GB1250464A - - Google Patents
Info
- Publication number
- GB1250464A GB1250464A GB1250464DA GB1250464A GB 1250464 A GB1250464 A GB 1250464A GB 1250464D A GB1250464D A GB 1250464DA GB 1250464 A GB1250464 A GB 1250464A
- Authority
- GB
- United Kingdom
- Prior art keywords
- slide
- adjustment
- springs
- pairs
- relative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002966 varnish Substances 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 239000012530 fluid Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 230000009347 mechanical transmission Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
- B23Q1/34—Relative movement obtained by use of deformable elements, e.g. piezoelectric, magnetostrictive, elastic or thermally-dilatable elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Abstract
1,250,464. Supporting photo-sensitive materials. SIEMENS A.G. Oct.28, 1968 [Oct.27, 1967], No.51008/68. Heading G2A. Apparatus used in the manufacture of a photosensitive varnish mask carrying a plurality of spaced images by successively locally exposing a varnish layer 8 at spaced locations comprises a first table A for holding the layer and its carrier 7, a second table B to which the first is mechanically coupled and upon which the first table is horizontally adjustable in two directions at right angles, a mechanical transmission system 5 for effecting coarse adjustment of slide 3 of the table B relative to a fixed reference plane 1, and a continuously operable adjustment means 10 for moving slide 4 of the table A relative to the table B. In use, the slide 3 is adjusted by the system 5, provided at least in pairs for adjustment in mutually perpendicular horizontal directions; the position of the slide4 relative to the reference plane monitored optically by means of markers 6 and interference bands 6a; the position of the slide 4 adjusted by the means 10; and the exposure carried out. This sequence is repeated to obtain the next image. After all the required exposures have been made, the varnish layer is processed and used in the production of a plurality of semiconductor components from a single plate. The fine adjustment means, provided in at least pairs for adjustment of the slide 4 in two directions at right angles, may be a rod (11), Fig. 2 (not shown) the dimensions of which are changed by application of a temperature change, or of an electric, electromagnetic, or magnetic field. Alternatively Figs.3 and 5 (not shown) the slide (4) may be held in equilibrium by pairs of springs (C, D, E, F), the springs (C, D) being heated to change the positions of the slide (4). In another embodiment, Fig.4 (not shown), the slide (4) may be positioned by springs and variable magnetic fields. If desired, the slide (4) can be continuously moved in one horizontal direction and as this happens the number of interference bands passed counted so as to trigger a flash device or a high speed shutter on specific counts. There may be a fluid bearing between the tables A, B.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0112621 | 1967-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1250464A true GB1250464A (en) | 1971-10-20 |
Family
ID=7531908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1250464D Expired GB1250464A (en) | 1967-10-27 | 1968-10-28 |
Country Status (5)
| Country | Link |
|---|---|
| CH (1) | CH485328A (en) |
| DE (1) | DE1614644A1 (en) |
| FR (1) | FR1587048A (en) |
| GB (1) | GB1250464A (en) |
| NL (1) | NL6811808A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2143049A (en) * | 1983-06-29 | 1985-01-30 | Dainippon Screen Mfg | Original transport in printing apparatus |
| GB2271191A (en) * | 1992-08-28 | 1994-04-06 | Randy John Penn | Alignment of wafers in printing |
| EP1211560A1 (en) * | 2000-12-04 | 2002-06-05 | Nikon Corporation | Gas-actuated stages including reaction-force-canceling mechanisms for use in charged-particle-beam microlithography systems |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0134268B1 (en) * | 1983-08-09 | 1987-11-19 | Siemens Aktiengesellschaft | Positioning and adjusting table and method of manufacture |
| CN113843636A (en) * | 2021-10-22 | 2021-12-28 | 王德胜 | Device and method for precisely and quickly adjusting angle during workpiece machining |
-
1967
- 1967-10-27 DE DE19671614644 patent/DE1614644A1/en active Pending
-
1968
- 1968-08-19 NL NL6811808A patent/NL6811808A/xx unknown
- 1968-10-24 FR FR1587048D patent/FR1587048A/fr not_active Expired
- 1968-10-25 CH CH1595468A patent/CH485328A/en not_active IP Right Cessation
- 1968-10-28 GB GB1250464D patent/GB1250464A/en not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2143049A (en) * | 1983-06-29 | 1985-01-30 | Dainippon Screen Mfg | Original transport in printing apparatus |
| US4580892A (en) * | 1983-06-29 | 1986-04-08 | Dainippon Screen Mfg. Co., Ltd. | Contact printing apparatus |
| GB2271191A (en) * | 1992-08-28 | 1994-04-06 | Randy John Penn | Alignment of wafers in printing |
| GB2271191B (en) * | 1992-08-28 | 1995-08-02 | Randy John Penn | Method and apparatus for accurate alignment of semiconductor wafers in photo printers |
| US5459546A (en) * | 1992-08-28 | 1995-10-17 | Penn; Randy J. | Method and apparatus for accurate alignment of semiconductor wafers in photo printers |
| EP1211560A1 (en) * | 2000-12-04 | 2002-06-05 | Nikon Corporation | Gas-actuated stages including reaction-force-canceling mechanisms for use in charged-particle-beam microlithography systems |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1614644A1 (en) | 1970-02-26 |
| NL6811808A (en) | 1969-04-29 |
| FR1587048A (en) | 1970-03-06 |
| CH485328A (en) | 1970-01-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |