GB1322963A - Cutting apparatus for semiconductor materials - Google Patents
Cutting apparatus for semiconductor materialsInfo
- Publication number
- GB1322963A GB1322963A GB5890370A GB5890370A GB1322963A GB 1322963 A GB1322963 A GB 1322963A GB 5890370 A GB5890370 A GB 5890370A GB 5890370 A GB5890370 A GB 5890370A GB 1322963 A GB1322963 A GB 1322963A
- Authority
- GB
- United Kingdom
- Prior art keywords
- cutting
- carriage
- workpiece
- block
- adjustable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005520 cutting process Methods 0.000 title abstract 13
- 239000000463 material Substances 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 2
- 229910002804 graphite Inorganic materials 0.000 abstract 2
- 239000010439 graphite Substances 0.000 abstract 2
- 239000002002 slurry Substances 0.000 abstract 2
- 229910000639 Spring steel Inorganic materials 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 229910003460 diamond Inorganic materials 0.000 abstract 1
- 239000010432 diamond Substances 0.000 abstract 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 abstract 1
- 125000006850 spacer group Chemical group 0.000 abstract 1
- 239000002699 waste material Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US88927769A | 1969-12-30 | 1969-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1322963A true GB1322963A (en) | 1973-07-11 |
Family
ID=25394846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB5890370A Expired GB1322963A (en) | 1969-12-30 | 1970-12-11 | Cutting apparatus for semiconductor materials |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3674004A (forum.php) |
| JP (1) | JPS4927980B1 (forum.php) |
| CA (1) | CA953210A (forum.php) |
| DE (1) | DE2061135C3 (forum.php) |
| FR (1) | FR2072115B1 (forum.php) |
| GB (1) | GB1322963A (forum.php) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108162026A (zh) * | 2018-01-04 | 2018-06-15 | 重庆市荣记三民斋桃片有限公司 | 桃片切片装置 |
| CN112543606A (zh) * | 2018-07-31 | 2021-03-23 | 帝斯曼知识产权资产管理有限公司 | 监测床垫质量的方法 |
| CN113650180A (zh) * | 2021-05-24 | 2021-11-16 | 无锡斯达新能源科技股份有限公司 | 双线硅棒截断机 |
| CN114670344A (zh) * | 2022-03-25 | 2022-06-28 | 中国人民大学 | 高定向热解石墨单晶的无损解理装置及方法 |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4105012A (en) * | 1975-08-20 | 1978-08-08 | Siemens Aktiengesellschaft | Apparatus for cutting up hard and brittle material |
| US4019886A (en) * | 1975-12-12 | 1977-04-26 | International Business Machines Corporation | Method of manufacture of multiple glass nozzle arrays |
| CH614151A5 (forum.php) * | 1976-12-27 | 1979-11-15 | Meyer & Burger Maschinenfabrik | |
| US4167174A (en) * | 1977-12-08 | 1979-09-11 | General Signal Corporation | Method and apparatus for aligning the streets of a semiconductor wafer |
| US4557599A (en) * | 1984-03-06 | 1985-12-10 | General Signal Corporation | Calibration and alignment target plate |
| US5154022A (en) * | 1991-06-21 | 1992-10-13 | International Business Machines Corporation | High precision micromachining of very fine features |
| DE9310754U1 (de) * | 1993-07-17 | 1994-11-17 | DIABÜ-Diamantwerkzeuge Heinz Büttner GmbH, 35713 Eschenburg | Trennvorrichtung mit ringförmiger Trennscheibe |
| US5711287A (en) * | 1996-08-14 | 1998-01-27 | Speer; Radleigh J. | Reciprocating slurry saw |
| US20080136955A1 (en) * | 1996-09-27 | 2008-06-12 | Tessera North America. | Integrated camera and associated methods |
| US8153957B2 (en) * | 1996-09-27 | 2012-04-10 | Digitaloptics Corporation East | Integrated optical imaging systems including an interior space between opposing substrates and associated methods |
| US6235141B1 (en) | 1996-09-27 | 2001-05-22 | Digital Optics Corporation | Method of mass producing and packaging integrated optical subsystems |
| US6096155A (en) | 1996-09-27 | 2000-08-01 | Digital Optics Corporation | Method of dicing wafer level integrated multiple optical elements |
| US6669803B1 (en) | 1997-10-03 | 2003-12-30 | Digital Optics Corp. | Simultaneous provision of controlled height bonding material at a wafer level and associated structures |
| US6319103B1 (en) * | 2000-02-25 | 2001-11-20 | Dongbu Electronics Co., Ltd. | Chemical mechanical polishing apparatus |
| US20070110361A1 (en) * | 2003-08-26 | 2007-05-17 | Digital Optics Corporation | Wafer level integration of multiple optical elements |
| US20100175834A1 (en) * | 2009-01-13 | 2010-07-15 | Shin-Kan Liu | Wafer splitting laminate mechanism |
| CN103302754B (zh) * | 2013-06-19 | 2015-02-11 | 中国有色桂林矿产地质研究院有限公司 | 金刚石线锯切割方法及切割设备 |
| CN105666573B (zh) * | 2016-04-02 | 2017-09-29 | 朱增伟 | 凉粉切开器 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1746737A (en) * | 1926-10-26 | 1930-02-11 | Fred R Patch | Stone-sawing machine |
| US1739214A (en) * | 1927-10-26 | 1929-12-10 | Amy F Darling | Meat tenderer |
| GB283458A (en) * | 1927-11-04 | 1928-01-12 | John Henry Hathaway | A new or improved tool for cutting leather or other sheet material into strips |
| US2556167A (en) * | 1945-05-18 | 1951-06-12 | Joseph E Coleman | Crystal analysis apparatus |
| US2774194A (en) * | 1954-11-08 | 1956-12-18 | Charles J Thatcher | Ultrasonic tools |
| US2813377A (en) * | 1955-08-25 | 1957-11-19 | Raytheon Mfg Co | Multiple slicing tools |
| US3079908A (en) * | 1960-11-22 | 1963-03-05 | Norton Co | Multiple blade power hacksaw |
| US3326071A (en) * | 1965-03-19 | 1967-06-20 | Norton Co | Dicing machine |
| US3383768A (en) * | 1966-07-11 | 1968-05-21 | Glen V. Hamilton | Letter opener |
| US3545325A (en) * | 1969-02-28 | 1970-12-08 | Aerojet General Co | Cutting apparatus |
-
1969
- 1969-12-30 US US889277A patent/US3674004A/en not_active Expired - Lifetime
-
1970
- 1970-11-26 FR FR707043243A patent/FR2072115B1/fr not_active Expired
- 1970-12-11 DE DE702061135A patent/DE2061135C3/de not_active Expired
- 1970-12-11 GB GB5890370A patent/GB1322963A/en not_active Expired
- 1970-12-16 CA CA100,732A patent/CA953210A/en not_active Expired
- 1970-12-17 JP JP11260270A patent/JPS4927980B1/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108162026A (zh) * | 2018-01-04 | 2018-06-15 | 重庆市荣记三民斋桃片有限公司 | 桃片切片装置 |
| CN112543606A (zh) * | 2018-07-31 | 2021-03-23 | 帝斯曼知识产权资产管理有限公司 | 监测床垫质量的方法 |
| US11490740B2 (en) | 2018-07-31 | 2022-11-08 | Covestro (Netherlands) B.V. | Method of monitoring the quality of a mattress |
| CN113650180A (zh) * | 2021-05-24 | 2021-11-16 | 无锡斯达新能源科技股份有限公司 | 双线硅棒截断机 |
| CN114670344A (zh) * | 2022-03-25 | 2022-06-28 | 中国人民大学 | 高定向热解石墨单晶的无损解理装置及方法 |
| CN114670344B (zh) * | 2022-03-25 | 2023-10-31 | 中国人民大学 | 高定向热解石墨单晶的无损解理装置及方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2072115A1 (forum.php) | 1971-09-24 |
| JPS4927980B1 (forum.php) | 1974-07-23 |
| FR2072115B1 (forum.php) | 1974-06-21 |
| DE2061135B2 (de) | 1978-06-29 |
| DE2061135A1 (de) | 1971-07-15 |
| CA953210A (en) | 1974-08-20 |
| US3674004A (en) | 1972-07-04 |
| DE2061135C3 (de) | 1979-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |