GB1357066A - Method for debonding - Google Patents

Method for debonding

Info

Publication number
GB1357066A
GB1357066A GB2356472A GB2356472A GB1357066A GB 1357066 A GB1357066 A GB 1357066A GB 2356472 A GB2356472 A GB 2356472A GB 2356472 A GB2356472 A GB 2356472A GB 1357066 A GB1357066 A GB 1357066A
Authority
GB
United Kingdom
Prior art keywords
fixture
circuit board
vibrations
released
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2356472A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1357066A publication Critical patent/GB1357066A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0486Replacement and removal of components
    • H05K13/0491Hand tools therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/018Unsoldering; Removal of melted solder or other residues
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/16Fastening of connecting parts to base or case; Insulating connecting parts from base or case
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

1357066 Unjointing; soldering INTERNATIONAL BUSINESS MACHINES CORP 19 May 1972 [29 June 1971] 23564/72 Headings B3V and B3R An element bonded to a base is released from the base by ultrasonic vibrations. Soldered connections may be released by the method. As applied to releasing a ground rail 10, Fig. 1, from a circuit board 11, the rail is clamped by screws 14 to a fixture 13 which is attached by a horn 15 to an ultrasonic transducer 16. Springs 17 apply pressure between the fixture and circuit board while the transducer is swept through a range of frequencies or tuned to the resonant frequency, the vibrations being effected to soften the solder and release the connection. If desired, heat may be applied in the region of the bond, or the fixture may be heated or preheated. Axial, lateral or rotary vibrations may be used. A pin may be detached from a circuit board using a connecting socket clamped to the pin by a screw (22), Fig. 2 (not shown). The process may be used to detach a circuit module (Fig. 3).
GB2356472A 1971-06-29 1972-05-19 Method for debonding Expired GB1357066A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15803371A 1971-06-29 1971-06-29

Publications (1)

Publication Number Publication Date
GB1357066A true GB1357066A (en) 1974-06-19

Family

ID=22566435

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2356472A Expired GB1357066A (en) 1971-06-29 1972-05-19 Method for debonding

Country Status (9)

Country Link
JP (1) JPS522111B1 (en)
AU (1) AU4245972A (en)
BR (1) BR7204264D0 (en)
CA (1) CA957908A (en)
DE (1) DE2223195C3 (en)
FR (1) FR2143967B1 (en)
GB (1) GB1357066A (en)
IT (1) IT953758B (en)
SE (1) SE388322B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5148969A (en) * 1991-11-27 1992-09-22 Digital Equipment Corporation Component reclamation apparatus and method
GB2364011A (en) * 2000-06-21 2002-01-16 Michael John Radley Young Ultrasonic cutting tool
US7770838B2 (en) 2004-07-15 2010-08-10 Sms Siemag Aktiengesellschaft Method of and device for reducing the static friction between a reel and a coil
US10072525B2 (en) 2014-09-16 2018-09-11 Rolls-Royce Plc Gas turbine engine
WO2021103965A1 (en) * 2019-11-26 2021-06-03 惠州市成泰自动化科技有限公司 Synchronous pin detachment mechanism

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4159074A (en) * 1976-05-12 1979-06-26 Basseches Mark T Desoldering method
US5478009A (en) * 1994-08-10 1995-12-26 International Business Machines Corporation Selective removal of a single solder ball from an array of solder balls

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5148969A (en) * 1991-11-27 1992-09-22 Digital Equipment Corporation Component reclamation apparatus and method
GB2364011A (en) * 2000-06-21 2002-01-16 Michael John Radley Young Ultrasonic cutting tool
US7770838B2 (en) 2004-07-15 2010-08-10 Sms Siemag Aktiengesellschaft Method of and device for reducing the static friction between a reel and a coil
US10072525B2 (en) 2014-09-16 2018-09-11 Rolls-Royce Plc Gas turbine engine
WO2021103965A1 (en) * 2019-11-26 2021-06-03 惠州市成泰自动化科技有限公司 Synchronous pin detachment mechanism

Also Published As

Publication number Publication date
DE2223195A1 (en) 1973-01-11
CA957908A (en) 1974-11-19
BR7204264D0 (en) 1973-05-17
FR2143967B1 (en) 1974-07-26
AU4245972A (en) 1973-11-22
FR2143967A1 (en) 1973-02-09
JPS522111B1 (en) 1977-01-19
IT953758B (en) 1973-08-10
SE388322B (en) 1976-09-27
DE2223195B2 (en) 1973-05-17
DE2223195C3 (en) 1973-12-13

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee