GB1350070A - Relectrolytic deposition of metals - Google Patents

Relectrolytic deposition of metals

Info

Publication number
GB1350070A
GB1350070A GB1350070DA GB1350070A GB 1350070 A GB1350070 A GB 1350070A GB 1350070D A GB1350070D A GB 1350070DA GB 1350070 A GB1350070 A GB 1350070A
Authority
GB
Grant status
Application
Patent type
Prior art keywords
springs
ends
metal
block
cu
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas

Abstract

1350070 Electroplating the ends of electrical contact springs INTERNATIONAL COMPUTERS Ltd 10 June 1971 [23 Sept 1970] 45195/70 Heading C7B In electroplating the ends of electrical contact springs 7 mounted in a block 6 of resilient insulating material, the springs are contacted at one end by a plating electrolyte 13 with an anode 12 immersed therein and cathodic contact is made with the other ends of the springs by an electrically conductive liquid 10 with a cathode 9 immersed therein. The block 6 carrying the springs 7 is mounted in an aperture 5 in a wall 2 which separates the electrolyte 13 and the liquid 10 within a tank 1. The tank 1 and wall 2 are of, or covered with, insulating material. The springs 7 are of Be-Cu. The liquid 10 is a solution of Na 2 CO 3 , Na 3 PO 4 , NaOH and surface active agent and is at a#H of 12À5, specific gravity of 1À2 and temperature of 50‹C. The plating electrolyte 13 contains the metal to be electrodeposited, e.g. Cu is deposited from CuSO 4 . The electrodeposition is at 200 amps/sq ft and the metal is deposited over the spring ends as domes. More than one layer of metal may be electrodeposited, e.g. (a) Cu followed by Au or (b) Ni followed by Ag. The electrodes are of C, Pt or platinized Ti. Alternatively the anode may be of the metal to be deposited. After plating the contact springs at one end, the block may be reversed in the aperture 5 to plate the opposite ends of the springs.
GB1350070A 1970-09-23 1970-09-23 Relectrolytic deposition of metals Expired GB1350070A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4519570 1970-09-23

Publications (1)

Publication Number Publication Date
GB1350070A true true GB1350070A (en) 1974-04-18

Family

ID=10436251

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1350070A Expired GB1350070A (en) 1970-09-23 1970-09-23 Relectrolytic deposition of metals

Country Status (2)

Country Link
FR (1) FR2107903A1 (en)
GB (1) GB1350070A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4042480A (en) * 1973-10-04 1977-08-16 Noz Francis X Apparatus for selectively applying a metal coating to the metallic parts of elements which pass through an insulator
DE3114181A1 (en) * 1980-05-07 1982-01-28 Perkin Elmer Corp Beruehrungsfreie technology for galvanic roentgenstrahllithographie
WO2000059008A2 (en) * 1999-03-30 2000-10-05 Nutool, Inc. Method and apparatus for forming an electrical contact with a semiconductor substrate
US7427337B2 (en) 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4042480A (en) * 1973-10-04 1977-08-16 Noz Francis X Apparatus for selectively applying a metal coating to the metallic parts of elements which pass through an insulator
DE3114181A1 (en) * 1980-05-07 1982-01-28 Perkin Elmer Corp Beruehrungsfreie technology for galvanic roentgenstrahllithographie
US7427337B2 (en) 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing
WO2000059008A2 (en) * 1999-03-30 2000-10-05 Nutool, Inc. Method and apparatus for forming an electrical contact with a semiconductor substrate
WO2000059008A3 (en) * 1999-03-30 2001-02-15 Nutool Inc Method and apparatus for forming an electrical contact with a semiconductor substrate
US6251235B1 (en) 1999-03-30 2001-06-26 Nutool, Inc. Apparatus for forming an electrical contact with a semiconductor substrate
US6958114B2 (en) 1999-03-30 2005-10-25 Asm Nutool, Inc. Method and apparatus for forming an electrical contact with a semiconductor substrate
US7309407B2 (en) 1999-03-30 2007-12-18 Novellus Systems, Inc. Method and apparatus for forming an electrical contact with a semiconductor substrate

Also Published As

Publication number Publication date Type
FR2107903A1 (en) 1972-05-12 application

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee