GB1018632A - Improvements in or relating to semiconductor arrangements enclosed in housings - Google Patents
Improvements in or relating to semiconductor arrangements enclosed in housingsInfo
- Publication number
- GB1018632A GB1018632A GB24177/64A GB2417764A GB1018632A GB 1018632 A GB1018632 A GB 1018632A GB 24177/64 A GB24177/64 A GB 24177/64A GB 2417764 A GB2417764 A GB 2417764A GB 1018632 A GB1018632 A GB 1018632A
- Authority
- GB
- United Kingdom
- Prior art keywords
- pin
- semi
- iron
- springs
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0085642 | 1963-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1018632A true GB1018632A (en) | 1966-01-26 |
Family
ID=7512482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB24177/64A Expired GB1018632A (en) | 1963-06-12 | 1964-06-10 | Improvements in or relating to semiconductor arrangements enclosed in housings |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3378735A (https=) |
| BE (1) | BE649049A (https=) |
| GB (1) | GB1018632A (https=) |
| SE (1) | SE302015B (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1514474C3 (de) * | 1965-06-05 | 1981-04-30 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement |
| US4769744A (en) * | 1983-08-04 | 1988-09-06 | General Electric Company | Semiconductor chip packages having solder layers of enhanced durability |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1248811B (https=) * | 1961-03-28 | |||
| DE1263190B (de) * | 1961-07-12 | 1968-03-14 | Siemens Ag | Halbleiteranordnung mit einem in ein Gehaeuse eingeschlossenen Halbleiterkoerper |
| NL291270A (https=) * | 1961-08-12 | |||
| BE623873A (https=) * | 1961-10-24 | 1900-01-01 | ||
| NL286498A (https=) * | 1961-12-30 | 1900-01-01 | ||
| BE629939A (https=) * | 1962-03-24 | |||
| BE638960A (https=) * | 1962-10-23 | |||
| US3170098A (en) * | 1963-03-15 | 1965-02-16 | Westinghouse Electric Corp | Compression contacted semiconductor devices |
-
1964
- 1964-06-09 US US373689A patent/US3378735A/en not_active Expired - Lifetime
- 1964-06-10 GB GB24177/64A patent/GB1018632A/en not_active Expired
- 1964-06-10 BE BE649049D patent/BE649049A/xx unknown
- 1964-06-11 SE SE7128/64A patent/SE302015B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| SE302015B (https=) | 1968-07-01 |
| BE649049A (https=) | 1964-12-10 |
| US3378735A (en) | 1968-04-16 |
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