GB1518089A - Optical couplers for electronic circuits - Google Patents

Optical couplers for electronic circuits

Info

Publication number
GB1518089A
GB1518089A GB3975974A GB3975974A GB1518089A GB 1518089 A GB1518089 A GB 1518089A GB 3975974 A GB3975974 A GB 3975974A GB 3975974 A GB3975974 A GB 3975974A GB 1518089 A GB1518089 A GB 1518089A
Authority
GB
United Kingdom
Prior art keywords
substrates
edges
transistor
edge
output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3975974A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems Electronics Ltd
Original Assignee
Marconi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Co Ltd filed Critical Marconi Co Ltd
Priority to GB3975974A priority Critical patent/GB1518089A/en
Publication of GB1518089A publication Critical patent/GB1518089A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

1518089 Printed circuits; optical coupler for electronic circuits MARCONI CO Ltd 30 July 1975 [12 Sept 1974] 39759/74 Headings H1K and H1R An optical coupler for interconnecting an input and an output signal comprises (Fig. 1, not shown) a light emissive diode energized through a transistor from an input signal to illuminate aphotodiode whose signal is transistor amplified to produce a proportional output. The coupler comprises two ceramic substrates 20, 22 of which the latter carries transistor TR1 energizing light emitting diode LED on its edge, which illuminates a photodiode PD on the edge of 20 whose output is amplified by transistor TR2; the gap between the edges being filled by clear plastic 18. Metal films defining circuits, e.g. 24, 26 are screen printed on the upper surfaces and edges of the substrates together with the necessary resistors; the conductors being first printed on the surfaces of the substrates and then on to the edges of a pack of such substrates; all cut out by diamond wheels. The diodes are secured to the edges, e.g. by a silver loaded conductive epoxy resin connected to the edge conductors. The substrates are housed in superimposed rectangular frames 12, 14 sandwiching input and output leads 28; to which cover 10 and base 12 are secured; and the unit is then potted in epoxy resin to form a flat pack. In a modification (Fig. 3, not shown) the substrates may carry e.g. 4 similar couplers.
GB3975974A 1975-07-30 1975-07-30 Optical couplers for electronic circuits Expired GB1518089A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3975974A GB1518089A (en) 1975-07-30 1975-07-30 Optical couplers for electronic circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3975974A GB1518089A (en) 1975-07-30 1975-07-30 Optical couplers for electronic circuits

Publications (1)

Publication Number Publication Date
GB1518089A true GB1518089A (en) 1978-07-19

Family

ID=10411330

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3975974A Expired GB1518089A (en) 1975-07-30 1975-07-30 Optical couplers for electronic circuits

Country Status (1)

Country Link
GB (1) GB1518089A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2537825A3 (en) * 1982-12-10 1984-06-15 Thomson Csf Mat Tel Interconnection system for printed-circuit boards
EP0712161A1 (en) * 1994-11-10 1996-05-15 TEMIC TELEFUNKEN microelectronic GmbH Semiconductor assembly for a free space bidirectional optical transmission system
EP3633115A1 (en) 2015-04-15 2020-04-08 Ocado Innovation Limited Robotic storage system and method of providing such robotic storage system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2537825A3 (en) * 1982-12-10 1984-06-15 Thomson Csf Mat Tel Interconnection system for printed-circuit boards
EP0712161A1 (en) * 1994-11-10 1996-05-15 TEMIC TELEFUNKEN microelectronic GmbH Semiconductor assembly for a free space bidirectional optical transmission system
EP3633115A1 (en) 2015-04-15 2020-04-08 Ocado Innovation Limited Robotic storage system and method of providing such robotic storage system

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee