GB1123563A - Improvements in or relating to sputtering apparatus - Google Patents

Improvements in or relating to sputtering apparatus

Info

Publication number
GB1123563A
GB1123563A GB35863/65A GB3586365A GB1123563A GB 1123563 A GB1123563 A GB 1123563A GB 35863/65 A GB35863/65 A GB 35863/65A GB 3586365 A GB3586365 A GB 3586365A GB 1123563 A GB1123563 A GB 1123563A
Authority
GB
United Kingdom
Prior art keywords
plasma
target
ion
sputtering
solenoid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB35863/65A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Consolidated Vacuum Corp
Original Assignee
Consolidated Vacuum Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Consolidated Vacuum Corp filed Critical Consolidated Vacuum Corp
Publication of GB1123563A publication Critical patent/GB1123563A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/354—Introduction of auxiliary energy into the plasma
    • C23C14/355—Introduction of auxiliary energy into the plasma using electrons, e.g. triode sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S422/00—Chemical apparatus and process disinfecting, deodorizing, preserving, or sterilizing
    • Y10S422/906—Plasma or ion generation means

Abstract

Fig.1 shows apparatus wherein material is sputtered from an ion target 94 on to a substrate 98. The sputtering chamber can be evacuated at 17 and ionizable gas such as argon can be supplied from a tank 28, e.g. to a pressure of 1 micron. A filament 41 is heated to supply electrons which move through a cooled electron guide 32 towards an anode 68 and create an ion plasma 131 along an axis 77. The ion target 94 is electrically biased so as to attract ions from the axial plasma. A solenoid 116A, having a controllable field, controls the density of ions attracted by the target 94 and the sputtering of material from the target and so controls the density of the resulting film on the substrate. The strength of the magnetic field is controlled by a variable resistor 120 and the position of the field can be altered by hooking hooks 118 into different links of suspending chains. The solenoid may be suspended in a tilted position. Figs. 2 and 3 (not shown) illustrate apparatus where a shaped nozzle at the end of the electron guide 32 and a shaped anode (157) cause the ion plasma to be in the form of a curtain. Fig.4 (not shown) illustrates apparatus wherein the plasma axis is arranged to be horizontal. Fig.6 (not shown) illustrates a modification wherein ion plasma can be created between a central position (205) and one or other of two (or more) anodes <PICT:1123563/C6-C7/1> (181, 181') in the coating of substrates (190, 190') by sputtering from targets (95, 95').
GB35863/65A 1964-08-20 1965-08-20 Improvements in or relating to sputtering apparatus Expired GB1123563A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US390800A US3305473A (en) 1964-08-20 1964-08-20 Triode sputtering apparatus for depositing uniform coatings
US475970A US3393142A (en) 1964-08-20 1965-07-30 Cathode sputtering apparatus with plasma confining means

Publications (1)

Publication Number Publication Date
GB1123563A true GB1123563A (en) 1968-08-14

Family

ID=27013280

Family Applications (1)

Application Number Title Priority Date Filing Date
GB35863/65A Expired GB1123563A (en) 1964-08-20 1965-08-20 Improvements in or relating to sputtering apparatus

Country Status (3)

Country Link
US (2) US3305473A (en)
DE (1) DE1515295B1 (en)
GB (1) GB1123563A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2416273A1 (en) * 1978-01-31 1979-08-31 Inst T Avtomobilno Vacuum coating appts. esp. for high speed steel or hard metal tools - has coating source material coaxially beneath hollow carrier for tools

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3533919A (en) * 1965-02-24 1970-10-13 Nat Res Dev Manufacture of superconductors
US3366562A (en) * 1965-04-29 1968-01-30 Commerce Usa Method of conducting electrolysis in a solid ionic conductor using an electron beam
US3436332A (en) * 1965-07-15 1969-04-01 Nippon Electric Co Stabilized low pressure triode sputtering apparatus
NL130959C (en) * 1965-12-17
US3544445A (en) * 1966-09-01 1970-12-01 Bendix Corp Floating shield in a triode sputtering apparatus protecting the base from the discharge
US3492215A (en) * 1967-02-27 1970-01-27 Bendix Corp Sputtering of material simultaneously evaporated onto the target
US3514391A (en) * 1967-05-05 1970-05-26 Nat Res Corp Sputtering apparatus with finned anode
US3507774A (en) * 1967-06-02 1970-04-21 Nat Res Corp Low energy sputtering apparatus for operation below one micron pressure
US3515663A (en) * 1968-02-01 1970-06-02 Hewlett Packard Co Triode sputtering apparatus using an electron emitter
US3844924A (en) * 1970-08-03 1974-10-29 Texas Instruments Inc Sputtering apparatus for forming ohmic contacts for semiconductor devices
US3779891A (en) * 1971-10-26 1973-12-18 Eastman Kodak Co Triode sputtering apparatus
JPS51117933A (en) * 1975-04-10 1976-10-16 Tokuda Seisakusho Spattering apparatus
US4038171A (en) * 1976-03-31 1977-07-26 Battelle Memorial Institute Supported plasma sputtering apparatus for high deposition rate over large area
DE2800852C2 (en) * 1978-01-10 1983-07-14 Jurij Akimovi&ccaron; Moskva Dmitriev Device for ion plasma coating
US4885070A (en) * 1988-02-12 1989-12-05 Leybold Aktiengesellschaft Method and apparatus for the application of materials
DE3830478A1 (en) * 1987-09-21 1989-07-13 Leybold Ag Cathodic sputtering device
US5130005A (en) * 1990-10-31 1992-07-14 Materials Research Corporation Magnetron sputter coating method and apparatus with rotating magnet cathode
US20050040037A1 (en) * 2003-08-20 2005-02-24 Walton Scott G. Electron beam enhanced large area deposition system
USH2209H1 (en) * 2004-04-14 2008-02-05 The United States Of America As Represented By The Secretary Of The Navy Large area metallization pretreatment and surface activation system
CN103160903B (en) * 2011-12-16 2017-02-22 富智康精密电子（廊坊）有限公司 Anodization coloring apparatus and treating method of coloring by using same
US10662529B2 (en) * 2016-01-05 2020-05-26 Applied Materials, Inc. Cooled gas feed block with baffle and nozzle for HDP-CVD

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL50072C (en) * 1935-12-28
US2239642A (en) * 1936-05-27 1941-04-22 Bernhard Berghaus Coating of articles by means of cathode disintegration
DE672664C (en) * 1936-06-17 1939-03-08 Bernhard Berghaus Method for cathode atomization by means of an additionally heated cathode
GB481842A (en) * 1936-06-17 1938-03-18 Bernhard Berghaus Improvements in and relating to the coating of articles by vaporisation of the coating materials
GB505135A (en) * 1937-03-25 1939-05-05 Bernhard Berghaus Improvements in and relating to the coating of articles by cathode disintegration
DE764927C (en) * 1939-02-22 1951-08-06 Bosch Gmbh Robert Process for evaporation in a vacuum
US2636855A (en) * 1948-03-25 1953-04-28 Hilger & Watts Ltd Method of producing photoconductive coatings
US3021271A (en) * 1959-04-27 1962-02-13 Gen Mills Inc Growth of solid layers on substrates which are kept under ion bombardment before and during deposition
DE1122801B (en) * 1960-05-25 1962-01-25 Siemens Ag Process for the production of metallic layers by means of cathode sputtering
US3117022A (en) * 1960-09-06 1964-01-07 Space Technhology Lab Inc Deposition arrangement
US3133874A (en) * 1960-12-05 1964-05-19 Robert W Morris Production of thin film metallic patterns
US3324019A (en) * 1962-12-11 1967-06-06 Schjeldahl Co G T Method of sputtering sequentially from a plurality of cathodes
US3296115A (en) * 1964-03-02 1967-01-03 Schjeldahl Co G T Sputtering of metals wherein gas flow is confined to increase the purity of deposition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2416273A1 (en) * 1978-01-31 1979-08-31 Inst T Avtomobilno Vacuum coating appts. esp. for high speed steel or hard metal tools - has coating source material coaxially beneath hollow carrier for tools

Also Published As

Publication number Publication date
DE1515295B1 (en) 1972-03-16
US3305473A (en) 1967-02-21
US3393142A (en) 1968-07-16

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