GB1260896A - Curable epoxide resin compositions - Google Patents

Curable epoxide resin compositions

Info

Publication number
GB1260896A
GB1260896A GB4458069A GB4458069A GB1260896A GB 1260896 A GB1260896 A GB 1260896A GB 4458069 A GB4458069 A GB 4458069A GB 4458069 A GB4458069 A GB 4458069A GB 1260896 A GB1260896 A GB 1260896A
Authority
GB
United Kingdom
Prior art keywords
dimethyl
urea
curing
nucleus
methylphenyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4458069A
Inventor
Christopher Hubert Bull
Edward William Garnish
Georg Sigfrid Neumann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ciba ARL Ltd
Original Assignee
Ciba ARL Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE755863D priority Critical patent/BE755863A/en
Application filed by Ciba ARL Ltd filed Critical Ciba ARL Ltd
Priority to GB4458069A priority patent/GB1260896A/en
Priority to CH1314670A priority patent/CH539094A/en
Priority to FR7032447A priority patent/FR2061055A5/fr
Publication of GB1260896A publication Critical patent/GB1260896A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

1,260,896. Curing epoxy resins. CIBA (A.R.L.) Ltd. 19 Aug., 1970 [9 Sept., 1969], No. 44580/69. Addition to 1,153,639. Heading C3B. Curable compositions comprise: (I) an epoxy resin, (II) as heat-curing agent a polyhydric phenol or a compound containing at least two primary amino groups attached to a 1,3,5- triazine nucleus, and (III) as curing accelerator a compound containing directly attached to an aromatic nucleus at least one residue in which R<SP>1</SP> is alkyl, alkenyl, cycloalkyl or aralkyl, R<SP>2</SP> either has the same definition as R<SP>1</SP> or is alkoxy; R<SP>1</SP> and R<SP>2</SP> may be substituted by halogen, OH or CN; R<SP>1</SP> and R<SP>2</SP> together with the nitrogen atom may form a heterocyclic ring; X is O or S. Not more than two such residues may be attached to any one aromatic nucleus (preferably a phenyl nucleus). Specific curing agents are resorcinol, hydroquinone, bisphenol A, a phenol novolac, melamine, N - (n - butyl)melamine, N,N - diallylmelamine and laurylguanamine. Accelerators exemplified are N,N - dimethyl - N<SP>1</SP> - (4 - chlorophenyl)urea; N,N - dimethyl - N<SP>1</SP> - (3 - chloro- 4 - methylphenyl)urea; N,N - dimethyl - N<SP>1</SP> - (4 - ethoxyphenyl)urea; N,N - dimethyl - N<SP>1</SP> - (3 - chloro - 4 - methylphenyl)thiourea; N,N<SP>1</SP>- bis - (dimethylcarbamoyl) - 2,4 - or 2,6 - toluidine and bis - [4 - (N,N - dimethylureido)- phenyl]-methane. The accelerator may be used at 0À01-10 parts by wt. per 100 parts by wt. of epoxy resin. Conventional fillers, extenders and solvents may be present.
GB4458069A 1969-09-09 1969-09-09 Curable epoxide resin compositions Expired GB1260896A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
BE755863D BE755863A (en) 1969-09-09 CURING COMPOSITIONS OF EPOXIDIZED RESINS
GB4458069A GB1260896A (en) 1969-09-09 1969-09-09 Curable epoxide resin compositions
CH1314670A CH539094A (en) 1969-09-09 1970-09-03 Curable epoxy resin composition
FR7032447A FR2061055A5 (en) 1969-09-09 1970-09-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4458069A GB1260896A (en) 1969-09-09 1969-09-09 Curable epoxide resin compositions

Publications (1)

Publication Number Publication Date
GB1260896A true GB1260896A (en) 1972-01-19

Family

ID=10433947

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4458069A Expired GB1260896A (en) 1969-09-09 1969-09-09 Curable epoxide resin compositions

Country Status (4)

Country Link
BE (1) BE755863A (en)
CH (1) CH539094A (en)
FR (1) FR2061055A5 (en)
GB (1) GB1260896A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4283520A (en) 1979-04-20 1981-08-11 Ciba-Geigy Corporation Storage-stable, homogeneous mixture containing epoxide resin, curing agent and curing accelerator, and the use of the mixture for producing cured products
JPH0360056A (en) * 1989-07-28 1991-03-15 Tomoegawa Paper Co Ltd Solid state image sensing device sealing adhesive
EP0728789A2 (en) * 1995-02-27 1996-08-28 Matsushita Electric Works, Ltd. Epoxy resin compound for use in laminated sheet
US6231959B1 (en) * 1995-02-27 2001-05-15 Matsushita Electric Works, Ltd. Prepreg of epoxy resin, hardener, and organodialkyurea promotor
EP3118238A1 (en) * 2012-08-02 2017-01-18 AlzChem AG Liquid hardeners for curing epoxy resins (i)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5949225A (en) * 1982-09-16 1984-03-21 Hitachi Ltd Heat-resistant flame-retardant resin composition
US5064881A (en) * 1989-01-18 1991-11-12 Mitsui Petrochemical Industries, Ltd. Epoxy resin composition and semiconductor sealing material comprising same based on spherical silica

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4283520A (en) 1979-04-20 1981-08-11 Ciba-Geigy Corporation Storage-stable, homogeneous mixture containing epoxide resin, curing agent and curing accelerator, and the use of the mixture for producing cured products
JPH0360056A (en) * 1989-07-28 1991-03-15 Tomoegawa Paper Co Ltd Solid state image sensing device sealing adhesive
EP0728789A2 (en) * 1995-02-27 1996-08-28 Matsushita Electric Works, Ltd. Epoxy resin compound for use in laminated sheet
EP0728789A3 (en) * 1995-02-27 1997-10-22 Matsushita Electric Works Ltd Epoxy resin compound for use in laminated sheet
US6231959B1 (en) * 1995-02-27 2001-05-15 Matsushita Electric Works, Ltd. Prepreg of epoxy resin, hardener, and organodialkyurea promotor
EP3118238A1 (en) * 2012-08-02 2017-01-18 AlzChem AG Liquid hardeners for curing epoxy resins (i)

Also Published As

Publication number Publication date
FR2061055A5 (en) 1971-06-18
BE755863A (en) 1971-03-08
CH539094A (en) 1973-07-15

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