GB1289651A - - Google Patents
Info
- Publication number
- GB1289651A GB1289651A GB1289651DA GB1289651A GB 1289651 A GB1289651 A GB 1289651A GB 1289651D A GB1289651D A GB 1289651DA GB 1289651 A GB1289651 A GB 1289651A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- regions
- silicon
- apertures
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 abstract 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 5
- 229910052751 metal Inorganic materials 0.000 abstract 5
- 239000002184 metal Substances 0.000 abstract 5
- 239000004065 semiconductor Substances 0.000 abstract 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 3
- 229910052737 gold Inorganic materials 0.000 abstract 3
- 239000010931 gold Substances 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 3
- 230000004048 modification Effects 0.000 abstract 3
- 238000012986 modification Methods 0.000 abstract 3
- 229910052759 nickel Inorganic materials 0.000 abstract 3
- 229910052594 sapphire Inorganic materials 0.000 abstract 3
- 239000010980 sapphire Substances 0.000 abstract 3
- 229910052710 silicon Inorganic materials 0.000 abstract 3
- 239000010703 silicon Substances 0.000 abstract 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 abstract 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 2
- 239000010936 titanium Substances 0.000 abstract 2
- 229910052719 titanium Inorganic materials 0.000 abstract 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract 2
- 229910052721 tungsten Inorganic materials 0.000 abstract 2
- 239000010937 tungsten Substances 0.000 abstract 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 abstract 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910005540 GaP Inorganic materials 0.000 abstract 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 abstract 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 238000003491 array Methods 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 abstract 1
- 229910001634 calcium fluoride Inorganic materials 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 239000011651 chromium Substances 0.000 abstract 1
- 229910000423 chromium oxide Inorganic materials 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000010941 cobalt Substances 0.000 abstract 1
- 229910017052 cobalt Inorganic materials 0.000 abstract 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 239000000395 magnesium oxide Substances 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 239000011733 molybdenum Substances 0.000 abstract 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 229910052596 spinel Inorganic materials 0.000 abstract 1
- 239000011029 spinel Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
- H01J9/233—Manufacture of photoelectric screens or charge-storage screens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
- H01J29/10—Screens on or from which an image or pattern is formed, picked up, converted or stored
- H01J29/36—Photoelectric screens; Charge-storage screens
- H01J29/39—Charge-storage screens
- H01J29/45—Charge-storage screens exhibiting internal electric effects caused by electromagnetic radiation, e.g. photoconductive screen, photodielectric screen, photovoltaic screen
- H01J29/451—Charge-storage screens exhibiting internal electric effects caused by electromagnetic radiation, e.g. photoconductive screen, photodielectric screen, photovoltaic screen with photosensitive junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
- H01L21/86—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body the insulating body being sapphire, e.g. silicon on sapphire structure, i.e. SOS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Led Devices (AREA)
Abstract
1289651 Image pick-up tubes; semi-conductor arrays TOKYO SHIBAURA ELECTRIC CO Ltd 20 Jan 1970 2721/70 Headings H1D and H1K The target of an image pick-up tube comprises an array of junctions on a semi-conductor layer supported by a monocrystalline insulating transparent substrate. In Fig. 3 a mono crystalline layer 11 of N-type silicon 20 microns thick is formed on a sapphire substrate 10 and covered with an insulating layer 12 of silicon dioxide formed with an array of apertures through which P-type material is diffused to form regions 13 in which N-type regions 16 are formed. A gold coating 15 is deposited round the periphery to form an electrode. In a modification, Fig. 1 (not shown), the regions 16 are omitted and in a modification of this diode arrangement (Fig. 2, not shown) the regions 13 extend right through to the substrate. The N-P-N arrangement shown in Fig. 3 may also be modified by extending the regions 13 and 16 right through to the substrate (Fig. 4, not shown). In another arrangement, Fig. 5F, the sapphire substrate has its upper and lower surfaces selected to be the (0001) faces and a nickel layer 21 of 0.5 micron thickness is formed on the substrate and etched to provide a pattern of apertures 10 microns diameter at a pitch of 15 microns. N-type monocrystalline silicon 3 microns thick is deposited at 22a over the substrate whilst the deposits at 22b over the nickel are polycrystalline. An apertured silicon oxide layer 23 covers the surface and boron is diffused through the apertures to form P-type regions 26 to a depth of 0.5 micron. The layer 21 may be of silicon oxide or chromium oxide or may be omitted. In a modification, Fig. 6 (not shown), islands of silicon are formed on the substrate and surrounded by metal or semiconductor, after which the apertured insulating layer is formed and P-type material diffused through the apertures. In a further arrangement, Fig. 7, metal islands 33 are deposited in the apertures in the insulating layer 32 to form Schottky junctions and are coated with a second metal at 35; the first metal may be gold, platinum, tungsten, nickel, molybdenum, titanium or aluminium and the second metal gold, titanium or tungsten. The substrate may be of spinel, quartz, magnesia or calcium fluoride instead of sapphire and may include an impurity to give selective transmission of light; cobalt improves violet transmission, chromium green, and copper infra-red. The semi-conductor material may be gallium arsenide or phosphide instead of silicon.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB272170 | 1970-01-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1289651A true GB1289651A (en) | 1972-09-20 |
Family
ID=9744634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1289651D Expired GB1289651A (en) | 1970-01-20 | 1970-01-20 |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1289651A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0005543A1 (en) * | 1978-05-19 | 1979-11-28 | Hitachi, Ltd. | Photosensor |
GB2132017A (en) * | 1982-12-16 | 1984-06-27 | Secr Defence | Semiconductor device array |
GB2450037A (en) * | 2004-03-30 | 2008-12-10 | Texas Instruments Inc | Dual Metal Schottky Diode |
US7902055B2 (en) | 2004-03-30 | 2011-03-08 | Texas Instruments Incoprorated | Method of manufacturing a dual metal Schottky diode |
US20140044925A1 (en) * | 2012-08-09 | 2014-02-13 | Hon Hai Precision Industry Co., Ltd. | Protective cover made with sapphire and method of manufacturing same |
-
1970
- 1970-01-20 GB GB1289651D patent/GB1289651A/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0005543A1 (en) * | 1978-05-19 | 1979-11-28 | Hitachi, Ltd. | Photosensor |
GB2132017A (en) * | 1982-12-16 | 1984-06-27 | Secr Defence | Semiconductor device array |
GB2450037A (en) * | 2004-03-30 | 2008-12-10 | Texas Instruments Inc | Dual Metal Schottky Diode |
GB2450037B (en) * | 2004-03-30 | 2009-05-27 | Texas Instruments Inc | Schottky diode |
US7902055B2 (en) | 2004-03-30 | 2011-03-08 | Texas Instruments Incoprorated | Method of manufacturing a dual metal Schottky diode |
US20140044925A1 (en) * | 2012-08-09 | 2014-02-13 | Hon Hai Precision Industry Co., Ltd. | Protective cover made with sapphire and method of manufacturing same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
435 | Patent endorsed 'licences of right' on the date specified (sect. 35/1949) | ||
PE20 | Patent expired after termination of 20 years |