GB1406505A - Paste vehicle and colour paste containing the same - Google Patents
Paste vehicle and colour paste containing the sameInfo
- Publication number
- GB1406505A GB1406505A GB3814472A GB3814472A GB1406505A GB 1406505 A GB1406505 A GB 1406505A GB 3814472 A GB3814472 A GB 3814472A GB 3814472 A GB3814472 A GB 3814472A GB 1406505 A GB1406505 A GB 1406505A
- Authority
- GB
- United Kingdom
- Prior art keywords
- fatty acid
- mixture
- paste
- ester
- colour
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- -1 sorbitan fatty acid ester Chemical class 0.000 abstract 6
- 235000014113 dietary fatty acids Nutrition 0.000 abstract 4
- 239000000194 fatty acid Substances 0.000 abstract 4
- 229930195729 fatty acid Natural products 0.000 abstract 4
- 239000000203 mixture Substances 0.000 abstract 4
- 150000002148 esters Chemical class 0.000 abstract 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 abstract 2
- 229920006395 saturated elastomer Polymers 0.000 abstract 2
- 150000004671 saturated fatty acids Chemical class 0.000 abstract 2
- 235000021122 unsaturated fatty acids Nutrition 0.000 abstract 2
- ZORQXIQZAOLNGE-UHFFFAOYSA-N 1,1-difluorocyclohexane Chemical compound FC1(F)CCCCC1 ZORQXIQZAOLNGE-UHFFFAOYSA-N 0.000 abstract 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 abstract 1
- 239000004147 Sorbitan trioleate Substances 0.000 abstract 1
- PRXRUNOAOLTIEF-ADSICKODSA-N Sorbitan trioleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@H]1OC[C@H](O)[C@H]1OC(=O)CCCCCCC\C=C/CCCCCCCC PRXRUNOAOLTIEF-ADSICKODSA-N 0.000 abstract 1
- 229910000019 calcium carbonate Inorganic materials 0.000 abstract 1
- 229960003563 calcium carbonate Drugs 0.000 abstract 1
- 235000010216 calcium carbonate Nutrition 0.000 abstract 1
- ZMRQTIAUOLVKOX-UHFFFAOYSA-L calcium;diphenoxide Chemical compound [Ca+2].[O-]C1=CC=CC=C1.[O-]C1=CC=CC=C1 ZMRQTIAUOLVKOX-UHFFFAOYSA-L 0.000 abstract 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 abstract 1
- 239000001593 sorbitan monooleate Substances 0.000 abstract 1
- 235000011069 sorbitan monooleate Nutrition 0.000 abstract 1
- 229940035049 sorbitan monooleate Drugs 0.000 abstract 1
- 235000019337 sorbitan trioleate Nutrition 0.000 abstract 1
- 229960000391 sorbitan trioleate Drugs 0.000 abstract 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D17/00—Pigment pastes, e.g. for mixing in paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B67/00—Influencing the physical, e.g. the dyeing or printing properties of dyestuffs without chemical reactions, e.g. by treating with solvents grinding or grinding assistants, coating of pigments or dyes; Process features in the making of dyestuff preparations; Dyestuff preparations of a special physical nature, e.g. tablets, films
- C09B67/0071—Process features in the making of dyestuff preparations; Dehydrating agents; Dispersing agents; Dustfree compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Bipolar Transistors (AREA)
- Wire Bonding (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US19255171A | 1971-10-26 | 1971-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1406505A true GB1406505A (en) | 1975-09-17 |
Family
ID=22710143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3814472A Expired GB1406505A (en) | 1971-10-26 | 1972-08-16 | Paste vehicle and colour paste containing the same |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS4942831B2 (enrdf_load_stackoverflow) |
| CA (1) | CA980509A (enrdf_load_stackoverflow) |
| CH (1) | CH594728A5 (enrdf_load_stackoverflow) |
| GB (1) | GB1406505A (enrdf_load_stackoverflow) |
| HK (1) | HK45576A (enrdf_load_stackoverflow) |
| IT (1) | IT965168B (enrdf_load_stackoverflow) |
| MY (1) | MY7600184A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5123077A (en) * | 1974-08-20 | 1976-02-24 | Matsushita Electronics Corp | Denkyokuriidosenno setsuzokuhoho |
| JPS5348487A (en) * | 1976-10-14 | 1978-05-01 | Fujitsu Ltd | Semiconductor device |
-
1972
- 1972-08-16 GB GB3814472A patent/GB1406505A/en not_active Expired
- 1972-08-31 IT IT6978872A patent/IT965168B/it active
- 1972-10-12 CH CH1491272A patent/CH594728A5/xx not_active IP Right Cessation
- 1972-10-12 JP JP47101669A patent/JPS4942831B2/ja not_active Expired
- 1972-10-19 CA CA154,543A patent/CA980509A/en not_active Expired
-
1976
- 1976-07-15 HK HK455/76*UA patent/HK45576A/xx unknown
- 1976-12-30 MY MY184/76A patent/MY7600184A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4942831B2 (enrdf_load_stackoverflow) | 1974-11-16 |
| CH594728A5 (enrdf_load_stackoverflow) | 1978-01-31 |
| HK45576A (en) | 1976-07-23 |
| MY7600184A (en) | 1976-12-31 |
| CA980509A (en) | 1975-12-30 |
| JPS4857578A (enrdf_load_stackoverflow) | 1973-08-13 |
| IT965168B (it) | 1974-01-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |