GB1526159A - Arc resistant poly(arylene sulphide) - Google Patents
Arc resistant poly(arylene sulphide)Info
- Publication number
- GB1526159A GB1526159A GB27452/77A GB2745277A GB1526159A GB 1526159 A GB1526159 A GB 1526159A GB 27452/77 A GB27452/77 A GB 27452/77A GB 2745277 A GB2745277 A GB 2745277A GB 1526159 A GB1526159 A GB 1526159A
- Authority
- GB
- United Kingdom
- Prior art keywords
- arc resistant
- resistant poly
- arylene sulphide
- sulphide
- arylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/29—Protection against damage caused by extremes of temperature or by flame
- H01B7/292—Protection against damage caused by extremes of temperature or by flame using material resistant to heat
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
Abstract
Polyarylene sulphides are plastics of interest for the manufacture of moulded articles for electrical apparatus. However, their arc resistance is insufficient. This resistance is improved by incorporating into a polyarylene sulphide, uncured or partially cured, from 20 to 50 % by weight, relative to the total composition, of clay and/or talc as filler.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70172876A | 1976-07-01 | 1976-07-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1526159A true GB1526159A (en) | 1978-09-27 |
Family
ID=24818443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB27452/77A Expired GB1526159A (en) | 1976-07-01 | 1977-06-30 | Arc resistant poly(arylene sulphide) |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS535252A (en) |
AU (1) | AU497588B1 (en) |
CA (1) | CA1102107A (en) |
CH (1) | CH623842A5 (en) |
DE (1) | DE2728233C3 (en) |
GB (1) | GB1526159A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0044136A1 (en) * | 1980-07-04 | 1982-01-20 | Asahi Glass Company Ltd. | Encapsulation of electronic device |
GB2133017A (en) * | 1983-01-10 | 1984-07-18 | Bicc Plc | Methods of improving the resistance of insulating surfaces to tracking |
EP1006575A2 (en) * | 1998-12-02 | 2000-06-07 | Kabushiki Kaisha Toshiba | Composition for resin sealing a semiconductor device, resin sealed semiconductor device and method of manufacturing the same |
WO2014028548A1 (en) * | 2012-08-15 | 2014-02-20 | Ticona Llc | Directly metallizable polyarylene sulfide composition |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU511909B2 (en) * | 1978-06-12 | 1980-09-11 | Phillips Petroleum Company | Poly (arylene sulfide) composition |
JPS5713162A (en) * | 1980-06-23 | 1982-01-23 | Nec Corp | Electroless plating bath |
JPS5763355A (en) * | 1980-10-03 | 1982-04-16 | Dainippon Ink & Chem Inc | Mica reinforced polyallylene sulfide resin composition |
US4337182A (en) * | 1981-03-26 | 1982-06-29 | Phillips Petroleum Company | Poly (arylene sulfide) composition suitable for use in semi-conductor encapsulation |
CA1201836A (en) * | 1982-02-22 | 1986-03-11 | James S. Dix | Arylene sulfide compositions containing calcium sulfate |
US4782195A (en) * | 1982-07-16 | 1988-11-01 | Phillips Petroleum Company | Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane |
JPH0832827B2 (en) * | 1986-11-27 | 1996-03-29 | 東ソー株式会社 | Method for curing poly (p-phenylene sulfide) |
JPH0759665B2 (en) * | 1987-03-31 | 1995-06-28 | 呉羽化学工業株式会社 | Polyary lentithioether composition |
DE3803475A1 (en) * | 1988-02-05 | 1989-08-17 | Bayer Ag | FILLED THERMOPLASTIC WITH LOW VIBRATION ANISOTROPY |
JPH01222064A (en) * | 1988-03-02 | 1989-09-05 | Hitachi Ltd | Chemical nickel plating solution and method for using same |
JP5525682B2 (en) | 2007-05-15 | 2014-06-18 | 出光ライオンコンポジット株式会社 | Polyarylene sulfide resin composition and molded article comprising the same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3354129A (en) * | 1963-11-27 | 1967-11-21 | Phillips Petroleum Co | Production of polymers from aromatic compounds |
JPS5325280B2 (en) * | 1972-08-10 | 1978-07-26 |
-
1977
- 1977-03-15 CA CA274,006A patent/CA1102107A/en not_active Expired
- 1977-06-17 AU AU26175/77A patent/AU497588B1/en not_active Expired
- 1977-06-23 DE DE2728233A patent/DE2728233C3/en not_active Expired
- 1977-06-24 CH CH778277A patent/CH623842A5/en not_active IP Right Cessation
- 1977-06-29 JP JP7771677A patent/JPS535252A/en active Pending
- 1977-06-30 GB GB27452/77A patent/GB1526159A/en not_active Expired
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0044136A1 (en) * | 1980-07-04 | 1982-01-20 | Asahi Glass Company Ltd. | Encapsulation of electronic device |
US4370292A (en) | 1980-07-04 | 1983-01-25 | Asahi Glass Company, Ltd. | Encapsulation of electronic device |
GB2133017A (en) * | 1983-01-10 | 1984-07-18 | Bicc Plc | Methods of improving the resistance of insulating surfaces to tracking |
EP1006575A2 (en) * | 1998-12-02 | 2000-06-07 | Kabushiki Kaisha Toshiba | Composition for resin sealing a semiconductor device, resin sealed semiconductor device and method of manufacturing the same |
EP1006575A3 (en) * | 1998-12-02 | 2001-01-10 | Kabushiki Kaisha Toshiba | Composition for resin sealing a semiconductor device, resin sealed semiconductor device and method of manufacturing the same |
US6255739B1 (en) | 1998-12-02 | 2001-07-03 | Kabushiki Kaisha Toshiba | Semiconductor device |
WO2014028548A1 (en) * | 2012-08-15 | 2014-02-20 | Ticona Llc | Directly metallizable polyarylene sulfide composition |
Also Published As
Publication number | Publication date |
---|---|
DE2728233A1 (en) | 1978-01-05 |
JPS535252A (en) | 1978-01-18 |
DE2728233B2 (en) | 1981-01-08 |
CH623842A5 (en) | 1981-06-30 |
CA1102107A (en) | 1981-06-02 |
DE2728233C3 (en) | 1981-10-08 |
AU497588B1 (en) | 1978-12-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
430B | Application (made) for amendment of specification (sect. 30/1949) | ||
PCNP | Patent ceased through non-payment of renewal fee | ||
430 | Proceeding under section 30 patents act 1949 |