GB1204834A - Improvements in or relating to epoxy resins - Google Patents

Improvements in or relating to epoxy resins

Info

Publication number
GB1204834A
GB1204834A GB491369A GB491369A GB1204834A GB 1204834 A GB1204834 A GB 1204834A GB 491369 A GB491369 A GB 491369A GB 491369 A GB491369 A GB 491369A GB 1204834 A GB1204834 A GB 1204834A
Authority
GB
United Kingdom
Prior art keywords
imidazole
epoxy resins
curing
monoepoxides
polymerization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB491369A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPG Industries Inc
Original Assignee
PPG Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PPG Industries Inc filed Critical PPG Industries Inc
Publication of GB1204834A publication Critical patent/GB1204834A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5093—Complexes of amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Abstract

1,204,834. Curing epoxy resins; polymerization of monoepoxides. PPG INDUSTRIES Inc. 29 Jan., 1969 [2 Feb., 1968], No. 4913/69. Headings C3B and C3R. Epoxy resins are cured and monoepoxides polymerized by means of a metal salt complex of an imidazole. Examples are complexes of a copper salt, e.g. CuSO 4 or CuCl 2 , or a nickel salt, e.g. NiCl2, with imidazole, 2-methyl-, 2-ethyl- or 2-ethyl-4-methyl-imidazole or adducts of imidazole with ethylenically unsaturated compounds, e.g. acrylic acid. The metal salt/ imidazole ratio may range from 1 : 1 to 1 : 6. Examples relate to: (a) the curing of conventional epoxy resins, e.g. diglycidyl ethers of bisphenol A, and (b) to the polymerization of phenyl glycidyl ether. The curing agents of the invention may be used in conjunction with nitrogeneous curing agents, e.g. dicyandiamide, urea, thiourea or diallylmelamine. The mixtures of epoxy resin and curing agent are stable for long periods at room temperature but cure readily at higher temperatures, e.g. 200-500‹ F.
GB491369A 1968-02-02 1969-01-29 Improvements in or relating to epoxy resins Expired GB1204834A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70252868A 1968-02-02 1968-02-02
US70253168A 1968-02-02 1968-02-02

Publications (1)

Publication Number Publication Date
GB1204834A true GB1204834A (en) 1970-09-09

Family

ID=27106985

Family Applications (1)

Application Number Title Priority Date Filing Date
GB491369A Expired GB1204834A (en) 1968-02-02 1969-01-29 Improvements in or relating to epoxy resins

Country Status (3)

Country Link
DE (1) DE1904641B2 (en)
FR (1) FR2001238A1 (en)
GB (1) GB1204834A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997021752A1 (en) 1995-12-14 1997-06-19 Minnesota Mining And Manufacturing Company Latent curing agent compositions and a method of making
CN111484821A (en) * 2020-04-28 2020-08-04 东莞市恒尔朗实业有限公司 Low-temperature fast-curing epoxy resin adhesive for relays and preparation method thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4413656A (en) * 1980-09-13 1983-11-08 Raychem Limited Wrap-around device
GB8304581D0 (en) * 1983-02-18 1983-03-23 Secr Defence Curing agents for epoxy resins
DE59510429D1 (en) * 1994-05-10 2002-11-28 Vantico Ag Epoxy resin mixtures containing metal complex catalysts

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997021752A1 (en) 1995-12-14 1997-06-19 Minnesota Mining And Manufacturing Company Latent curing agent compositions and a method of making
US5733954A (en) * 1995-12-14 1998-03-31 Minnesota Mining And Manufacturing Company Epoxy resin curing agent made via aqueous dispersion of an epoxide and an imidazole
US5801218A (en) * 1995-12-14 1998-09-01 Minnesota Mining And Manufacturing Company Latent curing agent compositions and a method of making
CN111484821A (en) * 2020-04-28 2020-08-04 东莞市恒尔朗实业有限公司 Low-temperature fast-curing epoxy resin adhesive for relays and preparation method thereof

Also Published As

Publication number Publication date
DE1904641B2 (en) 1971-03-11
DE1904641A1 (en) 1969-11-06
FR2001238A1 (en) 1969-09-26

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees