GB1516046A - Full wave rectifier assemblies - Google Patents

Full wave rectifier assemblies

Info

Publication number
GB1516046A
GB1516046A GB19502/76A GB1950276A GB1516046A GB 1516046 A GB1516046 A GB 1516046A GB 19502/76 A GB19502/76 A GB 19502/76A GB 1950276 A GB1950276 A GB 1950276A GB 1516046 A GB1516046 A GB 1516046A
Authority
GB
United Kingdom
Prior art keywords
wave rectifier
diodes
full
full wave
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB19502/76A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PHILCOM ELECTRONICS Ltd
Original Assignee
PHILCOM ELECTRONICS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PHILCOM ELECTRONICS Ltd filed Critical PHILCOM ELECTRONICS Ltd
Priority to GB19502/76A priority Critical patent/GB1516046A/en
Publication of GB1516046A publication Critical patent/GB1516046A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
  • Synchronous Machinery (AREA)

Abstract

1516046 Full-wave rectifier assemblies PHILCOM ELECTRONICS Ltd 10 May 1977 [12 May 1976] 19502/76 Heading H1K In a full-wave rectifier assembly including two conductive terminal plates 4, 5 supporting diodes 14 and mounted transversely of an elongate support member 1 the terminals of the diodes 14 not secured to the plates 4, 5 are connected in pairs (one diode from each plate 4, 5) to conductive elements which are not themselves directly supported by the member 1. In Fig. 1 the conductive elements are conductive areas on an insulating plate 15 and in Fig. 5 they are separate metal plates 21-23. In other embodiments they are located on a plastics moulding which encapsulates the diodes 14.
GB19502/76A 1977-05-10 1977-05-10 Full wave rectifier assemblies Expired GB1516046A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB19502/76A GB1516046A (en) 1977-05-10 1977-05-10 Full wave rectifier assemblies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB19502/76A GB1516046A (en) 1977-05-10 1977-05-10 Full wave rectifier assemblies

Publications (1)

Publication Number Publication Date
GB1516046A true GB1516046A (en) 1978-06-28

Family

ID=10130430

Family Applications (1)

Application Number Title Priority Date Filing Date
GB19502/76A Expired GB1516046A (en) 1977-05-10 1977-05-10 Full wave rectifier assemblies

Country Status (1)

Country Link
GB (1) GB1516046A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2542501A1 (en) * 1983-03-07 1984-09-14 Telemecanique Electrique DEVICE FOR ASSEMBLING ELECTRONIC POWER COMPONENTS ON A THERMAL DISSIPATOR AND APPLICATION

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2542501A1 (en) * 1983-03-07 1984-09-14 Telemecanique Electrique DEVICE FOR ASSEMBLING ELECTRONIC POWER COMPONENTS ON A THERMAL DISSIPATOR AND APPLICATION
EP0119134A1 (en) * 1983-03-07 1984-09-19 Telemecanique Heat sink assembly device for power electronic components and application to monophase or polyphase bridges

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Legal Events

Date Code Title Description
PS Patent sealed
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee