GB1250585A - - Google Patents
Info
- Publication number
- GB1250585A GB1250585A GB1250585DA GB1250585A GB 1250585 A GB1250585 A GB 1250585A GB 1250585D A GB1250585D A GB 1250585DA GB 1250585 A GB1250585 A GB 1250585A
- Authority
- GB
- United Kingdom
- Prior art keywords
- region
- nickel layer
- crystal
- nickel
- diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 22
- 229910052759 nickel Inorganic materials 0.000 abstract 11
- 239000013078 crystal Substances 0.000 abstract 8
- 238000009792 diffusion process Methods 0.000 abstract 4
- 238000000151 deposition Methods 0.000 abstract 3
- 239000002019 doping agent Substances 0.000 abstract 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052796 boron Inorganic materials 0.000 abstract 2
- 230000005496 eutectics Effects 0.000 abstract 2
- 229910052698 phosphorus Inorganic materials 0.000 abstract 2
- 239000011574 phosphorus Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- PEUPIGGLJVUNEU-UHFFFAOYSA-N nickel silicon Chemical compound [Si].[Ni] PEUPIGGLJVUNEU-UHFFFAOYSA-N 0.000 abstract 1
- 239000011253 protective coating Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/02—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion materials in the solid state
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
1,250,585. Semi-conductor devices. SIEMENS A.G. 19 Dec., 1969 [20 Dec., 1968], No. 61911/69. Heading H1K. A method of manufacturing a semi-conductor component with at least one diffused zone comprises depositing a nickel layer containing a dopant on to a part or parts of a silicon crystal, and diffusing in the dopant to form a zone or zones. A plurality of nickel layers of different thicknesses and containing different dopants may be used to produce zones of differing conductivity or conductivity type. In an embodiment an NPN transistor is formed by depositing a nickel layer containing phosphorus on parts of both faces of a P-doped silicon crystal and subsequently depositing a second nickel layer, containing boron, on the remaining surfaces and the first nickel layer. Diffusing produces a P doped base region 1 with a P<SP>+</SP> region 8 near its surface, and two N<SP>+</SP> regions, an emitter 6 and collector 7. In a second embodiment the first nickel layer is provided with a protective coating and the second nickel layer deposited only on the crystal, diffusion again producing an NPN transistor. In a third embodiment, an N doped crystal has deposited on all surfaces a nickel layer containing boron, which is subsequently diffused in to produce a P<SP>+</SP> region surrounding the N region. Using masking a second nickel layer containing phosphorus is deposited on one part of one surface of the crystal, and a second diffusion takes place producing a small central N region, a surrounding P<SP>+</SP> region and a second N<SP>+</SP> region produced by the second nickel layer. The lower part of the crystal is removed in order to gain access to the central N region, which forms the collector, the second N<SP>+</SP> region forming the emitter. It is stated that during diffusion a nickelsilicon eutectic, liquid at diffusion temperatures, is formed on the crystal, and that nickel from this eutectic diffuses into the crystal. Specification 1,250,584 is referred to.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19681816082 DE1816082A1 (en) | 1968-12-20 | 1968-12-20 | Process for producing diffused semiconductor components from silicon |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1250585A true GB1250585A (en) | 1971-10-20 |
Family
ID=5716945
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1250585D Expired GB1250585A (en) | 1968-12-20 | 1969-12-19 |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5011233B1 (en) |
CH (1) | CH519788A (en) |
DE (1) | DE1816082A1 (en) |
FR (1) | FR2026659A1 (en) |
GB (1) | GB1250585A (en) |
NL (1) | NL6918777A (en) |
SE (1) | SE344849B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2316125A2 (en) * | 2008-08-20 | 2011-05-04 | Honeywell International Inc. | Phosphorous-comprising dopants and methods for forming phosphorous-doped regions in semiconductor substrates using phosphorous-comprising dopants |
US8324089B2 (en) | 2009-07-23 | 2012-12-04 | Honeywell International Inc. | Compositions for forming doped regions in semiconductor substrates, methods for fabricating such compositions, and methods for forming doped regions using such compositions |
US8518170B2 (en) | 2008-12-29 | 2013-08-27 | Honeywell International Inc. | Boron-comprising inks for forming boron-doped regions in semiconductor substrates using non-contact printing processes and methods for fabricating such boron-comprising inks |
US8629294B2 (en) | 2011-08-25 | 2014-01-14 | Honeywell International Inc. | Borate esters, boron-comprising dopants, and methods of fabricating boron-comprising dopants |
US8975170B2 (en) | 2011-10-24 | 2015-03-10 | Honeywell International Inc. | Dopant ink compositions for forming doped regions in semiconductor substrates, and methods for fabricating dopant ink compositions |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH579827A5 (en) * | 1974-11-04 | 1976-09-15 | Bbc Brown Boveri & Cie |
-
1968
- 1968-12-20 DE DE19681816082 patent/DE1816082A1/en not_active Withdrawn
-
1969
- 1969-12-15 NL NL6918777A patent/NL6918777A/xx unknown
- 1969-12-16 CH CH1869469A patent/CH519788A/en not_active IP Right Cessation
- 1969-12-17 FR FR6943696A patent/FR2026659A1/fr not_active Withdrawn
- 1969-12-19 GB GB1250585D patent/GB1250585A/en not_active Expired
- 1969-12-20 JP JP44102124A patent/JPS5011233B1/ja active Pending
- 1969-12-22 SE SE17797/69A patent/SE344849B/xx unknown
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2316125A2 (en) * | 2008-08-20 | 2011-05-04 | Honeywell International Inc. | Phosphorous-comprising dopants and methods for forming phosphorous-doped regions in semiconductor substrates using phosphorous-comprising dopants |
EP2316125A4 (en) * | 2008-08-20 | 2012-02-29 | Honeywell Int Inc | Phosphorous-comprising dopants and methods for forming phosphorous-doped regions in semiconductor substrates using phosphorous-comprising dopants |
US8518170B2 (en) | 2008-12-29 | 2013-08-27 | Honeywell International Inc. | Boron-comprising inks for forming boron-doped regions in semiconductor substrates using non-contact printing processes and methods for fabricating such boron-comprising inks |
US8324089B2 (en) | 2009-07-23 | 2012-12-04 | Honeywell International Inc. | Compositions for forming doped regions in semiconductor substrates, methods for fabricating such compositions, and methods for forming doped regions using such compositions |
US8629294B2 (en) | 2011-08-25 | 2014-01-14 | Honeywell International Inc. | Borate esters, boron-comprising dopants, and methods of fabricating boron-comprising dopants |
US8975170B2 (en) | 2011-10-24 | 2015-03-10 | Honeywell International Inc. | Dopant ink compositions for forming doped regions in semiconductor substrates, and methods for fabricating dopant ink compositions |
Also Published As
Publication number | Publication date |
---|---|
DE1816082B2 (en) | 1978-03-02 |
DE1816082A1 (en) | 1970-06-25 |
JPS5011233B1 (en) | 1975-04-28 |
SE344849B (en) | 1972-05-02 |
CH519788A (en) | 1972-02-29 |
FR2026659A1 (en) | 1970-09-18 |
NL6918777A (en) | 1970-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3664896A (en) | Deposited silicon diffusion sources | |
US3341381A (en) | Method of making a semiconductor by selective impurity diffusion | |
GB1335814A (en) | Transistor and method of manufacturing the same | |
GB1379975A (en) | Methods of manufacturing a semiconductor device comprising a voltagedependant capacitance diode | |
ES363412A1 (en) | Method for producing semiconductor integrated circuit device and product produced thereby | |
GB1073551A (en) | Integrated circuit comprising a diode and method of making the same | |
GB1250585A (en) | ||
GB1270130A (en) | Improvements in and relating to methods of manufacturing semiconductor devices | |
GB1217472A (en) | Integrated circuits | |
GB1194113A (en) | A Method of Manufacturing Transistors | |
ES404807A1 (en) | Planar epitaxial process for making linear integrated circuits | |
GB1334319A (en) | Integrated circuits | |
GB1495295A (en) | Thyristor combined with monolithically integrated diode and method for producing it | |
GB1053406A (en) | ||
GB1250584A (en) | ||
GB1127161A (en) | Improvements in or relating to diffused base transistors | |
GB1277138A (en) | High power avalanche diode and methods of making the same | |
US3969750A (en) | Diffused junction capacitor and process for producing the same | |
GB1339384A (en) | Method for the manufacturing of a semiconductor device | |
GB1052135A (en) | ||
GB1260567A (en) | Improvements in or relating to semiconductor devices | |
GB1061629A (en) | Semiconductor device fabrication | |
GB1372779A (en) | Integrated circuits | |
US3392067A (en) | Method of producing silicon variable capacitance diodes by diffusion | |
GB1098826A (en) | Method of making integrated circuit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |