GB1095387A - - Google Patents
Info
- Publication number
- GB1095387A GB1095387A GB1095387A GB1095387A GB1095387A GB 1095387 A GB1095387 A GB 1095387A GB 1095387 A GB1095387 A GB 1095387A GB 1095387 A GB1095387 A GB 1095387A GB 1095387 A GB1095387 A GB 1095387A
- Authority
- GB
- United Kingdom
- Prior art keywords
- transistor
- encapsulated
- wires
- magnesia
- harden
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 abstract 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 abstract 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 abstract 4
- 239000000203 mixture Substances 0.000 abstract 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 abstract 2
- 239000004568 cement Substances 0.000 abstract 2
- 229910001629 magnesium chloride Inorganic materials 0.000 abstract 2
- 239000000395 magnesium oxide Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 abstract 2
- 239000011787 zinc oxide Substances 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 235000011837 pasties Nutrition 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000002002 slurry Substances 0.000 abstract 1
- 239000000725 suspension Substances 0.000 abstract 1
- 239000011592 zinc chloride Substances 0.000 abstract 1
- 235000005074 zinc chloride Nutrition 0.000 abstract 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 abstract 1
- 229910000165 zinc phosphate Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0095884 | 1965-03-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1095387A true GB1095387A (de) | 1967-12-20 |
Family
ID=7519680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1095387A Expired GB1095387A (de) | 1965-03-11 | 1966-03-09 |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE1514413A1 (de) |
GB (1) | GB1095387A (de) |
NL (1) | NL6601941A (de) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10593608B2 (en) | 2014-06-18 | 2020-03-17 | Heraeus Deutschland GmbH & Co. KG | Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component |
US10685894B2 (en) | 2013-11-07 | 2020-06-16 | Heraeus Deutschland GmbH & Co. KG | Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component |
WO2022139674A1 (en) * | 2020-12-23 | 2022-06-30 | Heraeus Deutschland Gmbh & Co. Kg. | Process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packages |
US12133366B2 (en) | 2019-05-02 | 2024-10-29 | Danfoss Silicon Power Gmbh | Power electronics module with improved cooling |
US12136585B2 (en) | 2019-05-02 | 2024-11-05 | Danfoss Silicon Power Gmbh | Compact power electronics module with increased cooling surface |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015102041A1 (de) * | 2015-02-12 | 2016-08-18 | Danfoss Silicon Power Gmbh | Leistungsmodul |
DE102015223467A1 (de) * | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Elektrische Vorrichtung mit einer Umhüllmasse |
DE102018215694A1 (de) * | 2018-09-14 | 2020-03-19 | Robert Bosch Gmbh | Vergussmasse, elektrisch isoliertes elektrisches oder elektronisches Bauteil und Verfahren zu dessen elektrischer Isolierung |
EP4095894A1 (de) * | 2021-05-26 | 2022-11-30 | Heraeus Deutschland GmbH & Co. KG | Mit einer umhüllung aus einer hydraulisch gehärteten anorganischen zementzusammensetzung versehenes elektronikobjekt |
-
1965
- 1965-03-11 DE DE19651514413 patent/DE1514413A1/de active Pending
-
1966
- 1966-02-15 NL NL6601941A patent/NL6601941A/xx unknown
- 1966-03-09 GB GB1095387A patent/GB1095387A/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10685894B2 (en) | 2013-11-07 | 2020-06-16 | Heraeus Deutschland GmbH & Co. KG | Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component |
US10593608B2 (en) | 2014-06-18 | 2020-03-17 | Heraeus Deutschland GmbH & Co. KG | Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component |
US12133366B2 (en) | 2019-05-02 | 2024-10-29 | Danfoss Silicon Power Gmbh | Power electronics module with improved cooling |
US12136585B2 (en) | 2019-05-02 | 2024-11-05 | Danfoss Silicon Power Gmbh | Compact power electronics module with increased cooling surface |
WO2022139674A1 (en) * | 2020-12-23 | 2022-06-30 | Heraeus Deutschland Gmbh & Co. Kg. | Process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packages |
Also Published As
Publication number | Publication date |
---|---|
DE1514413A1 (de) | 1969-06-12 |
NL6601941A (de) | 1966-09-12 |
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