GB1555358A - Method for manufacturing a base of a semiconductor device - Google Patents
Method for manufacturing a base of a semiconductor deviceInfo
- Publication number
- GB1555358A GB1555358A GB47557/76A GB4755776A GB1555358A GB 1555358 A GB1555358 A GB 1555358A GB 47557/76 A GB47557/76 A GB 47557/76A GB 4755776 A GB4755776 A GB 4755776A GB 1555358 A GB1555358 A GB 1555358A
- Authority
- GB
- United Kingdom
- Prior art keywords
- manufacturing
- base
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
- H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50146348A JPS5270764A (en) | 1975-12-10 | 1975-12-10 | Method of manufacturing base for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1555358A true GB1555358A (en) | 1979-11-07 |
Family
ID=15405663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB47557/76A Expired GB1555358A (en) | 1975-12-10 | 1976-11-15 | Method for manufacturing a base of a semiconductor device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5270764A (https=) |
| DE (1) | DE2649367A1 (https=) |
| FR (1) | FR2335047A1 (https=) |
| GB (1) | GB1555358A (https=) |
| NL (1) | NL7613314A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0171381U (https=) * | 1987-10-31 | 1989-05-12 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7115486A (https=) * | 1970-11-16 | 1972-05-18 |
-
1975
- 1975-12-10 JP JP50146348A patent/JPS5270764A/ja active Granted
-
1976
- 1976-10-29 DE DE19762649367 patent/DE2649367A1/de not_active Ceased
- 1976-11-15 GB GB47557/76A patent/GB1555358A/en not_active Expired
- 1976-11-25 FR FR7635602A patent/FR2335047A1/fr active Granted
- 1976-11-30 NL NL7613314A patent/NL7613314A/xx not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5270764A (en) | 1977-06-13 |
| FR2335047B1 (https=) | 1979-03-30 |
| NL7613314A (nl) | 1977-06-14 |
| FR2335047A1 (fr) | 1977-07-08 |
| DE2649367A1 (de) | 1977-06-30 |
| JPS5312791B2 (https=) | 1978-05-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |