JPH02285652A - Semiconductor bonding device - Google Patents

Semiconductor bonding device

Info

Publication number
JPH02285652A
JPH02285652A JP1108444A JP10844489A JPH02285652A JP H02285652 A JPH02285652 A JP H02285652A JP 1108444 A JP1108444 A JP 1108444A JP 10844489 A JP10844489 A JP 10844489A JP H02285652 A JPH02285652 A JP H02285652A
Authority
JP
Japan
Prior art keywords
bonding
specimen stage
semiconductor chip
fabric
well
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1108444A
Other languages
Japanese (ja)
Inventor
Shoichi Ishiwatari
Original Assignee
Chiyouonpa Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chiyouonpa Kogyo Kk filed Critical Chiyouonpa Kogyo Kk
Priority to JP1108444A priority Critical patent/JPH02285652A/en
Publication of JPH02285652A publication Critical patent/JPH02285652A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

PURPOSE: To enable the bonded part between an electrode pad on a semiconductor chip and leads of a circuit substrate to be evenly ultrasonic-oscillated as well as both bonding pressure and heating temperature to be reduced sufficiently by a method wherein a bonding device is provided with a specimen stage ultrasonic oscillating the semiconductor chip in the thickness direction as well as a tape type fabric closely adhering to the specimen stage.
CONSTITUTION: A bonding device collectively bonding electrode pads 12 of a semiconductor chip 13 to leads 22 of circuit substrates 21 is provided with a specimen stage 10 and tape-like fabric 11 closely adhering to the specimen stage 10. For example, as for the said tape-like fabric 11, a fabric comprising carbon fiber, polyimide base fiber, glass fiber etc. in high thermal resistance durable for repeated application in applicable temperature zone as well as high elastic limit of the fabrics themselves is applicable. A bonding tool 14 is arranged above the specimen stage 10 opposing to the semiconductor chip 13. The bonding tool 14 is fixed to a tool holder 15 reciprocated in the vertical direction by a reciprocating mechanism 16 such as a plunger, etc., while the bonding tool 14 is provided with a heater 18.
COPYRIGHT: (C)1990,JPO&Japio
JP1108444A 1989-04-27 1989-04-27 Semiconductor bonding device Pending JPH02285652A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1108444A JPH02285652A (en) 1989-04-27 1989-04-27 Semiconductor bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1108444A JPH02285652A (en) 1989-04-27 1989-04-27 Semiconductor bonding device

Publications (1)

Publication Number Publication Date
JPH02285652A true JPH02285652A (en) 1990-11-22

Family

ID=14484935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1108444A Pending JPH02285652A (en) 1989-04-27 1989-04-27 Semiconductor bonding device

Country Status (1)

Country Link
JP (1) JPH02285652A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005142537A (en) * 2003-10-15 2005-06-02 Bondotekku:Kk Longitudinal vibration bonding method and device
US10478915B2 (en) * 2016-07-12 2019-11-19 Ultex Corporation Joining method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005142537A (en) * 2003-10-15 2005-06-02 Bondotekku:Kk Longitudinal vibration bonding method and device
US10478915B2 (en) * 2016-07-12 2019-11-19 Ultex Corporation Joining method

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