GB1008215A - A casing for semiconductor devices - Google Patents

A casing for semiconductor devices

Info

Publication number
GB1008215A
GB1008215A GB2760362A GB2760362A GB1008215A GB 1008215 A GB1008215 A GB 1008215A GB 2760362 A GB2760362 A GB 2760362A GB 2760362 A GB2760362 A GB 2760362A GB 1008215 A GB1008215 A GB 1008215A
Authority
GB
United Kingdom
Prior art keywords
plates
soldered
plate
carrier plate
casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2760362A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Patentverwertungs GmbH
Original Assignee
Telefunken Patentverwertungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefunken Patentverwertungs GmbH filed Critical Telefunken Patentverwertungs GmbH
Publication of GB1008215A publication Critical patent/GB1008215A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thyristors (AREA)
GB2760362A 1961-08-01 1962-07-18 A casing for semiconductor devices Expired GB1008215A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1961T0013642 DE1850095U (de) 1961-08-01 1961-08-01 Gehaeuse fuer halbleiteranordnungen.

Publications (1)

Publication Number Publication Date
GB1008215A true GB1008215A (en) 1965-10-27

Family

ID=33013699

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2760362A Expired GB1008215A (en) 1961-08-01 1962-07-18 A casing for semiconductor devices

Country Status (3)

Country Link
DE (1) DE1850095U (fr)
FR (1) FR1328780A (fr)
GB (1) GB1008215A (fr)

Also Published As

Publication number Publication date
FR1328780A (fr) 1963-05-31
DE1850095U (de) 1962-04-19

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