GB1099874A - Semi-conductor devices for high currents - Google Patents
Semi-conductor devices for high currentsInfo
- Publication number
- GB1099874A GB1099874A GB1597065A GB1597065A GB1099874A GB 1099874 A GB1099874 A GB 1099874A GB 1597065 A GB1597065 A GB 1597065A GB 1597065 A GB1597065 A GB 1597065A GB 1099874 A GB1099874 A GB 1099874A
- Authority
- GB
- United Kingdom
- Prior art keywords
- lid
- flanges
- rings
- joined
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
- H10W40/237—Arrangements for cooling characterised by their places of attachment or cooling paths attached to additional arrangements for cooling
Landscapes
- Thyristors (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE481564 | 1964-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1099874A true GB1099874A (en) | 1968-01-17 |
Family
ID=20265035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1597065A Expired GB1099874A (en) | 1964-04-20 | 1965-04-14 | Semi-conductor devices for high currents |
Country Status (7)
| Country | Link |
|---|---|
| BE (1) | BE662743A (enExample) |
| CH (1) | CH431731A (enExample) |
| FI (1) | FI41178C (enExample) |
| FR (1) | FR1430747A (enExample) |
| GB (1) | GB1099874A (enExample) |
| NL (1) | NL6504892A (enExample) |
| NO (1) | NO118754B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3151113A1 (de) * | 1980-12-24 | 1982-08-19 | Jeumont-Schneider, 92811 Puteaux | "elektroden fuer leistungs-halbleiterzelle" |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3457472A (en) * | 1966-10-10 | 1969-07-22 | Gen Electric | Semiconductor devices adapted for pressure mounting |
| US3489957A (en) * | 1967-09-07 | 1970-01-13 | Power Semiconductors Inc | Semiconductor device in a sealed package |
| DE2049012C3 (de) * | 1970-09-30 | 1979-07-12 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes |
| KR970000281B1 (ko) * | 1991-12-30 | 1997-01-08 | 엘지전자 주식회사 | 마그네트론의 냉각핀 |
-
1965
- 1965-04-13 NO NO157673A patent/NO118754B/no unknown
- 1965-04-14 GB GB1597065A patent/GB1099874A/en not_active Expired
- 1965-04-15 NL NL6504892A patent/NL6504892A/xx unknown
- 1965-04-15 FI FI93465A patent/FI41178C/fi active
- 1965-04-17 CH CH539865A patent/CH431731A/de unknown
- 1965-04-20 FR FR13835A patent/FR1430747A/fr not_active Expired
- 1965-04-20 BE BE662743A patent/BE662743A/xx unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3151113A1 (de) * | 1980-12-24 | 1982-08-19 | Jeumont-Schneider, 92811 Puteaux | "elektroden fuer leistungs-halbleiterzelle" |
Also Published As
| Publication number | Publication date |
|---|---|
| NL6504892A (enExample) | 1965-10-21 |
| NO118754B (enExample) | 1970-02-09 |
| FI41178B (enExample) | 1969-06-02 |
| BE662743A (enExample) | 1965-08-17 |
| FI41178C (fi) | 1969-09-10 |
| CH431731A (de) | 1967-03-15 |
| FR1430747A (fr) | 1966-03-04 |
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