GB1301121A - Carrier for semiconductor devices - Google Patents
Carrier for semiconductor devicesInfo
- Publication number
- GB1301121A GB1301121A GB2013770A GB2013770A GB1301121A GB 1301121 A GB1301121 A GB 1301121A GB 2013770 A GB2013770 A GB 2013770A GB 2013770 A GB2013770 A GB 2013770A GB 1301121 A GB1301121 A GB 1301121A
- Authority
- GB
- United Kingdom
- Prior art keywords
- carrier
- walls
- annular wall
- holes
- retained
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
1301121 Semi-conductor devices BARNES CORP 27 April 1970 20137/70 Heading H1K [Also in Division H2] Figs. 1, 4 and 6 show perspective, underside, and side-sectional views respectively of one embodiment of an indexed carrier 12 for carrying any encapsulated semi-conductor device 86 of the external form shown, the base section of the carrier being a type commonly used with flat-pack integrated circuits. Here, the carrier is provided with a stand-off post 42 around which are disposed holes extending through the base of the carrier to receive the leads of the device. The upper ends of the holes are provided with guiding flares defined by walls 38 extending radially from the post 42 to meet an annular wall 40. The form of the flares is varied between embodiments by suitably shaping the faces of both radial and annular walls. In a variant the upper edge of the radial walls 38 rises from the top edge of the annular wall to a higher point on the post 42 to further ease the insertion of the device into the carrier. An outer annular wall (not shown) concentric with the annular wall 40 may be of a height sufficient to encircle the base of the device encapsulation and to thus shield the leads 88 from accidental contact with external objects. The device is retained in the carrier by providing one or more (e.g. alternate ones) of the holes with a portion 34 of a reduced cross-section comparable to or slightly less in diameter than the undistorted lead to provide frictional engagement. The pillar 42 is continued at the underside of the carrier in a portion of constant and larger cross-section and the holes are flared away from the pillar to form guided entries for the flexible conductors 82 of a contactor assembly 54 on which the carrier may be retained by spring biased latches 64, 66. The conductors 82 are retained in the generally circular bore of the contactor body by solid 74 and apertured parts 76 with projecting parts 86 engaging axial grooves 80 of semicircular crosssection in the walls of the bore 78 to lock the contact assembly against rotation. Further bores 90, 92 are provided in the contactor body to enable it to be secured to a suitable mounting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2013770A GB1301121A (en) | 1970-04-27 | 1970-04-27 | Carrier for semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2013770A GB1301121A (en) | 1970-04-27 | 1970-04-27 | Carrier for semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1301121A true GB1301121A (en) | 1972-12-29 |
Family
ID=10140992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2013770A Expired GB1301121A (en) | 1970-04-27 | 1970-04-27 | Carrier for semiconductor devices |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1301121A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2514560A1 (en) * | 1981-10-13 | 1983-04-15 | Molex Inc | INTEGRATED CIRCUIT SUPPORT ASSEMBLY |
EP0128191A1 (en) * | 1982-12-20 | 1984-12-19 | Motorola, Inc. | Integrated circuit carrier and assembly |
WO2013133348A3 (en) * | 2012-03-05 | 2013-12-05 | Yazaki Corporation | Connection structure of electronic components |
-
1970
- 1970-04-27 GB GB2013770A patent/GB1301121A/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2514560A1 (en) * | 1981-10-13 | 1983-04-15 | Molex Inc | INTEGRATED CIRCUIT SUPPORT ASSEMBLY |
EP0128191A1 (en) * | 1982-12-20 | 1984-12-19 | Motorola, Inc. | Integrated circuit carrier and assembly |
EP0128191A4 (en) * | 1982-12-20 | 1985-06-26 | Motorola Inc | Integrated circuit carrier and assembly. |
WO2013133348A3 (en) * | 2012-03-05 | 2013-12-05 | Yazaki Corporation | Connection structure of electronic components |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |