GB1144671A - Improvements in and relating to semiconductor device headers - Google Patents

Improvements in and relating to semiconductor device headers

Info

Publication number
GB1144671A
GB1144671A GB2396766A GB2396766A GB1144671A GB 1144671 A GB1144671 A GB 1144671A GB 2396766 A GB2396766 A GB 2396766A GB 2396766 A GB2396766 A GB 2396766A GB 1144671 A GB1144671 A GB 1144671A
Authority
GB
United Kingdom
Prior art keywords
moulded
insulating material
metal
semi
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2396766A
Inventor
Geoffrey William Scholes
Christopher Robert Coombes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASSOCIATED SEMICONDUCTOR MFT
Original Assignee
ASSOCIATED SEMICONDUCTOR MFT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to GB23967D priority Critical patent/GB23967A/en
Application filed by ASSOCIATED SEMICONDUCTOR MFT filed Critical ASSOCIATED SEMICONDUCTOR MFT
Priority to GB2396766A priority patent/GB1144671A/en
Priority to FR107978A priority patent/FR1524649A/en
Priority to DE19671614254 priority patent/DE1614254A1/en
Priority to NL6707304A priority patent/NL6707304A/xx
Publication of GB1144671A publication Critical patent/GB1144671A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

1,144,671. Semi-conductor devices. ASSOCIATED SEMICONDUCTOR MFRS. Ltd. 27 May, 1966, No. 23967/66. Heading H1K. A header for an integrated circuit or other semi-conductor device comprises a moulded bottom wall and side wall 2 of insulating material which define an enclosure, an isolated metal pad 5 (to which the semi-conductor device is to be bonded) moulded in the insulating material and situated at the base of an internal depression in the bottom wall, and a plurality of metal connecting leads 6 moulded in the side wall 2 and insulated from the metal pad 5 by the insulating material, the leads 6 extending into the enclosure and having exposed end portions 9 situated therein higher than the metal pad 5. The upper surface of the side wall 2 may have moulded thereto a metal frame 8 to which a lid is subsequently soldered, and the leads 6 may initially take the form of teeth projecting from a frame 7 which is severed after assembly of the header, this assembly being effected under heat and pressure in a jig (Fig. 4). The insulating material may be a borosilicate glass, and the metal parts may be of a nickel/iron/oobalt alloy with the exposed portions coated with gold by means of electroless plating.
GB2396766A 1966-05-27 1966-05-27 Improvements in and relating to semiconductor device headers Expired GB1144671A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB23967D GB23967A (en) 1966-05-27
GB2396766A GB1144671A (en) 1966-05-27 1966-05-27 Improvements in and relating to semiconductor device headers
FR107978A FR1524649A (en) 1966-05-27 1967-05-26 Socket for semiconductor device
DE19671614254 DE1614254A1 (en) 1966-05-27 1967-05-26 Socket for a semiconductor device
NL6707304A NL6707304A (en) 1966-05-27 1967-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2396766A GB1144671A (en) 1966-05-27 1966-05-27 Improvements in and relating to semiconductor device headers

Publications (1)

Publication Number Publication Date
GB1144671A true GB1144671A (en) 1969-03-05

Family

ID=10204281

Family Applications (2)

Application Number Title Priority Date Filing Date
GB23967D Active GB23967A (en) 1966-05-27
GB2396766A Expired GB1144671A (en) 1966-05-27 1966-05-27 Improvements in and relating to semiconductor device headers

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB23967D Active GB23967A (en) 1966-05-27

Country Status (3)

Country Link
DE (1) DE1614254A1 (en)
GB (2) GB1144671A (en)
NL (1) NL6707304A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2230863C2 (en) * 1972-06-23 1981-10-08 Intersil Inc., Cupertino, Calif. Semiconductor element housing with glass or ceramic insulator - has plastics sleeve surrounding insulator, from which terminal pins protrude

Also Published As

Publication number Publication date
NL6707304A (en) 1967-11-28
DE1614254A1 (en) 1970-05-27
GB23967A (en)

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