GB0809889D0 - Sputter deposition apparatus - Google Patents

Sputter deposition apparatus

Info

Publication number
GB0809889D0
GB0809889D0 GB0809889A GB0809889A GB0809889D0 GB 0809889 D0 GB0809889 D0 GB 0809889D0 GB 0809889 A GB0809889 A GB 0809889A GB 0809889 A GB0809889 A GB 0809889A GB 0809889 D0 GB0809889 D0 GB 0809889D0
Authority
GB
United Kingdom
Prior art keywords
deposition apparatus
sputter deposition
sputter
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0809889A
Other versions
GB2460456A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mantis Deposition Ltd
Original Assignee
Mantis Deposition Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mantis Deposition Ltd filed Critical Mantis Deposition Ltd
Priority to GB0809889A priority Critical patent/GB2460456A/en
Publication of GB0809889D0 publication Critical patent/GB0809889D0/en
Publication of GB2460456A publication Critical patent/GB2460456A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
GB0809889A 2008-05-30 2008-05-30 Sputtering apparatus Withdrawn GB2460456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0809889A GB2460456A (en) 2008-05-30 2008-05-30 Sputtering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0809889A GB2460456A (en) 2008-05-30 2008-05-30 Sputtering apparatus

Publications (2)

Publication Number Publication Date
GB0809889D0 true GB0809889D0 (en) 2008-07-09
GB2460456A GB2460456A (en) 2009-12-02

Family

ID=39637895

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0809889A Withdrawn GB2460456A (en) 2008-05-30 2008-05-30 Sputtering apparatus

Country Status (1)

Country Link
GB (1) GB2460456A (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB101638A (en) * 1916-09-29 1917-07-26 Soren Pallesen Mechanical Cycle-horse.
JPS57120231A (en) * 1981-01-14 1982-07-27 Matsushita Electric Ind Co Ltd Method and device for manufacture of magnetic recording medium
US4394236A (en) * 1982-02-16 1983-07-19 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
JPH0310069A (en) * 1989-06-05 1991-01-17 Matsushita Electric Ind Co Ltd Sputtering device
JPH04180563A (en) * 1990-11-13 1992-06-26 Matsushita Electric Ind Co Ltd Sputtering device
EP1923902B2 (en) * 2006-11-14 2014-07-23 Applied Materials, Inc. Magnetron sputtering source, sputter coating system and method for coating a substrate

Also Published As

Publication number Publication date
GB2460456A (en) 2009-12-02

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)