated film was measured by the method of JIS K-5651.
(vii) The color of the coated film was observed visually.
(viii) The crosscut test was performed by providing 11 parallel cuts in a substrate at an interval of 1 mm, and another set of 11 cuts at right angles to them, applying an adhesive tape to the substrate, pulling it away, and counting the number of remaining squares.
(ix) The resistance to n-hexane was performed by dipping the test sample in an n-hexane solution at 30"C., and then observing the state of the coated film visually.
WHAT WE CLAIM IS:
1. An epoxy resin composition comprising
[A] a polymer having a hydroxyl content of 0.3 to 7 millimoles/g, said polymer being prepared by polymerizing a polymerizable material selected from
(a) cationically polymerizable hydrocarbon-containing fractions having a boiling
point in the range of from 140 to 2800C. obtained by distillation of a crack
ing or reforming product of a petroleum,
(b) a cationically polymerizable aromatic unsaturated hydrocarbon, and
(c) a mixture of (a) and (b) in the presence of a cationic polymerization catalyst and modifying the resulting polymer with a phenol or naphthol; [B] a polyepoxy compound; and
[C] a curing agent.
2. The composition of claim 1 wherein the cationically polymerizable hydrocarbon-containing fraction (a) contains at least 20% by weight of cationically polymerizable aromatic unsaturated hydrocarbons.
3. The composition of claim 1 wherein the cationically polymerizable aromatic unsaturated hydrocarbon (b) contains 8 to 10 carbon atoms.
4. The composition of claim 1 wherein the cationically polymerizable aromatic
unsaturated hydrocarbon (b) is selected from the group consisting of styrene, a- and p-methylstyrenes, o-, m- and p-vinyltoluenes, o-, m- and p-isopropenyltoluenes, indene and mixtures of these.
5. The composition of claim 1 wherein the phenol or naphthol is a compound of the formula
wherein Ar represents a benzene or naphthalene ring, R1 and R2, independently from each other, represent a hydrogen atom or an alkyl group, and n is a integer of 1 or 2.
6. The composition of claim 1 wherein the phenol or naphthol is selected from the group consisting of phenol, cresol, xylenol, isopropyl phenol, sec- and tert-butyl phenols, octyl phenol, nonyl phenol, dodecyl phenol, naphthol and dihydroxybenzene.
7. The composition of claim 1 wherein the polymer [A] has a hydroxyl content of 0.4 to 5.5 millimoles/g.
8. The composition of claim 1 wherein the polymer [A] has a phenol or naphthol content of 3 to 50% by weight.
9. The composition of claim 1 wherein the polymer [A] has a phenol or naphthol content of 4.5 to 50% by weight.
10. The composition of claim 1 wherein the polymer [A] is a liquid at room temperature, or a solid with a softening point of not more than 200"C measured by a ball-and-ring method in ASTM E 2858T.
11. The composition of claim 1 wherein the polymer [A] has a number average molecular weight of 200 to 3,000.
12. The composition of claim 1 wherein the polyepoxy compound has an epoxy equivalent of at most 5,000.
13. The composition of claim 1 wherein the polyepoxy compound has a molecular weight of 86 to 20,000.
14. The composition of claim 1 wherein the polyepoxy compound is selected from the group consisting of polyglycidyl ethers of polyphenol compounds and novolak-type polyepoxy compounds.
15. The composition of claim 1 wherein the amount of the polymer [A] is 3 to 700 parts by weight per 100 parts by weight of the polyepoxy compound.
16. The composition of claim 1 wherein the curing agent is a polyfunctional compound having at least two functional groups selected from primary, secondary or tertiary amino groups, acid anhydride groups, mercapto groups and phenolic hydroxyl groups.
17. The composition of claim 1 wherein the amount of the curing agent is 3 to 500 parts by weight per 100 parts by weight of the polyepoxy compound.
18. A composition of claim 1 substantially as hereinbefore described in any of the
Examples.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5548377A JPS53141361A (en) | 1977-05-16 | 1977-05-16 | Epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1581974A true GB1581974A (en) | 1980-12-31 |
Family
ID=12999858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB18958/78A Expired GB1581974A (en) | 1977-05-16 | 1978-05-11 | Epoxy resin composition |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS53141361A (en) |
CA (1) | CA1134990A (en) |
DE (1) | DE2821301A1 (en) |
FR (1) | FR2391248A1 (en) |
GB (1) | GB1581974A (en) |
IT (1) | IT1096217B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2315274A (en) * | 1997-07-24 | 1998-01-28 | M J Highway Technology Limited | Road repair material |
US6315492B1 (en) | 1997-07-24 | 2001-11-13 | Roadtechs Europe Limited | Road repair material comprising cement and a resin |
CN109852314A (en) * | 2019-03-11 | 2019-06-07 | 上海域金澜优电子商务有限公司 | A kind of whitening resistance joint trimming agent |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62167318A (en) * | 1986-01-20 | 1987-07-23 | Teijin Ltd | Curing of epoxy resin |
JPH0611822B2 (en) * | 1987-02-03 | 1994-02-16 | 日本石油株式会社 | Rubber composition |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2911387A (en) * | 1954-07-06 | 1959-11-03 | Hercules Powder Co Ltd | Polymer phenol hydroperoxides |
DE1940576C3 (en) * | 1969-08-08 | 1978-10-19 | Ruetgerswerke Ag, 6000 Frankfurt | Process for the production of reactive liquid resins and their use as blending agents for reactive resin systems |
JPS4832432B1 (en) * | 1970-03-23 | 1973-10-05 |
-
1977
- 1977-05-16 JP JP5548377A patent/JPS53141361A/en active Pending
-
1978
- 1978-05-11 GB GB18958/78A patent/GB1581974A/en not_active Expired
- 1978-05-15 CA CA000303330A patent/CA1134990A/en not_active Expired
- 1978-05-16 DE DE19782821301 patent/DE2821301A1/en not_active Withdrawn
- 1978-05-16 FR FR7814385A patent/FR2391248A1/en not_active Withdrawn
- 1978-05-16 IT IT23469/78A patent/IT1096217B/en active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2315274A (en) * | 1997-07-24 | 1998-01-28 | M J Highway Technology Limited | Road repair material |
GB2315274B (en) * | 1997-07-24 | 1999-10-27 | M J Highway Technology Limited | Road repair material |
US6315492B1 (en) | 1997-07-24 | 2001-11-13 | Roadtechs Europe Limited | Road repair material comprising cement and a resin |
CN109852314A (en) * | 2019-03-11 | 2019-06-07 | 上海域金澜优电子商务有限公司 | A kind of whitening resistance joint trimming agent |
CN109852314B (en) * | 2019-03-11 | 2021-01-05 | 上海域金澜优实业有限公司 | Whitening-resistant seam beautifying agent |
Also Published As
Publication number | Publication date |
---|---|
IT1096217B (en) | 1985-08-26 |
DE2821301A1 (en) | 1978-11-30 |
FR2391248A1 (en) | 1978-12-15 |
IT7823469A0 (en) | 1978-05-16 |
JPS53141361A (en) | 1978-12-09 |
CA1134990A (en) | 1982-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |