GB1381192A - Electrodeposition of gold alloys - Google Patents

Electrodeposition of gold alloys

Info

Publication number
GB1381192A
GB1381192A GB1480872A GB1480872A GB1381192A GB 1381192 A GB1381192 A GB 1381192A GB 1480872 A GB1480872 A GB 1480872A GB 1480872 A GB1480872 A GB 1480872A GB 1381192 A GB1381192 A GB 1381192A
Authority
GB
United Kingdom
Prior art keywords
switches
seconds
complex
stepping
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1480872A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of GB1381192A publication Critical patent/GB1381192A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/09—Wave forms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1381192 Semi-conductor circuits SCHERING AG 29 March 1972 [24 April 1971] 14808/72 Heading H3T [Also in Division C7] A gold alloy, e.g. Au-Cu-, Au-Cu-Cd or Au-Ag-Ni-Pd, is electrodeposited by causing to act upon a gold plating electrolyte of constant composition, preferably containing alkali metal (e.g. K) dicyanoaurate-I and one or more complex-bound elements of Group IVa or Va or Group Ib, IIb or VIIb of the Periodic Table or mixtures thereof, a succession of periodically recurring voltage impulses having durations of 10<SP>-3</SP> to 10<SP>-4</SP> seconds preceded by deposition potentials of not less than 0À1 seconds and followed by virtually potential-less periods of 10<SP>-1</SP> to 10<SP>-3</SP> seconds. The amplitudes of the impulses may be the same or different and greater than the deposition potentials by 1 to 5 volts. The complex-bound element may be present in the electrolyte as cyanide with free KCN, or when As, Sb, Sn or Pb, as a hexahydroxy complex. Gold alloys specified are (a) 70-85% Au, 12-22% Cu and 3-8% Cd; and (b) 83-90% Au, 7-11% Ag, 0À5-1À0% Pd and 2À5-5À0% Ni. A variable polarizing voltage for electrodeposition is produced by stepping a switching signal in cyclic succession along conductors with first switches and second switches connected thereto and responsive to the signal to generate respective polarizing voltages and timing signals changing at respective rates, preferably adjusted by potentiometers connected to the switches. An integrator, reset with each stepping of the switching signal, may be connected to the second switches to produce the timing signals.
GB1480872A 1971-04-24 1972-03-29 Electrodeposition of gold alloys Expired GB1381192A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2121150A DE2121150C3 (en) 1971-04-24 1971-04-24 Process for the electrodeposition of gold alloys

Publications (1)

Publication Number Publication Date
GB1381192A true GB1381192A (en) 1975-01-22

Family

ID=5806389

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1480872A Expired GB1381192A (en) 1971-04-24 1972-03-29 Electrodeposition of gold alloys

Country Status (12)

Country Link
US (1) US3749650A (en)
JP (1) JPS544895B1 (en)
AT (1) AT313664B (en)
CA (1) CA984330A (en)
CH (1) CH555412A (en)
DE (1) DE2121150C3 (en)
FR (1) FR2134401B1 (en)
GB (1) GB1381192A (en)
IE (1) IE36303B1 (en)
IT (1) IT951424B (en)
NL (1) NL7205546A (en)
SE (1) SE393821B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009044266A2 (en) * 2007-10-05 2009-04-09 Create New Technology S.R.L. System and method of plating metal alloys by using galvanic technology

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4105527A (en) * 1975-07-07 1978-08-08 Nipki Po Tzvetna Metalurgia Electric system for electric extraction of non-ferrous metals from their solutions
CH629542A5 (en) * 1976-09-01 1982-04-30 Inoue Japax Res METHOD AND DEVICE FOR GALVANIC MATERIAL DEPOSITION.
US4082622A (en) * 1977-04-20 1978-04-04 Gte Automatic Electric Laboratories Incorporated Electrodeposition of ruthenium
JPS5653267A (en) * 1979-09-29 1981-05-12 Takiyasu Kk Production of fancy postdyed fabric
DE3020765A1 (en) * 1980-05-31 1981-12-10 Degussa Ag, 6000 Frankfurt ALKALINE BATH FOR GALVANIC DEPOSITION OF LOW-CARAINE PINK TO YELLOW-COLORED GOLD ALLOY LAYERS
US4343684A (en) * 1980-12-19 1982-08-10 Stanley Lechtzin Method of electroforming and product
US4840711A (en) * 1981-01-13 1989-06-20 Metafuse Limited Process for the fusion of one element into a second element
US4465564A (en) * 1983-06-27 1984-08-14 American Chemical & Refining Company, Inc. Gold plating bath containing tartrate and carbonate salts
CH710184B1 (en) 2007-09-21 2016-03-31 Aliprandini Laboratoires G Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals or metalloids.
EP2312021B1 (en) 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals
US8877630B1 (en) * 2013-11-12 2014-11-04 Chipmos Technologies Inc. Semiconductor structure having a silver alloy bump body and manufacturing method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009044266A2 (en) * 2007-10-05 2009-04-09 Create New Technology S.R.L. System and method of plating metal alloys by using galvanic technology
WO2009044266A3 (en) * 2007-10-05 2010-01-21 Create New Technology S.R.L. System and method of plating metal alloys by using galvanic technology
RU2473718C2 (en) * 2007-10-05 2013-01-27 Криейт Нью Текнолоджи С.Р.Л. System and method for electrolytic application of coating from metal alloys
AU2008306569B2 (en) * 2007-10-05 2013-06-13 Create New Technology S.R.L. System and method of plating metal alloys by using galvanic technology
US8668817B2 (en) 2007-10-05 2014-03-11 Creat New Technology S.R.L. System and method of plating metal alloys by using galvanic technology
CN101889107B (en) * 2007-10-05 2015-09-23 创新科技公司 Use the system and method for electroplating technology plating metal alloys

Also Published As

Publication number Publication date
DE2121150A1 (en) 1972-11-16
SE393821B (en) 1977-05-23
US3749650A (en) 1973-07-31
AT313664B (en) 1974-02-25
NL7205546A (en) 1972-10-26
CA984330A (en) 1976-02-24
DE2121150B2 (en) 1979-12-20
DE2121150C3 (en) 1980-08-21
JPS544895B1 (en) 1979-03-12
FR2134401A1 (en) 1972-12-08
IE36303L (en) 1972-10-24
CH555412A (en) 1974-10-31
IE36303B1 (en) 1976-09-29
IT951424B (en) 1973-06-30
FR2134401B1 (en) 1975-10-24

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee