GB1478498A - Joining metal surfaces - Google Patents

Joining metal surfaces

Info

Publication number
GB1478498A
GB1478498A GB4001174A GB4001174A GB1478498A GB 1478498 A GB1478498 A GB 1478498A GB 4001174 A GB4001174 A GB 4001174A GB 4001174 A GB4001174 A GB 4001174A GB 1478498 A GB1478498 A GB 1478498A
Authority
GB
United Kingdom
Prior art keywords
metal
shim
metal surfaces
sept
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4001174A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Post Office
Original Assignee
Post Office
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Post Office filed Critical Post Office
Priority to GB4001174A priority Critical patent/GB1478498A/en
Publication of GB1478498A publication Critical patent/GB1478498A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/14—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams
    • B23K1/18—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams circumferential seams, e.g. of shells

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)

Abstract

1478498 Sealing semiconductor device packages POST OFFICE 12 Sept 1975 [13 Sept 1974] 40011/74 Heading H1K [Also in Division B3] In a method of bonding together two metal surfaces 7, 8, preferably of ceramic substrates each having a Ti-Ni alloy layer plated with Au, a member 5 (e.g. an Au "O"-ring) is positioned, alongside a solder shim 6 (preferably of Au- Ge eutectic alloy), between and in contact with the metal surfaces, heat and pressure are applied, the shim initially preventing excessive stress in the substrates due to engagement with the "O"-ring, and the temperature is raised such that the shim melts and then, due to diffusion of metal from the metal surfaces and the member 5 into the molten shim metal, the metal solidifies, the member 5 impeding flow of metal from the shim. The invention is suitable for sealing integrated circuits and transistors in an argon atmosphere.
GB4001174A 1975-09-12 1975-09-12 Joining metal surfaces Expired GB1478498A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4001174A GB1478498A (en) 1975-09-12 1975-09-12 Joining metal surfaces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4001174A GB1478498A (en) 1975-09-12 1975-09-12 Joining metal surfaces

Publications (1)

Publication Number Publication Date
GB1478498A true GB1478498A (en) 1977-06-29

Family

ID=10412714

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4001174A Expired GB1478498A (en) 1975-09-12 1975-09-12 Joining metal surfaces

Country Status (1)

Country Link
GB (1) GB1478498A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2121598A (en) * 1982-04-27 1983-12-21 Marconi Co Ltd Sealing optoelectronic packages
US4925625A (en) * 1987-10-15 1990-05-15 Tokyo Electric Company, Ltd. Dot print head having a torsion bar with elastic portions
US4976554A (en) * 1987-10-15 1990-12-11 Tokyo Electric Company, Ltd. Release-type dot print head and method of manufacturing the same
US5011308A (en) * 1988-05-10 1991-04-30 Tokyo Electric Co., Ltd. Releasing type dot printer head
US5313371A (en) * 1991-03-04 1994-05-17 Motorola, Inc. Shielding apparatus for non-conductive electronic circuit packages
CN109207752A (en) * 2018-09-26 2019-01-15 云南大学 A kind of AuGe Modeling on Solidificated Structure of Eutectic Alloys regulation method and the alloy material

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2121598A (en) * 1982-04-27 1983-12-21 Marconi Co Ltd Sealing optoelectronic packages
US4925625A (en) * 1987-10-15 1990-05-15 Tokyo Electric Company, Ltd. Dot print head having a torsion bar with elastic portions
US4976554A (en) * 1987-10-15 1990-12-11 Tokyo Electric Company, Ltd. Release-type dot print head and method of manufacturing the same
US5011308A (en) * 1988-05-10 1991-04-30 Tokyo Electric Co., Ltd. Releasing type dot printer head
US5313371A (en) * 1991-03-04 1994-05-17 Motorola, Inc. Shielding apparatus for non-conductive electronic circuit packages
CN109207752A (en) * 2018-09-26 2019-01-15 云南大学 A kind of AuGe Modeling on Solidificated Structure of Eutectic Alloys regulation method and the alloy material

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Legal Events

Date Code Title Description
PS Patent sealed
746 Register noted 'licences of right' (sect. 46/1977)
PCNP Patent ceased through non-payment of renewal fee