GB1101770A - Compression bond encapsulation structure with integral caseweld ring - Google Patents

Compression bond encapsulation structure with integral caseweld ring

Info

Publication number
GB1101770A
GB1101770A GB23011/66A GB2301166A GB1101770A GB 1101770 A GB1101770 A GB 1101770A GB 23011/66 A GB23011/66 A GB 23011/66A GB 2301166 A GB2301166 A GB 2301166A GB 1101770 A GB1101770 A GB 1101770A
Authority
GB
United Kingdom
Prior art keywords
stack
layer
cylinder
conductor
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB23011/66A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of GB1101770A publication Critical patent/GB1101770A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/926—Elongated lead extending axially through another elongated lead

Landscapes

  • Die Bonding (AREA)
GB23011/66A 1965-06-14 1966-05-24 Compression bond encapsulation structure with integral caseweld ring Expired GB1101770A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US463794A US3337781A (en) 1965-06-14 1965-06-14 Encapsulation means for a semiconductor device

Publications (1)

Publication Number Publication Date
GB1101770A true GB1101770A (en) 1968-01-31

Family

ID=23841396

Family Applications (1)

Application Number Title Priority Date Filing Date
GB23011/66A Expired GB1101770A (en) 1965-06-14 1966-05-24 Compression bond encapsulation structure with integral caseweld ring

Country Status (3)

Country Link
US (1) US3337781A (https=)
BE (1) BE682535A (https=)
GB (1) GB1101770A (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3450962A (en) * 1966-02-01 1969-06-17 Westinghouse Electric Corp Pressure electrical contact assembly for a semiconductor device
US3424852A (en) * 1966-07-26 1969-01-28 Int Rectifier Corp Housing structure and method of manufacture for semi-conductor device
GB1128400A (en) * 1966-11-04 1968-09-25 Ass Elect Ind Pressure contact semi-conductor devices
GB1133358A (en) * 1966-11-11 1968-11-13 Ass Elect Ind Pressure contact semi-conductor devices
GB1144917A (en) * 1966-12-02 1969-03-12 Ass Elect Ind Improvements in pressure contact semi-conductor devices
US3504238A (en) * 1966-12-16 1970-03-31 Westinghouse Brake & Signal Solder free variable pressure contacted semiconductor device
SE333197B (sv) * 1966-12-27 1971-03-08 Asea Ab Halvledaranordning foer stora stroemstyrkor
US3643136A (en) * 1970-05-22 1972-02-15 Gen Electric Glass passivated double beveled semiconductor device with partially spaced preform
US4143395A (en) * 1976-10-15 1979-03-06 Tokyo Shibaura Electric Co., Ltd. Stud-type semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2946935A (en) * 1958-10-27 1960-07-26 Sarkes Tarzian Diode
NL280742A (https=) * 1961-08-12
BE638960A (https=) * 1962-10-23
US3170098A (en) * 1963-03-15 1965-02-16 Westinghouse Electric Corp Compression contacted semiconductor devices

Also Published As

Publication number Publication date
US3337781A (en) 1967-08-22
BE682535A (https=) 1966-11-14

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