GB1265489A - - Google Patents

Info

Publication number
GB1265489A
GB1265489A GB1265489DA GB1265489A GB 1265489 A GB1265489 A GB 1265489A GB 1265489D A GB1265489D A GB 1265489DA GB 1265489 A GB1265489 A GB 1265489A
Authority
GB
United Kingdom
Prior art keywords
styrene
vinyl acetate
methacrylic acid
butadiene
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1265489A publication Critical patent/GB1265489A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
GB1265489D 1968-07-17 1968-07-17 Expired GB1265489A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3397368 1968-07-17

Publications (1)

Publication Number Publication Date
GB1265489A true GB1265489A (xx) 1972-03-01

Family

ID=10359760

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1265489D Expired GB1265489A (xx) 1968-07-17 1968-07-17

Country Status (1)

Country Link
GB (1) GB1265489A (xx)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0063475A1 (en) * 1981-04-21 1982-10-27 Capsulated Systems, Inc. Microencapsulated epoxy adhesive system
US4536524A (en) * 1981-04-21 1985-08-20 Capsulated Systems, Inc. Microencapsulated epoxy adhesive system
GB2155938A (en) * 1984-03-20 1985-10-02 Westinghouse Electric Corp Aqueous epoxy resin impregnatng composition
EP0209080A1 (en) * 1985-07-10 1987-01-21 The Oakland Corporation Packaged adhesive
US4764579A (en) * 1985-07-10 1988-08-16 The Oakland Corporation Packaged adhesive
GB2201681A (en) * 1987-03-06 1988-09-07 Swift Adhesives Ltd Heat and pressure activated adhesive compositions
GB2224739A (en) * 1988-08-30 1990-05-16 Japan Synthetic Rubber Co Ltd Modified epoxy compositions
EP0672707A2 (en) * 1994-03-15 1995-09-20 Toray Industries, Inc. Microencapsulated curing agent for thermosetting resin compositions
WO2004024841A2 (en) * 2002-09-11 2004-03-25 Henkel Loctite Deutschland Gmbh An apparatus for the application of a curable composition to a fastener and curable compositions suitable for application to a fastener
WO2005104744A2 (en) * 2004-04-28 2005-11-10 L & L Products, Inc. Method for forming structures using an encapsulated adhesive material
US8070994B2 (en) 2004-06-18 2011-12-06 Zephyros, Inc. Panel structure
EP2792724A1 (en) * 2013-04-15 2014-10-22 Samsung Display Co., Ltd. Adhesive, adhesive tape and pre-product of an organic light emitting display device comprising an adhesive layer formed by the adhesive
CN105646797A (zh) * 2016-04-01 2016-06-08 烟台德邦科技有限公司 一种丙烯酸酯改性环氧增韧剂的合成

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0063475A1 (en) * 1981-04-21 1982-10-27 Capsulated Systems, Inc. Microencapsulated epoxy adhesive system
US4536524A (en) * 1981-04-21 1985-08-20 Capsulated Systems, Inc. Microencapsulated epoxy adhesive system
GB2155938A (en) * 1984-03-20 1985-10-02 Westinghouse Electric Corp Aqueous epoxy resin impregnatng composition
EP0209080A1 (en) * 1985-07-10 1987-01-21 The Oakland Corporation Packaged adhesive
US4764579A (en) * 1985-07-10 1988-08-16 The Oakland Corporation Packaged adhesive
GB2201681A (en) * 1987-03-06 1988-09-07 Swift Adhesives Ltd Heat and pressure activated adhesive compositions
GB2224739A (en) * 1988-08-30 1990-05-16 Japan Synthetic Rubber Co Ltd Modified epoxy compositions
GB2224739B (en) * 1988-08-30 1992-09-23 Japan Synthetic Rubber Co Ltd Modified epoxy composition
EP0672707A2 (en) * 1994-03-15 1995-09-20 Toray Industries, Inc. Microencapsulated curing agent for thermosetting resin compositions
EP0672707A3 (en) * 1994-03-15 1996-07-03 Toray Industries Encapsulated curing agent for thermosetting resin compositions.
WO2004024841A2 (en) * 2002-09-11 2004-03-25 Henkel Loctite Deutschland Gmbh An apparatus for the application of a curable composition to a fastener and curable compositions suitable for application to a fastener
WO2004024841A3 (en) * 2002-09-11 2004-07-15 Henkel Loctite Deutschland Gmb An apparatus for the application of a curable composition to a fastener and curable compositions suitable for application to a fastener
WO2005104744A2 (en) * 2004-04-28 2005-11-10 L & L Products, Inc. Method for forming structures using an encapsulated adhesive material
WO2005104744A3 (en) * 2004-04-28 2006-02-02 L & L Products Inc Method for forming structures using an encapsulated adhesive material
US8070994B2 (en) 2004-06-18 2011-12-06 Zephyros, Inc. Panel structure
US9688050B2 (en) 2004-06-18 2017-06-27 Zephyros, Inc. Panel structure
US10647083B2 (en) 2004-06-18 2020-05-12 Zephyros, Inc. Panel structure
EP2792724A1 (en) * 2013-04-15 2014-10-22 Samsung Display Co., Ltd. Adhesive, adhesive tape and pre-product of an organic light emitting display device comprising an adhesive layer formed by the adhesive
CN105646797A (zh) * 2016-04-01 2016-06-08 烟台德邦科技有限公司 一种丙烯酸酯改性环氧增韧剂的合成

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee