GB1315646A - Method of polishing hard articles - Google Patents

Method of polishing hard articles

Info

Publication number
GB1315646A
GB1315646A GB412072A GB412072A GB1315646A GB 1315646 A GB1315646 A GB 1315646A GB 412072 A GB412072 A GB 412072A GB 412072 A GB412072 A GB 412072A GB 1315646 A GB1315646 A GB 1315646A
Authority
GB
United Kingdom
Prior art keywords
grains
polishing
substratum
layer
articles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB412072A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1315646A publication Critical patent/GB1315646A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08—Circular back-plates for carrying flexible material
    • B24D9/10—Circular back-plates for carrying flexible material with suction means for securing the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/02—Wheels in one piece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

1315646 Polishing PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 28 Jan 1972 [2 Feb 1971] 4120/72 Heading B3D A method of polishing hard articles, such as recording and/or playback heads for recorders, comprises providing a comparatively thin layer of soft material on a hard non-deformable substratum, distributing polishing grains on the layer, and polishing the articles, the layer being a foil of synthetic resin having a thickness of at most 10 times the dimensions of the grains and being present loosely on the substratum on which it is held by negative pressure. The projected surface of all the grains is smaller than 10% of the surface of the foil which has a penetrability for the grains 10 times larger than the penetrability of the workpiece for the grains to reduce the influence of variation in grain size. The negative pressure is applied through narrow ducts in the substratum.
GB412072A 1971-02-02 1972-01-28 Method of polishing hard articles Expired GB1315646A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7101327A NL7101327A (en) 1971-02-02 1971-02-02

Publications (1)

Publication Number Publication Date
GB1315646A true GB1315646A (en) 1973-05-02

Family

ID=19812382

Family Applications (1)

Application Number Title Priority Date Filing Date
GB412072A Expired GB1315646A (en) 1971-02-02 1972-01-28 Method of polishing hard articles

Country Status (5)

Country Link
CA (1) CA961644A (en)
DE (1) DE2164958A1 (en)
FR (1) FR2125019A5 (en)
GB (1) GB1315646A (en)
NL (1) NL7101327A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991014538A1 (en) * 1990-03-22 1991-10-03 Westech Systems, Inc. Apparatus for interlayer planarization of semiconductor material

Also Published As

Publication number Publication date
FR2125019A5 (en) 1972-09-22
NL7101327A (en) 1972-08-04
CA961644A (en) 1975-01-28
DE2164958A1 (en) 1972-08-17

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee