GB1321604A - Bonding a substrate to polymeric material - Google Patents
Bonding a substrate to polymeric materialInfo
- Publication number
- GB1321604A GB1321604A GB3381869A GB1321604DA GB1321604A GB 1321604 A GB1321604 A GB 1321604A GB 3381869 A GB3381869 A GB 3381869A GB 1321604D A GB1321604D A GB 1321604DA GB 1321604 A GB1321604 A GB 1321604A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copolymer
- ethylene
- substrate
- polymeric material
- polypropylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
- C03C17/32—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/28—Non-macromolecular organic substances
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
1321604 Coatings DUNLOP HOLDINGS Ltd 1 July 1970 [4 July 1969] 33818/69 Addition to 1255777 Heading B2E A method of bonding a substrate to a polymeric material comprises contacting the substrate with the polymeric material in the presence of (a) a polyhydroxy compound having the general formula: in which R 1 to R 14 are hydrogen atoms, hydroxyl, alkyl, allyl, aryl, or aralkyl groups, at least one of R 1 to R 5 and at least one of R 6 to R 10 being a hydroxyl group, and at least one ortho- or para-position in each ring relative to a hydroxyl group being occupied by a hydrogen atom and (b) a compound capable of reacting with a polyhydroxy compound to form a formaldehyde condensation resin and heating the resulting assembly to cause the resin-forming compounds to react. Numerous suitable polyhydroxy compounds are specified such as 2, 2-bis (4-hydroxyphenyl) propane, 4, 4'-dihydroxy-tetraphenyl methane and sym-bis (4-hydroxyphenyl) ethane. Suitable polymeric materials are polyvinyl chloride, polyvinyl acetate, vinyl chloride/vinyl acetate copolymer, ethylene/vinyl acetate copolymer, ethylene/ ethyl acrylate copolymer, polyethylene, ethylene/polypropylene copolymer, polyurethanes and ionomers such as ethylene/sodium methacrylate copolymer. Polymeric material may also be based on a block copolymer, such as an elastomeric block copolymer of general formula A-(B-A) n in which A represents a non-elastomeric block having a second-order transition temperature greater than 25‹C. and a number average molecular weight of 200-2,000 and B is an elastomeric polymer block of glass-transition temperature of less than 10‹C. and a number average molecular weight of 25,000-1,000,000 and n is an integer of from 1 to 10. An exemplified material consists of a polyvinyl chloride/nitrile rubber blend. The resin may be formed by reaction of a methylene donating compound such as hexamethoxymethyl melamine, ethyloxymethyl pyridinium chloride and trioxan hexamethylol melamine. The preferred formaldehyde-generator is formaldehyde. The formaldehydegenerator may be in the form of microencapsulated particles. Numerous suitable sheathing materials are listed such as ethyl cellulose, polypropylene, ethylene propylene copolymer, cyolized natural rubber and polycarbonate. Fillers such as silica, pigments and other articles may be present. The substrate may be of metal, glass or a textile material such as polypropylene, polyamide or polyester fibres.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3381869 | 1969-07-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1321604A true GB1321604A (en) | 1973-06-27 |
Family
ID=10357863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3381869A Expired GB1321604A (en) | 1969-07-04 | 1969-07-04 | Bonding a substrate to polymeric material |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS5031572B1 (en) |
GB (1) | GB1321604A (en) |
-
1969
- 1969-07-04 GB GB3381869A patent/GB1321604A/en not_active Expired
-
1970
- 1970-07-04 JP JP45058684A patent/JPS5031572B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS5031572B1 (en) | 1975-10-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLE | Entries relating assignments, transmissions, licences in the register of patents | ||
PLE | Entries relating assignments, transmissions, licences in the register of patents | ||
PCNP | Patent ceased through non-payment of renewal fee |