GB1279207A - Curing agents for epoxy resins - Google Patents

Curing agents for epoxy resins

Info

Publication number
GB1279207A
GB1279207A GB1394870A GB1394870A GB1279207A GB 1279207 A GB1279207 A GB 1279207A GB 1394870 A GB1394870 A GB 1394870A GB 1394870 A GB1394870 A GB 1394870A GB 1279207 A GB1279207 A GB 1279207A
Authority
GB
United Kingdom
Prior art keywords
epoxy resins
curing agents
imidazole
alkyl
reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1394870A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vanderbilt Chemicals LLC
Original Assignee
RT Vanderbilt Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RT Vanderbilt Co Inc filed Critical RT Vanderbilt Co Inc
Publication of GB1279207A publication Critical patent/GB1279207A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D231/00—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
    • C07D231/02—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
    • C07D231/10—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
    • C07D231/12—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D249/00—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms
    • C07D249/02—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms not condensed with other rings
    • C07D249/08—1,2,4-Triazoles; Hydrogenated 1,2,4-triazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines

Abstract

1279207 Curing epoxy resins R T VANDERBILT CO Inc 23 March 1970 [16 Jan 1970] 13948/70 Heading C3B [Also in Division C2] Epoxy resins are cured by the monomeric reaction products, the reaction being carried out in the absence of a solvent, of propylene oxide and a substantially equimolar amount of a mixture of imidazole and an imidazole of formula where at least one R is C 1-4 alkyl and the others are hydrogen or alkyl.
GB1394870A 1970-01-16 1970-03-23 Curing agents for epoxy resins Expired GB1279207A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US349470A 1970-01-16 1970-01-16

Publications (1)

Publication Number Publication Date
GB1279207A true GB1279207A (en) 1972-06-28

Family

ID=21706138

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1394870A Expired GB1279207A (en) 1970-01-16 1970-03-23 Curing agents for epoxy resins

Country Status (6)

Country Link
AT (1) AT294818B (en)
BE (1) BE751231A (en)
DE (1) DE2007968A1 (en)
FR (1) FR2074845A5 (en)
GB (1) GB1279207A (en)
NL (1) NL7003179A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011190260A (en) * 2010-03-15 2011-09-29 Rohm & Haas Electronic Materials Llc Plating bath and method
US8262895B2 (en) 2010-03-15 2012-09-11 Rohm And Haas Electronic Materials Llc Plating bath and method
US8268157B2 (en) 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3324339A1 (en) * 1983-07-06 1985-01-17 Basf Ag, 6700 Ludwigshafen LIQUID EPOXY RESIN HARDENER AND METHOD FOR THE PRODUCTION THEREOF
US5017258A (en) * 1986-06-20 1991-05-21 Shell Oil Company Pipe rehabilitation using epoxy resin composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011190260A (en) * 2010-03-15 2011-09-29 Rohm & Haas Electronic Materials Llc Plating bath and method
EP2366692A3 (en) * 2010-03-15 2011-11-02 Rohm and Haas Electronic Materials LLC Copper electropating bath and method
US8262895B2 (en) 2010-03-15 2012-09-11 Rohm And Haas Electronic Materials Llc Plating bath and method
US8268157B2 (en) 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
US8268158B2 (en) 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method

Also Published As

Publication number Publication date
NL7003179A (en) 1971-07-20
FR2074845A5 (en) 1971-10-08
DE2007968A1 (en) 1971-07-22
AT294818B (en) 1971-12-10
BE751231A (en) 1970-11-30

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees