GB1357066A - Method for debonding - Google Patents
Method for debondingInfo
- Publication number
- GB1357066A GB1357066A GB2356472A GB2356472A GB1357066A GB 1357066 A GB1357066 A GB 1357066A GB 2356472 A GB2356472 A GB 2356472A GB 2356472 A GB2356472 A GB 2356472A GB 1357066 A GB1357066 A GB 1357066A
- Authority
- GB
- United Kingdom
- Prior art keywords
- fixture
- circuit board
- vibrations
- released
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
- H05K13/0491—Hand tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
1357066 Unjointing; soldering INTERNATIONAL BUSINESS MACHINES CORP 19 May 1972 [29 June 1971] 23564/72 Headings B3V and B3R An element bonded to a base is released from the base by ultrasonic vibrations. Soldered connections may be released by the method. As applied to releasing a ground rail 10, Fig. 1, from a circuit board 11, the rail is clamped by screws 14 to a fixture 13 which is attached by a horn 15 to an ultrasonic transducer 16. Springs 17 apply pressure between the fixture and circuit board while the transducer is swept through a range of frequencies or tuned to the resonant frequency, the vibrations being effected to soften the solder and release the connection. If desired, heat may be applied in the region of the bond, or the fixture may be heated or preheated. Axial, lateral or rotary vibrations may be used. A pin may be detached from a circuit board using a connecting socket clamped to the pin by a screw (22), Fig. 2 (not shown). The process may be used to detach a circuit module (Fig. 3).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15803371A | 1971-06-29 | 1971-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1357066A true GB1357066A (en) | 1974-06-19 |
Family
ID=22566435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2356472A Expired GB1357066A (en) | 1971-06-29 | 1972-05-19 | Method for debonding |
Country Status (9)
Country | Link |
---|---|
JP (1) | JPS522111B1 (en) |
AU (1) | AU4245972A (en) |
BR (1) | BR7204264D0 (en) |
CA (1) | CA957908A (en) |
DE (1) | DE2223195C3 (en) |
FR (1) | FR2143967B1 (en) |
GB (1) | GB1357066A (en) |
IT (1) | IT953758B (en) |
SE (1) | SE388322B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5148969A (en) * | 1991-11-27 | 1992-09-22 | Digital Equipment Corporation | Component reclamation apparatus and method |
GB2364011A (en) * | 2000-06-21 | 2002-01-16 | Michael John Radley Young | Ultrasonic cutting tool |
US7770838B2 (en) | 2004-07-15 | 2010-08-10 | Sms Siemag Aktiengesellschaft | Method of and device for reducing the static friction between a reel and a coil |
US10072525B2 (en) | 2014-09-16 | 2018-09-11 | Rolls-Royce Plc | Gas turbine engine |
WO2021103965A1 (en) * | 2019-11-26 | 2021-06-03 | 惠州市成泰自动化科技有限公司 | Synchronous pin detachment mechanism |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4159074A (en) * | 1976-05-12 | 1979-06-26 | Basseches Mark T | Desoldering method |
US5478009A (en) * | 1994-08-10 | 1995-12-26 | International Business Machines Corporation | Selective removal of a single solder ball from an array of solder balls |
-
1972
- 1972-03-29 CA CA138,508A patent/CA957908A/en not_active Expired
- 1972-04-26 IT IT2351972A patent/IT953758B/en active
- 1972-05-12 DE DE19722223195 patent/DE2223195C3/en not_active Expired
- 1972-05-18 AU AU42459/72A patent/AU4245972A/en not_active Expired
- 1972-05-19 GB GB2356472A patent/GB1357066A/en not_active Expired
- 1972-05-26 SE SE691472A patent/SE388322B/en unknown
- 1972-06-06 JP JP47055694A patent/JPS522111B1/ja active Pending
- 1972-06-27 FR FR7224038A patent/FR2143967B1/fr not_active Expired
- 1972-06-29 BR BR426472A patent/BR7204264D0/en unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5148969A (en) * | 1991-11-27 | 1992-09-22 | Digital Equipment Corporation | Component reclamation apparatus and method |
GB2364011A (en) * | 2000-06-21 | 2002-01-16 | Michael John Radley Young | Ultrasonic cutting tool |
US7770838B2 (en) | 2004-07-15 | 2010-08-10 | Sms Siemag Aktiengesellschaft | Method of and device for reducing the static friction between a reel and a coil |
US10072525B2 (en) | 2014-09-16 | 2018-09-11 | Rolls-Royce Plc | Gas turbine engine |
WO2021103965A1 (en) * | 2019-11-26 | 2021-06-03 | 惠州市成泰自动化科技有限公司 | Synchronous pin detachment mechanism |
Also Published As
Publication number | Publication date |
---|---|
DE2223195A1 (en) | 1973-01-11 |
CA957908A (en) | 1974-11-19 |
BR7204264D0 (en) | 1973-05-17 |
FR2143967B1 (en) | 1974-07-26 |
AU4245972A (en) | 1973-11-22 |
FR2143967A1 (en) | 1973-02-09 |
JPS522111B1 (en) | 1977-01-19 |
IT953758B (en) | 1973-08-10 |
SE388322B (en) | 1976-09-27 |
DE2223195B2 (en) | 1973-05-17 |
DE2223195C3 (en) | 1973-12-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100324652B1 (en) | Ultrasonic vibration bonding method | |
US2436830A (en) | Transmission system and method | |
GB1357066A (en) | Method for debonding | |
JPS63104512A (en) | Sealing structure for piezoelectric resonator | |
US2343738A (en) | Piezoelectric crystal mounting | |
US3257704A (en) | Method of mounting high frequency piezoelectric crystals | |
JPH08227924A (en) | Device for testing integrated circuit | |
JP2002289644A (en) | Method for joining semiconductor element and joining apparatus | |
JPH0957467A (en) | Resonator for ultrasonic joining | |
JPH11297766A (en) | Solder bump bonding device and method therefor | |
JP2509098Y2 (en) | Semiconductor device | |
SU1687390A1 (en) | Method for dismantling radio components glued to printed circuit board | |
JP2000176654A (en) | Ultrasonic vibration welding method | |
JPH03270032A (en) | Wireless pga bonder | |
JPH01136344A (en) | Mounting structure of semiconductor chip | |
JPH08330884A (en) | Chip-type piezoelectric vibration component and its manufacture | |
JPS5841796B2 (en) | connection device | |
JPH05235117A (en) | Manufacture of semiconductor device | |
JPS55140232A (en) | Method for bonding thin piece to mounting plate | |
JPH065659A (en) | Mounting method of semiconductor element | |
SU848217A1 (en) | Apparatus for producing pressure at diffusion welding | |
JP2004207589A (en) | Method for mounting electronic part, substrate, and circuit board | |
JPS57212814A (en) | Supporting body for flat-shaped oscillator | |
JP2996202B2 (en) | Semiconductor device and manufacturing method thereof | |
JPH02285652A (en) | Semiconductor bonding device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |