GB1003181A - Improvements in modular electrical units - Google Patents

Improvements in modular electrical units

Info

Publication number
GB1003181A
GB1003181A GB2387862A GB2387862A GB1003181A GB 1003181 A GB1003181 A GB 1003181A GB 2387862 A GB2387862 A GB 2387862A GB 2387862 A GB2387862 A GB 2387862A GB 1003181 A GB1003181 A GB 1003181A
Authority
GB
United Kingdom
Prior art keywords
disc
resistors
sealed
leads
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2387862A
Inventor
Jack St Clair Kilby
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Globe Union Inc
Original Assignee
Globe Union Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Globe Union Inc filed Critical Globe Union Inc
Priority to GB2387862A priority Critical patent/GB1003181A/en
Publication of GB1003181A publication Critical patent/GB1003181A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827Tapered, e.g. tapered hole, via or groove
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303Pin-in-hole mounted pins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147Sealing or impregnating, e.g. of pores
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

1,003,181. Circuit assemblies. GLOBE-UNION Inc. June 21, 1962, No. 23878/62. Heading H1R. In a modular electric unit, a semi-conductor device and other electrical devices mounted on one face of an insulating plate, through which are sealed conductive paths from said devices, are housed in a container into which the plate is sealed. As shown, a 4-stage transistor amplifier assembly comprises a ceramic disc 10, Fig. 2, having a plurality of apertures in which are mounted leads 1, 2, 3, 5, 6 (see also Fig. 1), which shows the top face of the disc 10. The leads are soldered at 36 to conductive areas 38 around each aperture which is lined with a layer 45 of silver paint &c., or an eyelet, or a cup-shaped connector. Resistors 22, 28, 34 of, e.g. stencil-screened carbon-containing paint, are applied to the top of disc 10 and connected into the circuit by conductive layers 88, 89, 93, 102, 103, 116, which may contain Ag and be screened on and then fired, and a wire lead 91; an insulating coating 39 is applied over the resistors. To the under face of the disc 10, Fig. 3, are applied resistors 12, 14, 16, 18, 20, 24, 26, 30, 32, conductive areas 70, 74, 76, 86, 90, 96, 99, 106, 108, 120, 122, and an insulating layer 37; transistors 40, 42, 44, 46, Fig. 4, and then soldered to relevant conductive areas. Four quadrantal capacitors such as 50, 54, Fig. 2, a full-disc capacitor 56, and a thin capacitor 58 are connected into circuit by means of ribbon leads 68, 72, 78, 82, 92, 94, 98, 104, 112, 118, 126, Figs. 3, 4. The whole assembly is sealed in a metal container 62 by solder 64 to which terminal lead 4 is connected.
GB2387862A 1962-06-21 1962-06-21 Improvements in modular electrical units Expired GB1003181A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2387862A GB1003181A (en) 1962-06-21 1962-06-21 Improvements in modular electrical units

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2387862A GB1003181A (en) 1962-06-21 1962-06-21 Improvements in modular electrical units

Publications (1)

Publication Number Publication Date
GB1003181A true GB1003181A (en) 1965-09-02

Family

ID=10202784

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2387862A Expired GB1003181A (en) 1962-06-21 1962-06-21 Improvements in modular electrical units

Country Status (1)

Country Link
GB (1) GB1003181A (en)

Similar Documents

Publication Publication Date Title
US2971138A (en) Circuit microelement
GB1337514A (en) Electrical circuit module and method of assembly
ES474519A1 (en) Lead frame and package for establishing electrical connections to electronic components.
GB1329052A (en) Method of manufacturing thick-film hybrid integrated cirucits
GB1213726A (en) Improvements relating to electrical circuit assemblies
GB1004459A (en) Electronic circuits
GB1117621A (en) Improvements in or relating to electrical components
GB1424642A (en) Layer circuits
GB1373008A (en) Electronic components
GB1481590A (en) Multisubstrate interconnected printed circuit module
GB1288982A (en)
US3052822A (en) Modular electrical unit
GB1360028A (en) Electroluminescent devices
GB1152809A (en) Electric Circuit Assembly
GB1209901A (en) Improvements relating to the mounting of integrated circuit assemblies
GB1025555A (en) Improvements in and relating to methods of manufacturing peltier devices
GB1020151A (en) Electrical semiconductor device
GB1003181A (en) Improvements in modular electrical units
GB1245610A (en) Improvements in and relating to semiconductor devices
GB1418915A (en) High voltage electrical resistors
EP0088492B1 (en) A means and a method for converting finished electrical components with terminal leads to elements having planar terminations
GB1234858A (en) Terminal construction for electrical circuit element
GB1394210A (en) Variable resistor assemblies
GB1072775A (en) Improvements in electric structural elements
GB1013849A (en) Improvements in or relating to insulating supports for electrical circuits