GB1301121A - Carrier for semiconductor devices - Google Patents

Carrier for semiconductor devices

Info

Publication number
GB1301121A
GB1301121A GB2013770A GB2013770A GB1301121A GB 1301121 A GB1301121 A GB 1301121A GB 2013770 A GB2013770 A GB 2013770A GB 2013770 A GB2013770 A GB 2013770A GB 1301121 A GB1301121 A GB 1301121A
Authority
GB
United Kingdom
Prior art keywords
carrier
walls
annular wall
holes
retained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2013770A
Inventor
James W Barnes
Rexford W Van De Boe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Barnes Corp
Original Assignee
Barnes Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Barnes Corp filed Critical Barnes Corp
Priority to GB2013770A priority Critical patent/GB1301121A/en
Publication of GB1301121A publication Critical patent/GB1301121A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/12Resilient or clamping means for holding component to structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40Securing contact members in or to a base or case; Insulating of contact members

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

1301121 Semi-conductor devices BARNES CORP 27 April 1970 20137/70 Heading H1K [Also in Division H2] Figs. 1, 4 and 6 show perspective, underside, and side-sectional views respectively of one embodiment of an indexed carrier 12 for carrying any encapsulated semi-conductor device 86 of the external form shown, the base section of the carrier being a type commonly used with flat-pack integrated circuits. Here, the carrier is provided with a stand-off post 42 around which are disposed holes extending through the base of the carrier to receive the leads of the device. The upper ends of the holes are provided with guiding flares defined by walls 38 extending radially from the post 42 to meet an annular wall 40. The form of the flares is varied between embodiments by suitably shaping the faces of both radial and annular walls. In a variant the upper edge of the radial walls 38 rises from the top edge of the annular wall to a higher point on the post 42 to further ease the insertion of the device into the carrier. An outer annular wall (not shown) concentric with the annular wall 40 may be of a height sufficient to encircle the base of the device encapsulation and to thus shield the leads 88 from accidental contact with external objects. The device is retained in the carrier by providing one or more (e.g. alternate ones) of the holes with a portion 34 of a reduced cross-section comparable to or slightly less in diameter than the undistorted lead to provide frictional engagement. The pillar 42 is continued at the underside of the carrier in a portion of constant and larger cross-section and the holes are flared away from the pillar to form guided entries for the flexible conductors 82 of a contactor assembly 54 on which the carrier may be retained by spring biased latches 64, 66. The conductors 82 are retained in the generally circular bore of the contactor body by solid 74 and apertured parts 76 with projecting parts 86 engaging axial grooves 80 of semicircular crosssection in the walls of the bore 78 to lock the contact assembly against rotation. Further bores 90, 92 are provided in the contactor body to enable it to be secured to a suitable mounting.
GB2013770A 1970-04-27 1970-04-27 Carrier for semiconductor devices Expired GB1301121A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2013770A GB1301121A (en) 1970-04-27 1970-04-27 Carrier for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2013770A GB1301121A (en) 1970-04-27 1970-04-27 Carrier for semiconductor devices

Publications (1)

Publication Number Publication Date
GB1301121A true GB1301121A (en) 1972-12-29

Family

ID=10140992

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2013770A Expired GB1301121A (en) 1970-04-27 1970-04-27 Carrier for semiconductor devices

Country Status (1)

Country Link
GB (1) GB1301121A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2514560A1 (en) * 1981-10-13 1983-04-15 Molex Inc INTEGRATED CIRCUIT SUPPORT ASSEMBLY
EP0128191A1 (en) * 1982-12-20 1984-12-19 Motorola, Inc. Integrated circuit carrier and assembly
WO2013133348A3 (en) * 2012-03-05 2013-12-05 Yazaki Corporation Connection structure of electronic components

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2514560A1 (en) * 1981-10-13 1983-04-15 Molex Inc INTEGRATED CIRCUIT SUPPORT ASSEMBLY
EP0128191A1 (en) * 1982-12-20 1984-12-19 Motorola, Inc. Integrated circuit carrier and assembly
EP0128191A4 (en) * 1982-12-20 1985-06-26 Motorola Inc Integrated circuit carrier and assembly.
WO2013133348A3 (en) * 2012-03-05 2013-12-05 Yazaki Corporation Connection structure of electronic components

Similar Documents

Publication Publication Date Title
US3033537A (en) Transistor cooler
EP0110997A4 (en) Semiconductor device package.
ES549215A0 (en) IMPROVEMENTS IN HERMETIC TERMINAL DEVICES
GB1301121A (en) Carrier for semiconductor devices
US3178621A (en) Sealed housing for electronic elements
GB1064886A (en) Improvements in or relating to electrical circuit assemblies
US3241094A (en) Socket for electrical component
GB1143308A (en) A semiconductor device assembly
KR910015031A (en) Semiconductor device parts
US3154692A (en) Voltage regulating semiconductor device
GB1363805A (en) Electrical components particularly semiconductor devices
US3516044A (en) Carrier for transistor outline semiconductor device
EP0085607A3 (en) Process for the simultaneous production of hyperfrequency diodes having an incorported encapsulation and diodes made by said process
GB1100737A (en) Semiconductor device junction stabilization
US3176202A (en) Semiconductor device
GB1397713A (en) Case for a plurality of semiconductor devices
KR860003657A (en) Integrated circuit package
US2892135A (en) Small enclosed electrical device
GB958989A (en) An electrical lamp socket
GB957950A (en) Improvements in photo-transistors
GB1176519A (en) Semiconductor Devices and the Manufacture Thereof
BULUCEA The influence of carrier injection through emitter sidewall on current gain properties of small area double diffused planar transistors(Emitter base lateral diode carrier injection effect on current gain properties of small area double diffused planar transistors)
GB863633A (en) Improvements in or relating to mounting arrangements for electrical components
SU693495A1 (en) Device for fastening diode
GB1399530A (en) Compound transistors

Legal Events

Date Code Title Description
PS Patent sealed
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee