GB1306224A - - Google Patents

Info

Publication number
GB1306224A
GB1306224A GB1306224DA GB1306224A GB 1306224 A GB1306224 A GB 1306224A GB 1306224D A GB1306224D A GB 1306224DA GB 1306224 A GB1306224 A GB 1306224A
Authority
GB
United Kingdom
Prior art keywords
block
base
plate
coolant
feb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1306224A publication Critical patent/GB1306224A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB1306224D 1969-02-24 1969-02-24 Expired GB1306224A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB987269 1969-02-24

Publications (1)

Publication Number Publication Date
GB1306224A true GB1306224A (es) 1973-02-07

Family

ID=9880348

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1306224D Expired GB1306224A (es) 1969-02-24 1969-02-24

Country Status (1)

Country Link
GB (1) GB1306224A (es)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2640000A1 (de) * 1976-09-04 1978-03-09 Bbc Brown Boveri & Cie Kuehldose fuer fluessigkeitsgekuehlte leistungshalbleiterbauelemente und verfahren zur herstellung derselben
DE2758166A1 (de) * 1977-02-18 1978-08-24 Ckd Praha Leistungshalbleiterbauelement
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
FR2500215A1 (fr) * 1981-02-13 1982-08-20 Thomson Csf Dispositif de refroidissement d'un composant electronique de puissance, et composant encapsule dans un boitier muni d'un tel dispositif
US4450896A (en) * 1981-09-17 1984-05-29 Siemens Aktiengesellschaft Method and apparatus for heat exchange at solid surfaces
US4467860A (en) * 1982-06-03 1984-08-28 Alec Wargo Device for cooling semi-conductors
DE4217289A1 (de) * 1992-05-25 1993-12-16 Mannesmann Ag Fluidkühlung von Halbleiterelementen
US5275237A (en) * 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2640000A1 (de) * 1976-09-04 1978-03-09 Bbc Brown Boveri & Cie Kuehldose fuer fluessigkeitsgekuehlte leistungshalbleiterbauelemente und verfahren zur herstellung derselben
DE2758166A1 (de) * 1977-02-18 1978-08-24 Ckd Praha Leistungshalbleiterbauelement
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
FR2500215A1 (fr) * 1981-02-13 1982-08-20 Thomson Csf Dispositif de refroidissement d'un composant electronique de puissance, et composant encapsule dans un boitier muni d'un tel dispositif
US4450896A (en) * 1981-09-17 1984-05-29 Siemens Aktiengesellschaft Method and apparatus for heat exchange at solid surfaces
US4467860A (en) * 1982-06-03 1984-08-28 Alec Wargo Device for cooling semi-conductors
DE4217289A1 (de) * 1992-05-25 1993-12-16 Mannesmann Ag Fluidkühlung von Halbleiterelementen
US5275237A (en) * 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees