GB0711943D0 - Re-configurable Memory Cards Having Muliple Application-Based Functions, Methods of Operating, and Methods of Forming the Same - Google Patents

Re-configurable Memory Cards Having Muliple Application-Based Functions, Methods of Operating, and Methods of Forming the Same

Info

Publication number
GB0711943D0
GB0711943D0 GBGB0711943.1A GB0711943A GB0711943D0 GB 0711943 D0 GB0711943 D0 GB 0711943D0 GB 0711943 A GB0711943 A GB 0711943A GB 0711943 D0 GB0711943 D0 GB 0711943D0
Authority
GB
United Kingdom
Prior art keywords
methods
muliple
operating
forming
application
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0711943.1A
Other versions
GB2450355A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority to GB0711943A priority Critical patent/GB2450355A/en
Publication of GB0711943D0 publication Critical patent/GB0711943D0/en
Publication of GB2450355A publication Critical patent/GB2450355A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0719Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for application selection, e.g. an acceleration sensor or a set of radio buttons
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07732Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/047Box-like arrangements of PCBs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10159Memory
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302Bending a rigid substrate; Breaking rigid substrates by bending
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
GB0711943A 2007-06-20 2007-06-20 Re-configurable memory cards having multiple application based functions of operating, and methods of forming the same Withdrawn GB2450355A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0711943A GB2450355A (en) 2007-06-20 2007-06-20 Re-configurable memory cards having multiple application based functions of operating, and methods of forming the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0711943A GB2450355A (en) 2007-06-20 2007-06-20 Re-configurable memory cards having multiple application based functions of operating, and methods of forming the same

Publications (2)

Publication Number Publication Date
GB0711943D0 true GB0711943D0 (en) 2007-08-01
GB2450355A GB2450355A (en) 2008-12-24

Family

ID=38352586

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0711943A Withdrawn GB2450355A (en) 2007-06-20 2007-06-20 Re-configurable memory cards having multiple application based functions of operating, and methods of forming the same

Country Status (1)

Country Link
GB (1) GB2450355A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116916530A (en) * 2023-09-12 2023-10-20 荣耀终端有限公司 Circuit board, circuit board assembly and electronic equipment

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5008496A (en) * 1988-09-15 1991-04-16 Siemens Aktiengesellschaft Three-dimensional printed circuit board
JPH02214354A (en) * 1989-02-15 1990-08-27 Nec Corp Card type multi-functional telephone terminal system
US5031027A (en) * 1990-07-13 1991-07-09 Motorola, Inc. Shielded electrical circuit
JPH04208587A (en) * 1990-11-30 1992-07-30 Fujitsu Ltd Three-dimensional circuit module
JPH0575218A (en) * 1991-06-19 1993-03-26 Hitachi Ltd Molded substrate
JP2003108951A (en) * 2001-10-02 2003-04-11 Sharp Corp Pc card
US6731011B2 (en) * 2002-02-19 2004-05-04 Matrix Semiconductor, Inc. Memory module having interconnected and stacked integrated circuits
US6994263B2 (en) * 2002-06-28 2006-02-07 Matsushita Electric Industrial Co., Ltd. IC card
US7083107B2 (en) * 2002-09-30 2006-08-01 Matsushita Electric Industrial Co., Ltd. Memory card
JP4238580B2 (en) * 2002-11-15 2009-03-18 ソニー株式会社 Data storage device and data recording system
CN101014969B (en) * 2004-06-18 2011-03-30 松下电器产业株式会社 Ic card
KR100674926B1 (en) * 2004-12-08 2007-01-26 삼성전자주식회사 Memory card and method of fabricating the same
JP2006268459A (en) * 2005-03-24 2006-10-05 Ricoh Co Ltd Nonvolatile memory card and shape conversion adapter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116916530A (en) * 2023-09-12 2023-10-20 荣耀终端有限公司 Circuit board, circuit board assembly and electronic equipment
CN116916530B (en) * 2023-09-12 2023-12-08 荣耀终端有限公司 Circuit board, circuit board assembly and electronic equipment

Also Published As

Publication number Publication date
GB2450355A (en) 2008-12-24

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)