GB1195301A - Improvements in or relating to Silk Screen Inks and Processes of Using the Same in the Production of Printed Circuits - Google Patents

Improvements in or relating to Silk Screen Inks and Processes of Using the Same in the Production of Printed Circuits

Info

Publication number
GB1195301A
GB1195301A GB38801/67A GB3880167A GB1195301A GB 1195301 A GB1195301 A GB 1195301A GB 38801/67 A GB38801/67 A GB 38801/67A GB 3880167 A GB3880167 A GB 3880167A GB 1195301 A GB1195301 A GB 1195301A
Authority
GB
United Kingdom
Prior art keywords
silk screen
xylene
ink
polyurethane
polyester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB38801/67A
Inventor
Edward Donnelly
Harold Lishman Petrie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Formica International Ltd
Original Assignee
Formica International Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formica International Ltd filed Critical Formica International Ltd
Priority to GB38801/67A priority Critical patent/GB1195301A/en
Publication of GB1195301A publication Critical patent/GB1195301A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4205—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups
    • C08G18/4208—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

1,195,301. Polyurethane based silk screen ink. FORMICA INTERNATIONAL Ltd. 22 Nov., 1968 [23 Aug., 1967], No. 38801/67. Heading C3R. [Also in Divisions B2 and H1] A silk screen ink comprises a polyurethane obtained by reacting a di- or poly-isocyanate and a polyester, 20 to 60% by weight of the polyester of an inert finely divided filler capable of imparting abrasion resistance to dried films of the ink and a solvent for the polyurethane, which solvent has a b.p. of at least 90‹ C. or comprises a mixture of solvents substantially free of compounds having boiling points less than 90‹ C., the ink being free of materials capable of making dried films thereof other than electrically insulative. The di- or poly-isooyanates used are preferably those which are non- volatile, e.g. oligomerized arylene diisocyanates. Linear or branched polyesters may be used. The filler may be finely divided silica, alumina or aluminium silicate. The solvents most preferably have a b.p. between 110‹ and 150‹ C. and may be o-xylene, m-xylene, p-xylene or toluene, optionally mixed with ketones or alkoxy-alkyl esters.
GB38801/67A 1967-08-23 1967-08-23 Improvements in or relating to Silk Screen Inks and Processes of Using the Same in the Production of Printed Circuits Expired GB1195301A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB38801/67A GB1195301A (en) 1967-08-23 1967-08-23 Improvements in or relating to Silk Screen Inks and Processes of Using the Same in the Production of Printed Circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB38801/67A GB1195301A (en) 1967-08-23 1967-08-23 Improvements in or relating to Silk Screen Inks and Processes of Using the Same in the Production of Printed Circuits

Publications (1)

Publication Number Publication Date
GB1195301A true GB1195301A (en) 1970-06-17

Family

ID=10405781

Family Applications (1)

Application Number Title Priority Date Filing Date
GB38801/67A Expired GB1195301A (en) 1967-08-23 1967-08-23 Improvements in or relating to Silk Screen Inks and Processes of Using the Same in the Production of Printed Circuits

Country Status (1)

Country Link
GB (1) GB1195301A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2279817A (en) * 1993-07-02 1995-01-11 Gec Avery Ltd A method of encapsulating components on a printed circuit
GB2302451A (en) * 1995-06-16 1997-01-15 Nec Corp Mounting semiconductor devices in stepped recesses in a circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2279817A (en) * 1993-07-02 1995-01-11 Gec Avery Ltd A method of encapsulating components on a printed circuit
GB2279817B (en) * 1993-07-02 1998-01-14 Gec Avery Ltd A method of encapsulating components on a printed circuit
GB2302451A (en) * 1995-06-16 1997-01-15 Nec Corp Mounting semiconductor devices in stepped recesses in a circuit board
US5801438A (en) * 1995-06-16 1998-09-01 Nec Corporation Semiconductor device mounting and multi-chip module
GB2302451B (en) * 1995-06-16 2000-01-26 Nec Corp Semiconductor device mounting method and multi-chip module produced by the same

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees