GB1174285A - Etching - Google Patents

Etching

Info

Publication number
GB1174285A
GB1174285A GB2657/67A GB265767A GB1174285A GB 1174285 A GB1174285 A GB 1174285A GB 2657/67 A GB2657/67 A GB 2657/67A GB 265767 A GB265767 A GB 265767A GB 1174285 A GB1174285 A GB 1174285A
Authority
GB
United Kingdom
Prior art keywords
etchant
copper
etching
tape
inflow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2657/67A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FMC Corp
Original Assignee
FMC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FMC Corp filed Critical FMC Corp
Publication of GB1174285A publication Critical patent/GB1174285A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/08Apparatus, e.g. for photomechanical printing surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Investigating And Analyzing Materials By Characteristic Methods (AREA)

Abstract

1,174,285. Etching. FMC CORP. 18 Jan., 1967 [24 Jan., 1966], No. 2657/67. Heading B6J. An article such as a copper foil plastic laminate 10, Fig. 1, is etched in a tank 1, while a small amount of the etchant is passed to a control unit 7. A tape 11, Figs. 1 and 2, of copper foil laminated on to a transparent polyester tape backing, is passed through the etchant in the control unit, so that the copper is removed. The tape passes over a window 19 and between a light source 21 and two photoelectric cells 20, 22. Too rapid etching dissolves the copper before reaching the cell 20, which operates to decrease the inflow of etchant to the tank 1. Too slow etching results in some copper remaining when the cell 22 is reached, and the latter operates to increase the inflow of etchant. Alternatively, the cells may control some other etch factor such as the bath temperature or spray pressure. The etchant may be a solution of ammonium persulphate containing a catalyst amount of mercuric chloride.
GB2657/67A 1966-01-24 1967-01-18 Etching Expired GB1174285A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52269466A 1966-01-24 1966-01-24

Publications (1)

Publication Number Publication Date
GB1174285A true GB1174285A (en) 1969-12-17

Family

ID=24081942

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2657/67A Expired GB1174285A (en) 1966-01-24 1967-01-18 Etching

Country Status (4)

Country Link
US (1) US3503817A (en)
DE (1) DE1698663A1 (en)
ES (1) ES335776A1 (en)
GB (1) GB1174285A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2843777A1 (en) * 1977-10-06 1979-04-12 Rca Corp PROCESS FOR ETCHING A SEQUENCE OF OBJECTS FROM A SHEET METAL
GB2130970A (en) * 1980-12-05 1984-06-13 Burroughs Corp Etching depth monitor

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2410927C3 (en) * 1974-03-05 1978-11-16 Kollmorgen Corp., Glen Cove, N.Y. (V.St.A.) Measuring probe for layer thickness measurements and methods for measuring the layer thickness or the rate of deposition by means of this probe
US4142099A (en) * 1974-03-05 1979-02-27 Kollmorgen Technologies Corporation Process and apparatus for controlling metal thickness, and deposition and degradation rates
DE2815373A1 (en) * 1978-04-10 1979-10-11 Siemens Ag METHOD AND DEVICE FOR TESTING HIGH-PRECISION FORMAT PARTS
JP2500402B2 (en) * 1991-09-05 1996-05-29 上村工業株式会社 Etching rate measuring method and etching rate measuring device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762036A (en) * 1954-09-02 1956-09-04 North American Aviation Inc Method of monitoring etching depth
US2978301A (en) * 1957-01-11 1961-04-04 Fmc Corp Process and composition for the dissolution of copper
US3032753A (en) * 1958-05-20 1962-05-01 Arthur D Knapp Apparatus for controlling the depth of etching
US2933094A (en) * 1958-08-26 1960-04-19 Ind Instr Inc Pickling bath instrumentation
GB980414A (en) * 1962-02-15 1965-01-13 Crosfield Electronics Ltd Improvements in or relating to the etching of printing surfaces
US3401068A (en) * 1965-02-15 1968-09-10 Chemcut Corp Method and apparatus for uniformly etching printed circuits by control of the conveyor speed

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2843777A1 (en) * 1977-10-06 1979-04-12 Rca Corp PROCESS FOR ETCHING A SEQUENCE OF OBJECTS FROM A SHEET METAL
GB2130970A (en) * 1980-12-05 1984-06-13 Burroughs Corp Etching depth monitor

Also Published As

Publication number Publication date
DE1698663A1 (en) 1971-06-16
ES335776A1 (en) 1967-12-01
US3503817A (en) 1970-03-31

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees