GB1471623A - Sputter etching - Google Patents

Sputter etching

Info

Publication number
GB1471623A
GB1471623A GB2803674A GB2803674A GB1471623A GB 1471623 A GB1471623 A GB 1471623A GB 2803674 A GB2803674 A GB 2803674A GB 2803674 A GB2803674 A GB 2803674A GB 1471623 A GB1471623 A GB 1471623A
Authority
GB
United Kingdom
Prior art keywords
articles
plate
support plate
support
etched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2803674A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1471623A publication Critical patent/GB1471623A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
GB2803674A 1973-07-12 1974-06-25 Sputter etching Expired GB1471623A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7326405A FR2237311B1 (https=) 1973-07-12 1973-07-12

Publications (1)

Publication Number Publication Date
GB1471623A true GB1471623A (en) 1977-04-27

Family

ID=9122801

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2803674A Expired GB1471623A (en) 1973-07-12 1974-06-25 Sputter etching

Country Status (5)

Country Link
US (1) US4070264A (https=)
JP (1) JPS5091280A (https=)
DE (1) DE2426880A1 (https=)
FR (1) FR2237311B1 (https=)
GB (1) GB1471623A (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4040891A (en) * 1976-06-30 1977-08-09 Ibm Corporation Etching process utilizing the same positive photoresist layer for two etching steps
US4253907A (en) * 1979-03-28 1981-03-03 Western Electric Company, Inc. Anisotropic plasma etching
US4483478A (en) * 1981-09-11 1984-11-20 Rockwell International Corporation Method for fabricating superplastically formed/diffusion bonded aluminum or aluminum alloy structures
EP0090067B2 (de) 1982-03-31 1991-03-20 Ibm Deutschland Gmbh Reaktor für das reaktive Ionenätzen und Ätzverfahren
US5032310A (en) 1983-08-16 1991-07-16 Interface, Inc. Microbiocidal cleansing and disinfecting formulations and preparation thereof
US4534921A (en) * 1984-03-06 1985-08-13 Asm Fico Tooling, B.V. Method and apparatus for mold cleaning by reverse sputtering
EP0187882B1 (de) * 1985-01-17 1989-04-05 Ibm Deutschland Gmbh Verfahren zur Herstellung von Kontakten mit niedrigem Übergangswiderstand
WO1989003584A1 (en) * 1987-10-14 1989-04-20 Unisearch Limited Multi-electrode vacuum processing chamber
WO1989003899A1 (en) * 1987-10-23 1989-05-05 Unisearch Limited Etching process using metal compounds
US5039376A (en) * 1989-09-19 1991-08-13 Stefan Zukotynski Method and apparatus for the plasma etching, substrate cleaning, or deposition of materials by D.C. glow discharge
GB9603295D0 (en) * 1996-02-16 1996-04-17 Boc Group Plc Process and apparatus for surface cleaning
US11987874B2 (en) * 2019-01-23 2024-05-21 Semiconductor Components Industries, Llc Backside metal formation methods and systems

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3507248A (en) * 1967-06-15 1970-04-21 Ibm Vacuum evaporation coating apparatus including means for precleaning substrates by ion bombardment
US3844924A (en) * 1970-08-03 1974-10-29 Texas Instruments Inc Sputtering apparatus for forming ohmic contacts for semiconductor devices
US3763031A (en) * 1970-10-01 1973-10-02 Cogar Corp Rf sputtering apparatus

Also Published As

Publication number Publication date
FR2237311B1 (https=) 1977-05-13
JPS5091280A (https=) 1975-07-21
FR2237311A1 (https=) 1975-02-07
DE2426880A1 (de) 1975-01-30
US4070264A (en) 1978-01-24

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee