GB1387590A - Slicing machine - Google Patents

Slicing machine

Info

Publication number
GB1387590A
GB1387590A GB4005971A GB4005971A GB1387590A GB 1387590 A GB1387590 A GB 1387590A GB 4005971 A GB4005971 A GB 4005971A GB 4005971 A GB4005971 A GB 4005971A GB 1387590 A GB1387590 A GB 1387590A
Authority
GB
United Kingdom
Prior art keywords
rod
cut
slice
saw
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4005971A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Monsanto Ltd
Original Assignee
Monsanto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Ltd filed Critical Monsanto Ltd
Priority to GB4005971A priority Critical patent/GB1387590A/en
Publication of GB1387590A publication Critical patent/GB1387590A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D45/00—Sawing machines or sawing devices with circular saw blades or with friction saw discs
    • B23D45/08—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a ring blade having inside saw teeth
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D47/00—Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts
    • B23D47/04—Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts of devices for feeding, positioning, clamping, or rotating work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

1387590 Severing by abrasion MONSANTO Ltd 20 July 1972 [26 Aug 1971] 40059/71 Heading B3D [Also in Division B5] A method of slicing a rod 24 comprises adheasively bonding one end of the rod to one end of an adapter piece 46, Fig. 1, having at least a portion of the same cross-section as the rod, placing the bonded rod in a rod-holding assembly 2, holding the bonded rod by a clamping means, relatively moving the rod and a saw 54 to slice the rod while supporting the slice being cut with a suction pick-up head, releasing the clamping means, returning the rod or saw, and advancing the rod relative to the saw blade plane in readiness for the next cut. In a machine for performing the method an annular saw 54 having an internal diamond edge is supported and rotated by a hollow spindle 55 mounted in a carriage which is reciprocated by an hydraulic motor 61. The rod holding assembly 2 comprises clamping means in the form of a pair of jaws 21, Fig. 2, which are pivotably supported in a cradle 12 which is itself pivotable about a vertical axis so that slices may be cut from the rod at an angle to the axis thereof. The cradle 12 is movable towards the saw blade plane by an hydraulic cylinder 7, and the rod and adapter piece are moved relative to the jaws 21, when these are open, by an hydraulic cylinder 39, Fig. 1, which moves a rack 38, Fig. 2, to cause rotation of a nut 36 via a one-way clutch 35 and thus cause a lead screw 37 attached to the adapter piece 46 to be advanced by a distance equal to the thickness of a slice plus the saw kerf. The suction pick-up head comprises a grooved rubber pad having a central aperture through which vacuum may be applied or released or air blown. Air is blown to clean the free end of the rod before the head is secured thereto by vacuum, and the vacuum is released to drop a slice cut from the rod into, e.g. a container of water. The cut slice and rod are withdrawn from the plane of the cut before the saw blade is retracted to its initial position.
GB4005971A 1971-08-26 1971-08-26 Slicing machine Expired GB1387590A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4005971A GB1387590A (en) 1971-08-26 1971-08-26 Slicing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4005971A GB1387590A (en) 1971-08-26 1971-08-26 Slicing machine

Publications (1)

Publication Number Publication Date
GB1387590A true GB1387590A (en) 1975-03-19

Family

ID=10412981

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4005971A Expired GB1387590A (en) 1971-08-26 1971-08-26 Slicing machine

Country Status (1)

Country Link
GB (1) GB1387590A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2360488A1 (en) * 1976-08-02 1978-03-03 Philips Nv PLATE REMOVAL DEVICE
US4184472A (en) * 1978-05-15 1980-01-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method and apparatus for slicing crystals
US4346691A (en) * 1972-09-04 1982-08-31 Bourke Patrick T Slab-gripping apparatus
DE102007045455A1 (en) * 2007-09-24 2009-04-09 Schott Ag Process for producing wafers from ingots
DE102008028213A1 (en) * 2008-06-06 2009-12-10 Gebr. Schmid Gmbh & Co. Method for attaching a silicon block to a support therefor and corresponding arrangement
CN102672830A (en) * 2011-03-17 2012-09-19 苏州赫瑞特电子专用设备科技有限公司 Multi-line cutting machine workbench system
CN110639825A (en) * 2019-09-27 2020-01-03 南京信息工程大学 Automatic assembly line of apricot bao mushroom letter sorting based on vision technique
CN111168541A (en) * 2020-01-14 2020-05-19 秦继中 Grinding device for machining
CN118219443A (en) * 2024-05-07 2024-06-21 无锡安鑫卓越智能科技有限公司 Slicing device for semiconductor production

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346691A (en) * 1972-09-04 1982-08-31 Bourke Patrick T Slab-gripping apparatus
FR2360488A1 (en) * 1976-08-02 1978-03-03 Philips Nv PLATE REMOVAL DEVICE
US4184472A (en) * 1978-05-15 1980-01-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method and apparatus for slicing crystals
DE102007045455A1 (en) * 2007-09-24 2009-04-09 Schott Ag Process for producing wafers from ingots
DE102008028213A1 (en) * 2008-06-06 2009-12-10 Gebr. Schmid Gmbh & Co. Method for attaching a silicon block to a support therefor and corresponding arrangement
US8105676B2 (en) 2008-06-06 2012-01-31 Gebr. Schmid Gmbh & Co. Method for fastening a silicon block on a support intended therefor and corresponding arrangement
CN102672830A (en) * 2011-03-17 2012-09-19 苏州赫瑞特电子专用设备科技有限公司 Multi-line cutting machine workbench system
CN110639825A (en) * 2019-09-27 2020-01-03 南京信息工程大学 Automatic assembly line of apricot bao mushroom letter sorting based on vision technique
CN111168541A (en) * 2020-01-14 2020-05-19 秦继中 Grinding device for machining
CN111168541B (en) * 2020-01-14 2021-07-20 大冶市卫峰机械制造有限公司 Grinding device for machining
CN118219443A (en) * 2024-05-07 2024-06-21 无锡安鑫卓越智能科技有限公司 Slicing device for semiconductor production

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee