GB1202429A - Improvements in and relating to insulated gate field effect transistors - Google Patents
Improvements in and relating to insulated gate field effect transistorsInfo
- Publication number
- GB1202429A GB1202429A GB5101367A GB5101367A GB1202429A GB 1202429 A GB1202429 A GB 1202429A GB 5101367 A GB5101367 A GB 5101367A GB 5101367 A GB5101367 A GB 5101367A GB 1202429 A GB1202429 A GB 1202429A
- Authority
- GB
- United Kingdom
- Prior art keywords
- source
- layer
- bonding pads
- drain regions
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000005669 field effect Effects 0.000 title 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract 6
- 239000004408 titanium dioxide Substances 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 230000007062 hydrolysis Effects 0.000 abstract 1
- 238000006460 hydrolysis reaction Methods 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000013508 migration Methods 0.000 abstract 1
- 230000005012 migration Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0638—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layer, e.g. with channel stopper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Wire Bonding (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
1,202,429. Semi-conductor devices. ASSOCIATED SEMICONDUCTOR MFRS. Ltd. 9 Nov., 1967, No. 51013/67. Heading H1K. An IGFET is provided with a layer of titanium dioxide on the insulating layer at such an area beyond the gate electrode as to interrupt a path for ion or charge migration between the source and drain electrodes. As shown, Fig. 2, in an enhancement mode IGFET parallel elongate P+ type source and drain regions are produced by diffusing boron into an N-type silicon wafer using an oxide masking technique, a fresh layer of silicon oxide is provided and the source and drain regions exposed, aluminium is deposited over the surface and selectively photo-engraved to leave regions 2 and 3 contacting the source and drain regions with extensions over the oxide to large area bonding pads and an insulated gate electrode 4 extending between the source and drain regions. The whole surface is then covered with a layer of titanium dioxide by vapour phase hydrolysis of titanium tetrachloride or by sputtering, and openings 5, 6, and 7 are etched to expose the bonding pads of the source, drain and gate electrodes, respectively. A plurality of devices may be produced simultaneously in a single wafer which is then subdivided. Wires 8, 9 and 10 are thermo-compression bonded to the exposed bonding pads of the individual devices which are then encapsulated. The titanium dioxide layer may be deposited over the surface of the oxide layer and electrodes after the wires have been attached to the bonding pads, the etching step being unnecessary in this case.
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB5101367A GB1202429A (en) | 1967-11-09 | 1967-11-09 | Improvements in and relating to insulated gate field effect transistors |
CH1658268A CH492304A (en) | 1967-11-09 | 1968-11-06 | Semiconductor device comprising a field effect transistor with an insulated gate electrode and method for manufacturing such a device |
JP8090268A JPS4822392B1 (en) | 1967-11-09 | 1968-11-06 | |
AT1077168A AT297801B (en) | 1967-11-09 | 1968-11-06 | Semiconductor device comprising a field effect transistor with an insulated gate electrode and method for manufacturing such a device |
SE1503768A SE353187B (en) | 1967-11-09 | 1968-11-06 | |
NL6815830A NL6815830A (en) | 1967-11-09 | 1968-11-07 | |
DE19681807570 DE1807570A1 (en) | 1967-11-09 | 1968-11-07 | Semiconductor device comprising a field effect transistor with an insulated gate electrode and method for manufacturing such a device |
ES359950A ES359950A1 (en) | 1967-11-09 | 1968-11-07 | Improvements in and relating to insulated gate field effect transistors |
BE723665D BE723665A (en) | 1967-11-09 | 1968-11-08 | |
BR20385568A BR6803855D0 (en) | 1967-11-09 | 1968-11-08 | PROCESS OF MANUFACTURING A SEMICONDUCTOR DEVICE AND ITS PRODUCT |
FR1591724D FR1591724A (en) | 1967-11-09 | 1968-11-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB5101367A GB1202429A (en) | 1967-11-09 | 1967-11-09 | Improvements in and relating to insulated gate field effect transistors |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1202429A true GB1202429A (en) | 1970-08-19 |
Family
ID=10458300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5101367A Expired GB1202429A (en) | 1967-11-09 | 1967-11-09 | Improvements in and relating to insulated gate field effect transistors |
Country Status (11)
Country | Link |
---|---|
JP (1) | JPS4822392B1 (en) |
AT (1) | AT297801B (en) |
BE (1) | BE723665A (en) |
BR (1) | BR6803855D0 (en) |
CH (1) | CH492304A (en) |
DE (1) | DE1807570A1 (en) |
ES (1) | ES359950A1 (en) |
FR (1) | FR1591724A (en) |
GB (1) | GB1202429A (en) |
NL (1) | NL6815830A (en) |
SE (1) | SE353187B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4835585A (en) * | 1984-11-26 | 1989-05-30 | American Telephone And Telegraph Company, At&T Bell Laboratories | Trench gate structures |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59174992U (en) * | 1983-05-12 | 1984-11-22 | 五洋建設株式会社 | Intermediate buoy for mooring offshore structures |
-
1967
- 1967-11-09 GB GB5101367A patent/GB1202429A/en not_active Expired
-
1968
- 1968-11-06 SE SE1503768A patent/SE353187B/xx unknown
- 1968-11-06 JP JP8090268A patent/JPS4822392B1/ja active Pending
- 1968-11-06 CH CH1658268A patent/CH492304A/en not_active IP Right Cessation
- 1968-11-06 AT AT1077168A patent/AT297801B/en not_active IP Right Cessation
- 1968-11-07 DE DE19681807570 patent/DE1807570A1/en active Pending
- 1968-11-07 NL NL6815830A patent/NL6815830A/xx unknown
- 1968-11-07 ES ES359950A patent/ES359950A1/en not_active Expired
- 1968-11-08 BR BR20385568A patent/BR6803855D0/en unknown
- 1968-11-08 BE BE723665D patent/BE723665A/xx unknown
- 1968-11-12 FR FR1591724D patent/FR1591724A/fr not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4835585A (en) * | 1984-11-26 | 1989-05-30 | American Telephone And Telegraph Company, At&T Bell Laboratories | Trench gate structures |
Also Published As
Publication number | Publication date |
---|---|
BE723665A (en) | 1969-05-08 |
BR6803855D0 (en) | 1973-04-17 |
ES359950A1 (en) | 1970-10-16 |
JPS4822392B1 (en) | 1973-07-05 |
SE353187B (en) | 1973-01-22 |
NL6815830A (en) | 1969-05-13 |
AT297801B (en) | 1972-04-10 |
CH492304A (en) | 1970-06-15 |
DE1807570A1 (en) | 1969-06-26 |
FR1591724A (en) | 1970-05-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |