GB1147335A - Circuit Board Interconnection. - Google Patents

Circuit Board Interconnection.

Info

Publication number
GB1147335A
GB1147335A GB21610/65A GB2161065A GB1147335A GB 1147335 A GB1147335 A GB 1147335A GB 21610/65 A GB21610/65 A GB 21610/65A GB 2161065 A GB2161065 A GB 2161065A GB 1147335 A GB1147335 A GB 1147335A
Authority
GB
United Kingdom
Prior art keywords
board
wiring
pins
circuit
welded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB21610/65A
Inventor
John Anthony Cayzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Ltd
Original Assignee
Texas Instruments Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Ltd filed Critical Texas Instruments Ltd
Priority to GB21610/65A priority Critical patent/GB1147335A/en
Publication of GB1147335A publication Critical patent/GB1147335A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/222Completing of printed circuits by adding non-printed jumper connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/09181Notches in edge pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10287Metal wires as connectors or conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

1,147,335. Circuit assemblies. TEXAS INSTRUMENTS Ltd. 23 May, 1966 [21 May, 1965], No. 21610/65. Heading H1R. [Also in Division H2] In an arrangement for connecting a first circuit board 1 to a second circuit board 2, a plurality of contact pins 5 are secured to board 1 along one edge thereof, and are inserted in a series of holes 10 in board 2, wherein they contact pins 11B secured to board 2, mechanical and electrical connection between pins 5 and 11B being established by a wire-wrapped joint 12; alternatively the pins may be secured together by a weld 15, Fig. 3. Each pin 5 forms a bight, both free ends of which are bent to protrude through apertures 6 in board 1, and are bent again to form tabs 7 which are welded at 8 to printed wiring 9 on board 1. Pins 11B have a single bent portion which is welded to printed wiring 11A on the underside of board 2. The invention is described with reference to the connection of a plurality of parallel spaced first boards 1, each bearing electronic modules 3, to a single second board 2 (Fig. 1, not shown). Fig. 3 depicts a second board formed from two printed circuit boards 13, each carrying printed wiring 16 on both sides thereof, and the two circuit boards 13 being bonded together by a layer of epoxy resin filler 14. Connections between wiring on opposite sides of the same board, and between wiring on different boards, are made by lead-through conductors 18, 20 which pass through apertures in the board(s) and are welded at each end to the relevant wiring.
GB21610/65A 1965-05-21 1965-05-21 Circuit Board Interconnection. Expired GB1147335A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB21610/65A GB1147335A (en) 1965-05-21 1965-05-21 Circuit Board Interconnection.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB21610/65A GB1147335A (en) 1965-05-21 1965-05-21 Circuit Board Interconnection.

Publications (1)

Publication Number Publication Date
GB1147335A true GB1147335A (en) 1969-04-02

Family

ID=1759660

Family Applications (1)

Application Number Title Priority Date Filing Date
GB21610/65A Expired GB1147335A (en) 1965-05-21 1965-05-21 Circuit Board Interconnection.

Country Status (1)

Country Link
GB (1) GB1147335A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4255005A (en) * 1978-06-02 1981-03-10 Nissan Motor Company, Limited Electrical connector assembly
DE3005269A1 (en) * 1980-02-13 1981-08-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Programmable control unit based upon PROM - with memory chips mounted in sockets on card such that removal is possible with card in rack
CN101574773B (en) * 2008-05-08 2010-12-15 华通电脑股份有限公司 Positioning pin assembly device of printed circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4255005A (en) * 1978-06-02 1981-03-10 Nissan Motor Company, Limited Electrical connector assembly
DE3005269A1 (en) * 1980-02-13 1981-08-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Programmable control unit based upon PROM - with memory chips mounted in sockets on card such that removal is possible with card in rack
CN101574773B (en) * 2008-05-08 2010-12-15 华通电脑股份有限公司 Positioning pin assembly device of printed circuit board

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