GB1328185A - Method of joining electrically conducting bodies - Google Patents

Method of joining electrically conducting bodies

Info

Publication number
GB1328185A
GB1328185A GB481172A GB1328185DA GB1328185A GB 1328185 A GB1328185 A GB 1328185A GB 481172 A GB481172 A GB 481172A GB 1328185D A GB1328185D A GB 1328185DA GB 1328185 A GB1328185 A GB 1328185A
Authority
GB
United Kingdom
Prior art keywords
bodies
melting material
plates
germanium
joined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB481172A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chernetsky T P
Original Assignee
Chernetsky T P
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chernetsky T P filed Critical Chernetsky T P
Publication of GB1328185A publication Critical patent/GB1328185A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0004—Resistance soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • H10P10/12—
    • H10P10/128—
    • H10W72/073—
    • H10W72/07336—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Ceramic Products (AREA)
GB481172A 1972-02-02 1972-02-02 Method of joining electrically conducting bodies Expired GB1328185A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB481172 1972-02-02
FR7204383A FR2170955B1 (enExample) 1972-02-02 1972-02-09
US22865272A 1972-02-23 1972-02-23
US355293A US3870850A (en) 1972-02-02 1973-04-27 Method of connecting electrically conducting bodies

Publications (1)

Publication Number Publication Date
GB1328185A true GB1328185A (en) 1973-08-30

Family

ID=27446155

Family Applications (1)

Application Number Title Priority Date Filing Date
GB481172A Expired GB1328185A (en) 1972-02-02 1972-02-02 Method of joining electrically conducting bodies

Country Status (3)

Country Link
US (1) US3870850A (enExample)
FR (1) FR2170955B1 (enExample)
GB (1) GB1328185A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138208A (en) * 1983-04-08 1984-10-17 Telecommunications Sa Photovoltaic detector in optical immersion
EP0284817A1 (de) * 1987-04-03 1988-10-05 BBC Brown Boveri AG Verfahren zum Herstellen von Halbleiterbauelementen

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2943243C3 (de) * 1979-10-23 1982-04-01 Zschimmer, Gero, 8000 München Verfahren zum Verlöten von Teilen und Vorrichtung zu dessen Durchführung
US4381598A (en) * 1981-06-11 1983-05-03 General Electric Company Method of making anode and cathode connections for electromigration
US4542397A (en) * 1984-04-12 1985-09-17 Xerox Corporation Self aligning small scale integrated circuit semiconductor chips to form large area arrays
US4990462A (en) * 1989-04-12 1991-02-05 Advanced Micro Devices, Inc. Method for coplanar integration of semiconductor ic devices
US5075253A (en) * 1989-04-12 1991-12-24 Advanced Micro Devices, Inc. Method of coplanar integration of semiconductor IC devices
US6864570B2 (en) * 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
FR2895831B1 (fr) * 2006-01-03 2009-06-12 Alcatel Sa Source compacte a faisceau de rayons x de tres grande brillance
US8283566B2 (en) * 2009-03-14 2012-10-09 Palo Alto Research Center Incorporated Printed circuit boards by massive parallel assembly

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3427460A (en) * 1964-09-10 1969-02-11 Rca Corp Beam-of-light transistor utilizing p-n junctions which are non-abrupt and non-tunneling with a base region of degenerate material
US3374530A (en) * 1965-07-16 1968-03-26 Gen Dynamics Corp Process for the joinder of metallic members
US3660632A (en) * 1970-06-17 1972-05-02 Us Navy Method for bonding silicon chips to a cold substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138208A (en) * 1983-04-08 1984-10-17 Telecommunications Sa Photovoltaic detector in optical immersion
EP0284817A1 (de) * 1987-04-03 1988-10-05 BBC Brown Boveri AG Verfahren zum Herstellen von Halbleiterbauelementen
US4856702A (en) * 1987-04-03 1989-08-15 Bbc Brown Boveri Ag Method for manufacturing semiconductor components

Also Published As

Publication number Publication date
US3870850A (en) 1975-03-11
FR2170955A1 (enExample) 1973-09-21
FR2170955B1 (enExample) 1975-10-24

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee